F-Term-List

H01L21/304-21/304,631;21/463

AA00
PROBLEM*

AA01

AA02

AA03

AA04

AA05

AA06

AA07

AA08

AA09

. Improve accuracy

. . Improve shape accuracy (Thickness, warping, sagging, etc.)

. . Improve surface accuracy (Roughness, planarity, haze, etc.)

. Decrease damage

. . Improve appearance abnormality (crack and chipping)

. . Prevent distortion, crystal damage and modified layer

. . Prevent film damage and exfoliation

. . Prevent corrosion

. . . Reduce dishing, erosion, etc.

AA11

AA12

AA13

AA14

AA16

AA17

AA19

AA20

. Improve the process

. . Improve process efficiency and stability

. . . Reduce the number of processes

. . . Reduce process time (individual process time)

. . Improve workpiece evenness after processing

. . . Improve process selection ratio

. . Improve inspection, evaluation and measurement methods

. . . Improve detection method (monitoring method)

AA21

AA23

AA24

AA25

AA27

AA28

AA29

. Purification and contamination prevention

. Improve tools

. . Improve abrasive cloth

. . . Improve to prolong abrasive cloth life

. Improve treatment liquid

. . Improve treatment liquid

. . . Storage stability

AA31

AA32

AA33

AA34

AA35

AA36

AA37

AA39

. Improve equipment and component (excluding safety measures)

. . Composition and arrangement

. . . Downsizing and space-saving

. . Higher throughput (AA14 must be as well considered.)

. . Operability

. . Operation ratio

. . Reliability, durability and maintenancebility

. Thermal and humidity measures

AA41

AA42

AA43

AA44

AA45

AA47

AA48

AA49

. Cost reduction

. . Raw material cost reduction (AA48 must be as well considered.)

. . . Recycle and reuse

. . Running cost reduction

. . Cost reduction of hardware

. Reduce environmental burden

. . Save resource and energy (AA42 must be as well considered.)

. . Disposal of waste liquid

AA51

AA52

AA53

. Safety precautions and measures against abnormalities

. . Hazard control

. . Prevention against abnormalities

BA00
WORKPIECE TYPES AND CONDITIONS *

BA01

BA02

. Ingot

. . Non cylindrical ingot

BA11

BA12

BA13

BA15

BA16

BA17

BA18

BA19

BA20

. Wafer

. . Bear wafer

. . . Non-circular wafer

. . Subject matter with a surface layer

. . . Subject matter with an epitaxial layer

. . . . SOS wafer

. . . Subject matter with an insulator layer or a stopper layer

. . Bonded wafer and multi-layer stack wafer

. . . SOI wafer

BA21

BA22

BA24

BA26

BA28

BA30

. . Subject matter with internal wiring

. . . Buried wiring (damascene)

. . Element isolation structure (STI)

. . External wiring, with a protrusion (e.g. CSP)

. . Wafer for evaluation (TEG, dummy wafer)

. Other workpiece kinds and statuses

BB00
MATERIAL OF WORKPIECE*

BB01

BB02

BB03

BB05

BB06

BB07

BB08

BB09

. Substrate material* (including ingot)

. . Elemental semiconductor

. . . Silicon (bulk state)

. . Compound semiconductor *

. . . Ga group

. . . . GaAs

. . . In group (BB06 is assigned if it contains Ga)

. . . Silicon carbide

BB11

BB12

BB14

BB15

BB16

BB17

BB18

BB19

. . Insulator substrate *

. . . Sapphire

. Layer material *

. . Silicon layer

. . Oxide silicon layer

. . Compound semiconductor layer

. . . GaN layer

. . Silicon nitride layer

BB21

BB22

BB23

BB24

BB25

BB26

BB27

BB28

BB29

. Wiring layer material *

. . Metal *

. . . Copper group

. . . Aluminum group

. . . Tungsten group

. . . Precious metal (Pt, Pd, Ag, etc.)*

. . . . Gold (Au)

