F-Term-List

H01L33/00-33/00,450

AA00
PURPOSE

AA01

AA02

AA03

AA04

AA05

AA06

AA07

AA08

AA09

AA10

. optical

. . High-speed operations; improving transient response characteristics

. . improving light-emission efficiency

. . increasing optical outputs

. . uniforming light intensity distribution

. . preventing light diffusion or improving directivity or concentration of light

. . diffusing light

. . improving current-optical output characteristics

. . stabilising optical outputs

. . correcting brightness

AA11

AA12

AA13

AA14

. . improving emission colours or wavelengths *

. . having multiple emission colours or wavelengths

. . suppressing laser oscillations

. . Others *

AA21

AA22

AA23

AA24

AA25

. electrical *

. . increasing current density

. . protecting against overcurrents

. . reducing power consumption

. . preventing disconnection or contact

AA31

AA32

AA33

AA34

AA35

AA36

AA37

AA38

AA39

AA40

. Others *

. . Temperature compensation

. . Heat radiation or cooling

. . improving moisture resistances

. . Positioning

. . . in the process of manufacturing chips

. . . in the process of packaging

. . . in the process of mounting finished products

. . . optically

. . removing stresses or strain; improving crystallinity

AA41

AA42

AA43

AA44

AA45

AA46

AA47

. . increasing yields

. . reducing parts count or the number of processes

. . improving reliability

. . preventing deterioration

. . Marking, e.g. indicating polarities or emission colours

. . Testing or measuring *

. . Miniaturisation

BB00
DRIVE CIRCUIT FOR LIGHT EMITTING DIODE

BB01

BB02

BB03

BB04

BB05

BB06

BB07

BB08

BB09

BB10

. Kinds of circuits

. . Amplifier circuits

. . Switching circuits

. . Current limiting circuits

. . . using single elements

. . . using a plurality of elements, including constant current circuits

. . Bypass circuits

. . Differential or integral circuits, including smoothing circuits

. . Rectification circuits

. . Feedback circuits

BB11

BB12

BB13

. . Transformer circuits

. . Digital circuits

. . Others *

BB21

BB22

BB23

BB24

BB25

BB26

BB27

. Components of circuits

. . Resistors

. . Inductors

. . Capacitors

. . Diodes

. . Transistors

. . Others *

BB31

BB32

BB33

BB34

. Drive systems

. . using constant currents or constant voltages

. . using intermittent pulses

. . Others *

CA00
TYPE OF LIGHT EMITTING DIODE (1)

CA01

CA02

CA03

CA04

CA05

CA06

CA07

CA08

CA10

. Junction structures

. . Homojunctions

. . Heterojunctions

. . . Double heterojunctions

. . Superlattices, including quantum wells

. . Metal-insulator-semiconductor (MIS) types or metal-semiconductor (MES) types

. . PNPN structures, e.g. thyristor structures or junction structures having negative resistances

. . Other junction structures *

. characterised by the shapes of junction surfaces

CA11

CA12

CA13

CA14

. Light-emitting directions

. . Surface emission

. . . Rear surface emission

. . Edge emission

CA21

CA22

CA23

CA24

CA25

. Crystal structures

. . Single crystals

. . . Plane orientations or crystal-axis orientations *

. . Polycrystals *

. . Amorphous structures *

CA31

CA32

CA33

CA34

CA35

CA36

CA37

CA38

CA39

CA40

. Materials of light emitting diodes

. . Base materials

. . . Group IV *

. . . Groups III-V *

. . . . Gallium arsenides (GaAs)

. . . . Gallium aluminium arsenides (GaAlAs)

. . . . Gallium phosphides (GaP)

. . . . Gallium arsenic phosphides (GaAsP)

. . . . Indium gallium arsenic phosphides (InGaAsP)

. . . . Gallium nitrides (GaN)

CA41

CA42

CA43

CA44

CA45

CA46

CA47

CA48

CA49

CA50

. . . Groups II-VI *

. . . . Zinc sulphides (ZnS)

. . . . Zinc selenides (ZnSe)

. . . . Zinc selenium sulphides (ZnSeS)

. . . Organic semiconductors *

. . . Others *

. . Additives

. . . Functions thereof *

. . . . Conductivity types

. . . . Luminescence centres

CA51

CA52

CA53

CA54

CA55

CA56

CA57

CA58

CA60

. . . . insulating or semi-insulating

. . . Materials thereof

. . . . Zinc (Zn)

. . . . Oxygen (O)

. . . . Nitrogen (N)

