F-Term-List

5F089 PHOTO-COUPLERS OR INTERRUPTERS
H01L31/12 -31/12@Z
H01L31/12@A-31/12@Z AA AA00
APPLICATION OF PHOTOCOUPLER
AA01 AA02 AA03 AA05 AA06 AA07 AA10
. Optical communication . Data writing or reading e.g. IC cards . Remote controls . for automobiles . Optical wiring in semiconductor integrated circuits . Optical operations optical modulation or optical amplification . Other applications of photocouplers
AB AB00
TYPE OF PHOTOCOUPLER
AB01 AB03 AB07 AB08 AB09
. Reflector types . Facing types . Monolithic types . . incorporating light emitting elements into light receiving elements . . incorporating light receiving elements into signal processing circuits
AB11 AB13 AB15 AB17 AB20
. Layered film types . adhering light emitting wafers and light receiving wafers . having devices for both emitting and receiving light . using multiple wavelengths . Other types of photocouplers
AC AC00
STRUCTURE OF PHOTOCOUPLER
AC01 AC02 AC03 AC04 AC05 AC06 AC07 AC08 AC09 AC10
. Light receiving elements . . Junction types . . SIT or static induction types . . Photoconductive types . characterised by structures of elements . characterised by shapes of elements . . in array form . characterised by structures arrangements or shapes of electrodes . characterised by wiring patterns or pads . characterised by arrangement of light emitting elements and light receiving elements
AC11 AC13 AC14 AC15 AC16 AC17 AC18 AC19 AC20
. characterised by structures or shapes of packages . Reflectors . . characterised by scattering structure . characterised by structure or shapes of transparent bodies . Light guides . . Optical fibres including methods of connection thereof . Substrates . . transparent . . characterised by shapes
AC21 AC23 AC24 AC25 AC26 AC30
. characterised by lead frames or chip carriers . Structures for mounting printed circuit boards . Structures or methods for positioning . Structures of connectors . Structures of electromagnetic shielding . Others
BA BA00
APPLICATION OF INTERRUPTER OR PHOTOSENSOR
BA01 BA02 BA03 BA04 BA05 BA10
. Sensing rotational speed . Measuring distance or position . Contact image sensors . Optical pickups e.g. CDs . Others; Sensing others than objects . Others; Applications other than sensing
BB BB00
TYPE OF INTERRUPTER OR PHOTOSENSOR
BB01 BB02 BB03 BB04 BB05 BB06 BB07 BB08 BB09
. Reflector types . . incorporating light emitting elements into light receiving elements . . separating light emitting elements from light receiving elements . Facing types . . Mould sealed types . . assembled in cases . Monolithic types . . Light emitting elements and light receiving elements . . Light receiving elements and signal processing circuits
BB17 BB20
. using multiple wavelengths . Other types of interrupters
BC BC00
STRUCTURE OF INTERRUPTER OR PHOTOSENSOR
BC01 BC02 BC03 BC04 BC05 BC06 BC07 BC08 BC09 BC10
. Light receiving elements . . Junction types . . Photoconductive types e.g. photoconductors . . characterised by arrangements or shapes of different types of light receiving elements . characterised by structures of elements . characterised by shapes of elements . . in array form . . Divided light receiving surfaces . characterised by structures arrangements or shapes of electrodes . characterised by wiring patterns or pads
BC11 BC15 BC16 BC17
. characterised by structures or shapes of packages . characterised by structure or shapes of lenses . characterised by light guides . . Optical fibres including methods of connection thereof
BC21 BC22 BC23 BC24 BC25 BC26 BC27 BC29 BC30
. characterised by lead frames or chip carriers . characterised by positional relationships . . Light emitting elements and lenses . . Light receiving elements and lenses . . Light emitting elements and light receiving elements . characterised by protective films . . with conductivity for preventing static electricity . Arrayed light sources . Other structures of interrupters
CA CA00
PURPOSE
CA01 CA02 CA03 CA04 CA05 CA06 CA07 CA08 CA09 CA10
. improving withstand voltage . . interposing insulating films . Improving efficiency of light transmission . . preventing leakage of emitted lights . . improving reflectance . Measures against disturbance light e.g. light blocking . preventing static electricity . improving contact . reducing thermal stress . improving moisture resistance
CA11 CA12 CA13 CA14 CA15 CA16 CA17 CA18 CA19 CA20
. reducing electrical noises . operating in high-speed . protecting electric circuits . acknowledging light emissions from light emitting elements . stabilising light emitting elements; automatic power control (APC) . controlling light emitting power . controlling the quantity of received light or sensitivity . Temperature compensation . preventing failures due to cut-off of light emission . Miniaturisation productivity or longevity
CA21
. Others
DA DA00
MATERIAL OF PHOTOCOUPLER OR INTERRUPTER
DA01 DA02 DA03 DA05 DA06 DA07 DA08
. Packages . . Main materials thereof . . Additives thereof . Reflective materials . . Metals . . White paints . . Other reflective materials
DA11 DA13 DA14 DA15 DA17 DA20
. Diffuse reflection . Transparent bodies . . Main materials thereof . . Additives . Lens materials . Others excluding materials of light emitting elements and light receiving elements
EA EA00
MANUFACTURING METHOD OF PHOTOCOUPLER OR PHOTOINTERRUPTER
EA01 EA03 EA04 EA06 EA08 EA10
. for mounting elements . for transparent bodies or packages . . Moulding . taking out to external terminals . for mounting lenses . Others; Other manufacturing methods not otherwise provided for
FA FA00
ATTACHED ELECTRIC CIRCUIT
FA03 FA05 FA06 FA10
. controlling bias current of light emitting elements . Amplifying circuits . Operation or signal-processing circuits . Others; Other circuit arrangements not otherwise provided for
GA GA00
COMBINATION WITH OPTICAL ELEMENT
GA01 GA03 GA05 GA07 GA08 GA10
. Prisms or external lenses . Beam splitters . Holograms . Filters . using liquid crystals . Others
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