. . Silicon group

. . . a-Si, p-Si

BB31

BB32

BB33

BB34

BB36

BB37

BB38

BB40

. Barrier layer material *

. . Tantalum group

. . Titanium group

. . Tungsten group

. Insulation layer material *

. . Oxide group

. . Low permittivity material

. Other workpieces *

BC00
APPLICABLE SUBJECT MATTER *

BC01

BC02

BC03

BC05

BC06

BC07

BC09

BC10

. Integrated circuit *

. . Memory *

. . Image pick-up device

. Discrete semiconductor element *

. . Luminous device

. . . Semiconductor laser

. Other devices *

. . MEMS

CA00
MANUFACTURING PROCESS *

CA01

CA02

CA03

CA04

CA05

CA06

CA07

CA09

. Ingot processing *

. . Slicing

. Preprocessing of ingot process

. . Slice base or its installation

. . Crystal orientation alignment

. Post-process of ingot processing

. . Remove the slice base

. beveling, chamfering and mesa-shaping

CA11

CA12

CA13

CA14

CA15

CA16

CA18

CA19

. Single side processing of a wafer

. . Process only on the element surface

. . Process only on the backside surface

. . . Thinning process

. . Process inner circumference within a plane (Creating a ring-shaped reinforcing part)

. . Process inner circumference within a plane(Polishing an inner circumferential part and cutting an outer circumferential part)

. Process both sides of a wafer

. . Simultaneous treatment of both sides of a wafer

CA21

CA22

CA24

CA25

CA27

CA29

. Finishing treatment of a wafer edge

. . OF, IF, notched part treatment

. Pretreatment of wafer polishing

. Post-treatment of wafer polishing

. Inspection and evaluation

. Retreatment of a wafer

CA31

CA32

CA34

CA36

CA38

CA40

. Process within a chip

. . Grinding before dicing

. Element treatment after dicing

. A series of processes including polishing and grinding

. Packaging and assembly processes

. Other manufacturing processes *

DA00
PROCESSING/TREATMENT METHOD AND MEANS *

DA01

DA02

DA03

DA04

DA05

DA06

DA07

DA08

DA09

DA10

. Polishing

. . Subject matter that uses an abrasive cloth (including fixed abrasive grains)

. . . CMP

. . . ECMP and EMP

. . Lapping

. . Tape and belt polishing

. . Brushing

. . Multi-step polishing

. . . Subject matter that is carried out on a same surface plate

. . Subject matter using a polishing tool smaller than a workpiece

DA11

DA12

DA13

DA14

DA15

DA16

DA17

DA18

DA19

DA20

. . Grinding

. . . Electrolytic grinding

. . Subject matter that uses other treatment means

. Cutting

. Wire and reciprocating blade processing

. Inner diameter blade application

. Outer diameter blade processing (revolving blade)

. Scribing

. Cracking and separation

. . Cleavage

DA21

DA22

DA23

DA24

DA26

DA28

DA29

. Photoirradiation treatment (including electron beam and radiation)

. . Subject matter that uses laser

. Jetting

. . Sand blasting

. Ultrasonic treatment (Assign GA if a subject matter is to treat working fluid)

. Etching

. . Wet etching

DA31

DA32

DA33

DA34

DA35

DA36

DA37

DA38

DA39

DA40

. Property modification *

. . Doping

. . . Ion injection

. . Anodization

. Thermal treatment

. . Subject matter of which purpose is to improve crystal quality

. . Subject matter that is characterized with thermal treatment atmosphere

. Cleaning treatment (FA36 to 37 must be as well considered.)