. . . . Sulphur (S)

. . . . Others *

. . . characterised by concentration distribution of additives

. . having inclined band gap layers

CA61

CA62

CA63

CA64

CA65

CA66

CA67

. Manufacturing processes

. . Growth of base materials

. . . Liquid-phase epitaxy (LPE)

. . . Vapour-phase epitaxy (VPE)

. . . . Metal-organic chemical vapour deposition (MOCVD)

. . . Molecular beam epitaxy (MBE)

. . . Others *

CA71

CA72

CA73

CA74

CA75

CA76

CA77

. . Ion implantation

. . Diffusion

. . Heat treatments

. . Etching

. . forming grooves

. . Dicing or scribing

. . Others *

CA81

CA82

CA83

CA84

CA85

CA86

CA87

CA88

. Electrodes

. . Materials thereof *

. . . Single metals *

. . . Alloys *

. . . . Gold (Au)

. . . . Silver (Ag)

. . . . Aluminium (Al)

. . . transmitting light

CA91

CA92

CA93

CA94

CA98

CA99

. . Structures thereof

. . . multi-layered

. . . characterised by shapes of electrodes

. . . combined with light-shielding films

. . Manufacturing processes thereof

. . . Special treatments of semiconductor layers

CB00
TYPE OF LIGHT EMITTING DIODE (2)

