Theme -Code-Choice

On this page, you can select 5F 「theme code」.

Select the desired 「Theme code」.

  • 5F003
  • Bipolar transistors
  • 5F004
  • Dry etching of semiconductors
  • 5F005
  • Thyristors
  • 5F031
  • Containers, movement, fixing, and positioning of semiconductor wafers
  • 5F032
  • ELEMENT SEPARATION
  • 5F033
  • Internal circuitry in semiconductor integrated circuit devices
  • 5F034
  • Semiconductor or solid-state device mounting
  • 5F035
  • Supporting of complete semiconductor or solid state devices
  • 5F036
  • Cooling of semiconductor or solid state devices
  • 5F037
  • Semiconductor or solid-state device assemblies
  • 5F038
  • SEMICONDUCTOR INTEGRATED CIRCUITS
  • 5F039
  • Semiconductor devices featured in their main body
  • 5F041
  • LIGHT EMITTING DIODES
  • 5F042
  • Diffusion
  • 5F043
  • WET ETCHING
  • 5F044
  • Wire Bonding
  • 5F045
  • Vapor-phase growth (i.e., excluding metal layers)
  • 5F046
  • EXPOSURE OF SEMICONDUCTORS, EXCLUDING ELECTRON OR ION BEAM EXPOSURE
  • 5F047
  • DIE BONDING
  • 5F048
  • METAL-OXIDE SEMICONDUCTOR INTEGRATED CIRCUITS (MOSIC) AND BIPOLAR METAL-OXIDE SEMICONDUCTOR INTEGRATED CIRCUITS (BI-MOSIC)
  • 5F049
  • Light-receiving elements 3: Photodiodes and transistors
  • 5F050
  • Piezoelectric, electrostrictive and magnetostrictive devices
  • 5F051
  • PHOTOVOLTAIC DEVICES
  • 5F052
  • Recrystallization technology
  • 5F053
  • Liquid deposition of substances of which semiconductor devices are composed
  • 5F054
  • Anneal
  • 5F056
  • ELECTRON BEAM EXPOSURE
  • 5F057
  • MECHANICAL TREATMENT OF SEMICONDUCTOR
  • 5F058
  • FORMATION OF INSULATING FILMS
  • 5F059
  • Semiconductor device manufacturing and assembling
  • 5F061
  • ENCAPSULATION OF AND COATINGS FOR SEMICONDUCTOR OR SOLID STATE DEVICES
  • 5F063
  • DICING
  • 5F064
  • DESIGN AND MANUFACTURE OF INTEGRATED CIRCUITS (IC)
  • 5F065
  • Semiconductor capsules and their sealing
  • 5F066
  • Diode and transistor lead frames
  • 5F067
  • LEAD FRAMES FOR INTEGRATED CIRCUITS
  • 5F068
  • Wiring among chips
  • 5F069
  • Temperature compensation circuits etc.
  • 5F070
  • Maser
  • 5F071
  • Lasers
  • 5F072
  • Lasers (2)
  • 5F073
  • Semiconductor lasers
  • 5F080
  • 3D integrated circuits
  • 5F081
  • Hybrid integrated circuits
  • 5F082
  • Bipolar integrated circuits
  • 5F083
  • SEMICONDUCTOR MEMORIES
  • 5F084
  • SOI, active matrix and SOS
  • 5F086
  • Semiconductors featured in their operation
  • 5F087
  • Diodes
  • 5F088
  • LIGHT-RECEIVING ELEMENTS I (COMMON ITEMS, RADIATION DETECTION)
  • 5F089
  • PHOTO-COUPLERS OR INTERRUPTERS
  • 5F090
  • Light-to-light transducers
  • 5F091
  • Thermoelement
  • 5F092
  • HALL/MR ELEMENTS
  • 5F093
  • Ovshinsky elements
  • 5F094
  • Gunn effect elements
  • 5F095
  • Thin and thick film devices
  • 5F096
  • Organic semiconductor materials
  • 5F097
  • Optical integrated circuits
  • 5F101
  • Non-volatile memory
  • 5F102
  • JUNCTION FIELD-EFFECT TRANSISTORS
  • 5F103
  • Physical deposition of substances that are components of semiconductor devices
  • 5F107
  • Bump electrodes
  • 5F110
  • Thin film transistor
  • 5F111
  • Vertical MOS transistors
  • 5F117
  • Semiconductor device manufacturing processing in general
  • 5F121
  • 5F122
  • 5F123
  • 5F131
  • CONTAINER, CONVEYANCE, ADHERENCE, POSITIONING, OF WAFER
  • 5F136
  • COOLING OR THE LIKE OF SEMICONDUCTORS OR SOLID STATE DEVICES
  • 5F137
  • 5F138
  • 5F139
  • (Not Translated)
  • 5F140
  • Insulated gate type field-effect transistor
  • 5F141
  • (Not Translated)
  • 5F142
  • LED DEVICE PACKAGES
  • 5F146
  • EXPOSURE OF SEMICONDUCTORS, EXCLUDING ELECTRON OR ION BEAM EXPOSURE
  • 5F148
  • 5F149
  • LIGHT-RECEIVING ELEMENTS
  • 5F151
  • PHOTOVOLTAIC DEVICES
  • 5F152
  • RECRYSTALLISATION TECHNIQUES
  • 5F157
  • CLEANING OR DRYING SEMICONDUCTORS
  • 5F172
  • LASERS (2)
  • 5F173
  • SEMICONDUCTOR LASERS
  • 5F182
  • 5F184
  • 5F188
  • 5F196
  • 5F197
  • 5F211
  • 5F241
  • LED DEVICES (OTHER THAN PACKAGES)
  • 5F251
  • PHOTOVOLTAIC DEVICES
  • 5F849
  • LIGHT RECEIVING ELEMENTS
  • 5F889
  • PHOTO COUPLER, INTERRUPTER, OPTICAL-TO-OPTICAL CONVERSION DEVICES
    TOP