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| 5F089 | PHOTO-COUPLERS OR INTERRUPTERS | |
| H01L31/12 -31/12@Z | ||
| H01L31/12@A-31/12@Z | AA | AA00 APPLICATION OF PHOTOCOUPLER |
AA01 | AA02 | AA03 | AA05 | AA06 | AA07 | AA10 | |||
| . Optical communication | . Data writing or reading e.g. IC cards | . Remote controls | . for automobiles | . Optical wiring in semiconductor integrated circuits | . Optical operations optical modulation or optical amplification | . Other applications of photocouplers | ||||||
| AB | AB00 TYPE OF PHOTOCOUPLER |
AB01 | AB03 | AB07 | AB08 | AB09 | ||||||
| . Reflector types | . Facing types | . Monolithic types | . . incorporating light emitting elements into light receiving elements | . . incorporating light receiving elements into signal processing circuits | ||||||||
| AB11 | AB13 | AB15 | AB17 | AB20 | ||||||||
| . Layered film types | . adhering light emitting wafers and light receiving wafers | . having devices for both emitting and receiving light | . using multiple wavelengths | . Other types of photocouplers | ||||||||
| AC | AC00 STRUCTURE OF PHOTOCOUPLER |
AC01 | AC02 | AC03 | AC04 | AC05 | AC06 | AC07 | AC08 | AC09 | AC10 | |
| . Light receiving elements | . . Junction types | . . SIT or static induction types | . . Photoconductive types | . characterised by structures of elements | . characterised by shapes of elements | . . in array form | . characterised by structures arrangements or shapes of electrodes | . characterised by wiring patterns or pads | . characterised by arrangement of light emitting elements and light receiving elements | |||
| AC11 | AC13 | AC14 | AC15 | AC16 | AC17 | AC18 | AC19 | AC20 | ||||
| . characterised by structures or shapes of packages | . Reflectors | . . characterised by scattering structure | . characterised by structure or shapes of transparent bodies | . Light guides | . . Optical fibres including methods of connection thereof | . Substrates | . . transparent | . . characterised by shapes | ||||
| AC21 | AC23 | AC24 | AC25 | AC26 | AC30 | |||||||
| . characterised by lead frames or chip carriers | . Structures for mounting printed circuit boards | . Structures or methods for positioning | . Structures of connectors | . Structures of electromagnetic shielding | . Others | |||||||
| BA | BA00 APPLICATION OF INTERRUPTER OR PHOTOSENSOR |
BA01 | BA02 | BA03 | BA04 | BA05 | BA10 | |||||
| . Sensing rotational speed | . Measuring distance or position | . Contact image sensors | . Optical pickups e.g. CDs | . Others; Sensing others than objects | . Others; Applications other than sensing | |||||||
| BB | BB00 TYPE OF INTERRUPTER OR PHOTOSENSOR |
BB01 | BB02 | BB03 | BB04 | BB05 | BB06 | BB07 | BB08 | BB09 | ||
| . Reflector types | . . incorporating light emitting elements into light receiving elements | . . separating light emitting elements from light receiving elements | . Facing types | . . Mould sealed types | . . assembled in cases | . Monolithic types | . . Light emitting elements and light receiving elements | . . Light receiving elements and signal processing circuits | ||||
| BB17 | BB20 | |||||||||||
| . using multiple wavelengths | . Other types of interrupters | |||||||||||
| BC | BC00 STRUCTURE OF INTERRUPTER OR PHOTOSENSOR |
BC01 | BC02 | BC03 | BC04 | BC05 | BC06 | BC07 | BC08 | BC09 | BC10 | |
| . Light receiving elements | . . Junction types | . . Photoconductive types e.g. photoconductors | . . characterised by arrangements or shapes of different types of light receiving elements | . characterised by structures of elements | . characterised by shapes of elements | . . in array form | . . Divided light receiving surfaces | . characterised by structures arrangements or shapes of electrodes | . characterised by wiring patterns or pads | |||
| BC11 | BC15 | BC16 | BC17 | |||||||||
| . characterised by structures or shapes of packages | . characterised by structure or shapes of lenses | . characterised by light guides | . . Optical fibres including methods of connection thereof | |||||||||
| BC21 | BC22 | BC23 | BC24 | BC25 | BC26 | BC27 | BC29 | BC30 | ||||
| . characterised by lead frames or chip carriers | . characterised by positional relationships | . . Light emitting elements and lenses | . . Light receiving elements and lenses | . . Light emitting elements and light receiving elements | . characterised by protective films | . . with conductivity for preventing static electricity | . Arrayed light sources | . Other structures of interrupters | ||||
| CA | CA00 PURPOSE |
CA01 | CA02 | CA03 | CA04 | CA05 | CA06 | CA07 | CA08 | CA09 | CA10 | |
| . improving withstand voltage | . . interposing insulating films | . Improving efficiency of light transmission | . . preventing leakage of emitted lights | . . improving reflectance | . Measures against disturbance light e.g. light blocking | . preventing static electricity | . improving contact | . reducing thermal stress | . improving moisture resistance | |||
| CA11 | CA12 | CA13 | CA14 | CA15 | CA16 | CA17 | CA18 | CA19 | CA20 | |||
| . reducing electrical noises | . operating in high-speed | . protecting electric circuits | . acknowledging light emissions from light emitting elements | . stabilising light emitting elements; automatic power control (APC) | . controlling light emitting power | . controlling the quantity of received light or sensitivity | . Temperature compensation | . preventing failures due to cut-off of light emission | . Miniaturisation productivity or longevity | |||
| CA21 | ||||||||||||
| . Others | ||||||||||||
| DA | DA00 MATERIAL OF PHOTOCOUPLER OR INTERRUPTER |
DA01 | DA02 | DA03 | DA05 | DA06 | DA07 | DA08 | ||||
| . Packages | . . Main materials thereof | . . Additives thereof | . Reflective materials | . . Metals | . . White paints | . . Other reflective materials | ||||||
| DA11 | DA13 | DA14 | DA15 | DA17 | DA20 | |||||||
| . Diffuse reflection | . Transparent bodies | . . Main materials thereof | . . Additives | . Lens materials | . Others excluding materials of light emitting elements and light receiving elements | |||||||
| EA | EA00 MANUFACTURING METHOD OF PHOTOCOUPLER OR PHOTOINTERRUPTER |
EA01 | EA03 | EA04 | EA06 | EA08 | EA10 | |||||
| . for mounting elements | . for transparent bodies or packages | . . Moulding | . taking out to external terminals | . for mounting lenses | . Others; Other manufacturing methods not otherwise provided for | |||||||
| FA | FA00 ATTACHED ELECTRIC CIRCUIT |
FA03 | FA05 | FA06 | FA10 | |||||||
| . controlling bias current of light emitting elements | . Amplifying circuits | . Operation or signal-processing circuits | . Others; Other circuit arrangements not otherwise provided for | |||||||||
| GA | GA00 COMBINATION WITH OPTICAL ELEMENT |
GA01 | GA03 | GA05 | GA07 | GA08 | GA10 | |||||
| . Prisms or external lenses | . Beam splitters | . Holograms | . Filters | . using liquid crystals | . Others |