CB01

CB02

CB03

CB04

CB05

CB06

. Element structures

. . for constricting currents

. . . Potential-jump barriers, e.g. PN junctions

. . . Insulators

. . . Mesa forms

. . . Impurity concentrations

CB11

CB12

CB13

CB14

CB15

CB16

. . Mesa types

. . Ballast types

. . Thin-film types

. . having lenses

. . having reflecting surfaces

. . having light-shielding members

CB21

CB22

CB23

CB24

CB25

CB27

CB28

CB29

. . monolithic

. . . Monolithic light emitting diode arrays

. . . . Separation by insulation

. . . . PN separation

. . . . Groove or air separation

. . . Monolithic multicolour light emitting diodes

. . . . arranged in series

. . . . arranged in parallel

CB31

CB32

CB33

CB36

. . . Composite elements *

. . . . combined with other optical semiconductors *

. . . . combined with transistors or diodes

. . Others *

DA00
PACKAGING

DA01

DA02

DA03

DA04

DA06

DA07

DA08

DA09

. Mounting

. . using electrically-conductive adhesives

. . using solder

. . Upside-down mounting

. Bonding

. . Wire bonding

. . . characterised by wire materials *

. . Flip-chip bonding

DA11

DA12

DA13

DA14

DA15

DA16

DA17

DA18

DA19

DA20

. Structures or manufacturing processes of packages

. . of a single chip

. . of a plurality of chips

. . . Multicolour light emitting diodes

. . Members on which chips are mounted

. . . Lead-frames

. . . . on the surfaces

. . . . on the end surfaces

. . . Bases or stems

. . . Others, e.g. printed circuit boards *

DA21

DA22

DA25

DA26

DA29

. . characterised by lead-frames

. . . Materials thereof *

. . . characterised by shapes or structures

. . . . having reflecting members

. . . characterised by electric conductors on which chips are mounted *

DA31

DA32

DA33

DA34

DA35

DA36

DA39

. . characterised by bases or stems

. . . Materials thereof *

. . . . Metals *

. . . . Insulators *

. . . characterised by shapes or structures

. . . . having reflecting members

. . . characterised by electric conductors of stems on which chips are mounted *

DA41

DA42

DA43

DA44

DA45

DA46

DA47

. . Integral moulding

. . . Materials thereof *

. . . . Resins

. . . . . Epoxy resins

. . . . . Silicon resins

. . . . . Others *

. . . . Glass *

DA55

DA56

DA57

DA58

DA59

. . . characterised by shapes or structures

. . . . for uniform light

. . . . improving concentration or directivity of light

. . . . combining two or more kinds of mould members

. . . Processes therefor

DA61

DA62

DA63

DA64

. . Airtight sealing

. . . between stems and leads

. . . between stems and cans

. . . between cans and optical elements

DA71

DA72

DA73

DA74

DA75

DA76

DA77

DA78

. . Containers, e.g. caps or frames

. . . Materials thereof *

. . . . Metals *

. . . . Resins *

. . . characterised by shapes or structures

. . . . with windows

. . . . with lenses

. . . . combined with reflecting members

DA81

DA82

DA83

. characterised by finished light emitting diodes after packaging

. . with arrayed chips

. . packaging light emitting diode chips and other electric elements *

DA91

DA92

. Manufacturing apparatus for packaging

. manufacturing a plurality of finished light emitting diodes which are combined

DB00
SHAPES OF FINISHED PRODUCT

DB01

DB02

DB03

DB04

DB05

DB06

DB07

DB08

DB09

. Lamp types, e.g. projectile types

. Flanged lamp types

. Angular types

. Flanged angular types

. Seven-segment types

. Stem- or can-types

. One-dimensional arrays

. Matrix types, e.g. two-dimensional arrays

. Others *

DC00
MOUNTING FINISHED PRODUCT

DC01

DC02

DC03

DC04

DC07

DC08

DC10

. Light emitting diodes having special external shapes for mounting

. . Moulded parts

. . Leads

. . Others *

. mounting a plurality of finished light emitting diodes

. . having special structures for aligning plural light emitting diodes

. Structures for connecting leads electrically

DC11

DC12

DC13

. using accessories for mounting finished light emitting diodes

. . using accessories, e.g. holders or spacers

. . using other accessories

DC21

DC22

DC23

DC24

DC25

DC26

. Members on which finished light emitting diodes are directly mounted

. . Chassis, cases, or containers

. . Printed circuit boards

. . . Optical axes being parallel to printed circuit boards

. . Flexible circuit boards

. . Others *

DC31

DC32

DC33

DC34

. Structures of accessories

. . having sections for guiding leads

. . having conductive parts

. . combining a plurality of accessories

DC41

DC42

DC43

DC44

DC45

DC46

DC47

DC48

. Structures for mounting finished light emitting diodes and accessories

. . for holding resiliently

. . . with resilient pawls

. . for engaging with grooves or holes

. . for mounting with screws or nuts

. . Bonding or welding

. . for enabling or facilitating attaching and detaching

. . Others *

DC51

DC52

DC53

DC54

DC55

DC56

DC57

DC58

. Structures for mounting accessories and members on which finished light emitting diodes are directly mounted

. . for holding resiliently

. . . with resilient pawls

. . for engaging with grooves or holes

. . for mounting with screws or nuts

. . Bonding or welding

. . for enabling or facilitating attaching and detaching

. . Others *

DC61

DC62

DC63

DC64

DC65

DC66

DC67

DC68

. Structures for mounting finished light emitting diodes and members on which finished light emitting diodes are directly mounted

. . for holding resiliently

. . . with resilient pawls

. . for engaging with grooves or holes

. . for mounting with screws or nuts

. . Bonding or welding

. . for enabling or facilitating attaching and detaching

. . Others *

DC71

DC72

DC73

DC74

DC75

DC76

DC77

DC78

. Structures for mounting members on which finished light emitting diodes are directly mounted and members on which finished light emitting diodes are finally mounted

. . for holding resiliently

. . . with resilient pawls

. . for engaging with grooves or holes

. . for mounting with screws or nuts

. . Bonding or welding

. . for enabling or facilitating attaching and detaching

. . Others *

DC81

DC82

DC83

DC84

. characterised by products after mounting finished light emitting diodes

. . Bulb-type light emitting diodes

. . arranging finished products in array forms

. . mounting finished products and other electric components *

DC91

. Apparatus for mounting finished light emitting diodes

EE00
COMBINATION WITH OPTICAL ELEMENT

EE01

EE02

EE03

EE04

EE05

EE06

EE07

EE08

. combining with fibres

. . aligning optical axes

. . having intermediates between fibres and light emitting diodes *

. . . having lenses

. . holding fibres

. . . by containers

. . . by bonding or moulding fibres on light emitting diode chips

. . fixing fibres horizontally to bases

EE11

EE12

EE15

EE16

EE17

. combining with lenses

. . aligning optical axes or focusing

. . holding lenses

. . . by containers

. . . by bonding or moulding lenses on light emitting diode chips

EE21

EE22

EE23

EE24

EE25

. combining with other optical elements

. . Filters

. . Reflecting members

. . Light-shielding members

. . Others *

FF00
USE

FF01

FF02

FF03

FF04

FF05

FF06

. for indication

. . of dots

. . of rows

. . of characters or symbols

. . . Seven-segments

. . . Matrices

FF11

FF12

FF13

FF14

FF15

FF16

. for lighting

. for decoration

. for printers or copying machines

. Optical communications

. for optical excitation, e.g. lasers

. Others *

5F041	LIGHT EMITTING DIODES
	H01L33/00 -33/00,450