5F003
|
Bipolar transistors
|
5F004
|
Dry etching of semiconductors
|
5F005
|
Thyristors
|
5F031
|
Containers, movement, fixing, and positioning of semiconductor wafers
|
5F032
|
ELEMENT SEPARATION
|
5F033
|
Internal circuitry in semiconductor integrated circuit devices
|
5F034
|
Semiconductor or solid-state device mounting
|
5F035
|
Supporting of complete semiconductor or solid state devices
|
5F036
|
Cooling of semiconductor or solid state devices
|
5F037
|
Semiconductor or solid-state device assemblies
|
5F038
|
SEMICONDUCTOR INTEGRATED CIRCUITS
|
5F039
|
Semiconductor devices featured in their main body
|
5F041
|
LIGHT EMITTING DIODES
|
5F042
|
Diffusion
|
5F043
|
WET ETCHING
|
5F044
|
Wire Bonding
|
5F045
|
Vapor-phase growth (i.e., excluding metal layers)
|
5F046
|
EXPOSURE OF SEMICONDUCTORS, EXCLUDING ELECTRON OR ION BEAM EXPOSURE
|
5F047
|
DIE BONDING
|
5F048
|
METAL-OXIDE SEMICONDUCTOR INTEGRATED CIRCUITS (MOSIC) AND BIPOLAR METAL-OXIDE SEMICONDUCTOR INTEGRATED CIRCUITS (BI-MOSIC)
|
5F049
|
Light-receiving elements 3: Photodiodes and transistors
|
5F050
|
Piezoelectric, electrostrictive and magnetostrictive devices
|
5F051
|
PHOTOVOLTAIC DEVICES
|
5F052
|
Recrystallization technology
|
5F053
|
Liquid deposition of substances of which semiconductor devices are composed
|
5F054
|
Anneal
|
5F056
|
ELECTRON BEAM EXPOSURE
|
5F057
|
MECHANICAL TREATMENT OF SEMICONDUCTOR
|
5F058
|
FORMATION OF INSULATING FILMS
|
5F059
|
Semiconductor device manufacturing and assembling
|
5F061
|
ENCAPSULATION OF AND COATINGS FOR SEMICONDUCTOR OR SOLID STATE DEVICES
|
5F063
|
DICING
|
5F064
|
DESIGN AND MANUFACTURE OF INTEGRATED CIRCUITS (IC)
|
5F065
|
Semiconductor capsules and their sealing
|
5F066
|
Diode and transistor lead frames
|
5F067
|
LEAD FRAMES FOR INTEGRATED CIRCUITS
|
5F068
|
Wiring among chips
|
5F069
|
Temperature compensation circuits etc.
|
5F070
|
Maser
|
5F071
|
Lasers
|
5F072
|
Lasers (2)
|
5F073
|
Semiconductor lasers
|
5F080
|
3D integrated circuits
|
5F081
|
Hybrid integrated circuits
|
5F082
|
Bipolar integrated circuits
|
5F083
|
SEMICONDUCTOR MEMORIES
|
5F084
|
SOI, active matrix and SOS
|
5F086
|
Semiconductors featured in their operation
|
5F087
|
Diodes
|
5F088
|
LIGHT-RECEIVING ELEMENTS I (COMMON ITEMS, RADIATION DETECTION)
|
5F089
|
PHOTO-COUPLERS OR INTERRUPTERS
|
5F090
|
Light-to-light transducers
|
5F091
|
Thermoelement
|
5F092
|
HALL/MR ELEMENTS
|
5F093
|
Ovshinsky elements
|
5F094
|
Gunn effect elements
|
5F095
|
Thin and thick film devices
|
5F096
|
Organic semiconductor materials
|
5F097
|
Optical integrated circuits
|
5F101
|
Non-volatile memory
|
5F102
|
JUNCTION FIELD-EFFECT TRANSISTORS
|
5F103
|
Physical deposition of substances that are components of semiconductor devices
|
5F107
|
Bump electrodes
|
5F110
|
Thin film transistor
|
5F111
|
Vertical MOS transistors
|
5F117
|
Semiconductor device manufacturing processing in general
|
5F121
|
|
5F122
|
|
5F123
|
|
5F131
|
CONTAINER, CONVEYANCE, ADHERENCE, POSITIONING, OF WAFER
|
5F136
|
COOLING OR THE LIKE OF SEMICONDUCTORS OR SOLID STATE DEVICES
|
5F137
|
|
5F138
|
|
5F139
|
(Not Translated)
|
5F140
|
Insulated gate type field-effect transistor
|
5F141
|
(Not Translated)
|
5F142
|
LED DEVICE PACKAGES
|
5F146
|
EXPOSURE OF SEMICONDUCTORS, EXCLUDING ELECTRON OR ION BEAM EXPOSURE
|
5F148
|
|
5F149
|
LIGHT-RECEIVING ELEMENTS
|
5F151
|
PHOTOVOLTAIC DEVICES
|
5F152
|
RECRYSTALLISATION TECHNIQUES
|
5F157
|
CLEANING OR DRYING SEMICONDUCTORS
|
5F172
|
LASERS (2)
|
5F173
|
SEMICONDUCTOR LASERS
|
5F182
|
|
5F184
|
|
5F188
|
|
5F196
|
|
5F197
|
|
5F211
|
|
5F241
|
LED DEVICES (OTHER THAN PACKAGES)
|
5F251
|
PHOTOVOLTAIC DEVICES
|
5F849
|
LIGHT RECEIVING ELEMENTS
|
5F889
|
PHOTO COUPLER, INTERRUPTER, OPTICAL-TO-OPTICAL CONVERSION DEVICES
|