. . Scrubbing (including water polishing)

. Other processing and treatment

EA00
WORKING FLUID (A SUBJECT MATTER THAT IS DESCRIBED IN A CLAIM, EXCEPT FOR EA15 TO 18 AND EA31 TO 33, IS APPLICABLE)

EA01

EA02

EA03

EA05

EA06

EA07

EA08

EA09

EA10

. Subject matter where abrasive grain is an essential constituent

. Subject matter where abrasive grain is not contained

. . Subject matter which can contain abrasive grains

. Types of abrasive grains *

. . Inorganic particles

. . . Silica

. . . Alumina

. . . Ceria

. . Organic particles

EA11

EA12

EA13

EA15

EA16

EA17

EA18

. . Composite particles

. . Mixed particles

. . Magnetic particles

. Shape and size of abrasive grains

. . Definition of the primary particle size

. . Definition of the secondary particle size

. . Subject matter that is characterized with abrasive grain shape

EA21

EA22

EA23

EA24

EA25

EA26

EA27

EA28

EA29

EA30

. Constituents other than abrasive grains (essential constituent) *

. . Oxidant

. . Complexing agent (chelating agent)

. . Metal dissolving agent (etching agent)

. . Anti-corrosive agent (an agent to form a protection layer or passivation film)

. . pH adjusting agent (buffering agent)

. . Surfactant

. . Dispersing agent

. . Solvent

. . . Alcohol

EA31

EA32

EA33

EA35

EA37

EA38

EA40

. pH range

. . Subject matter that is used only in an acid area

. . Subject matter that is used only in an alkaline area

. Subject matter that defines impurity density

. Subject matter that is diluted or mixed

. . Polishing liquid kit

. Subject matter that is characterized with methods of evaluation and selection of working fluid

EB00
TOOL *

EB01

EB02

EB03

EB04

EB05

EB06

EB07

EB08

EB09

EB10

. Abrasive cloth *

. . Subject matter characterized with material (must be specified in claim)

. . . Subject matter of which base is an organic polymer.

. . . Subject matter of which base is non-woven fabrics

. . Subject matter that is characterized with tis structure and shape

. . . Multiple-layer structure

. . . Foam structure

. . . Subject matter that is characterized with grooves on a surface

. . . Subject mater that contains particles

. . . . Subject matter that contains abrasive grains

EB11

EB12

EB13

EB15

EB16

EB17

EB18

EB19

EB20

. . . Subject matter that has an opening and a translucent part

. . . . Subject matter that is characterized with material or properties of a translucent part

. . Subject matter that is characterized with properties (EB12 is prioritized)

. Grindstone *

. . Subject matter that is characterized with material of abrasive grains

. . . Subject matter that defines abrasive grain size

. . Subject matter that is characterized with bonding material

. . Subject matter that is characterized with properties

. . Subject matter that is characterized with structure and shape

EB21

EB22

EB23

EB24

EB26

EB27

EB30

. Lap plate

. Polishing tape

. Polishing belt

. Wire tool

. Other tools *

. . Dressing tool

. Subject matter that is characterized with methods of manufacturing or evaluation of a tool

EC00
SUPPLEMENTAL MATERIAL *

EC01

EC02

EC03

EC04

EC05

EC06

EC07

EC08

EC09

EC10

. Material to retain a workpiece (It must be specified in claim.)

. . Adhesive agent

. . . Subject matter that is characterized with material

. . . Subject matter that is characterized with properties

. . Adhesive sheet (with a substrate)

. . . Subject matter that is characterized with material or properties of a substrate (middle layer)

. . . Subject matter that is characterized with material and properties of an adhesive layer.

. . . Subject matter that is characterized with properties as an entire sheet

. . . Subject matter that is characterized with sheet structure or layer composition

. . Retention board and material of retention jig (carrier material and the like)

EC11

EC12

EC13

EC14

EC15

EC16

EC17

EC18

EC19

EC20

. Surface protection material (It must be specified in claim.)

. . Melting and sublimation material (no substrate)

. . . Subject matter that is characterized with material

. . . Subject matter that is characterized with properties

. . Adhesive sheet (with substrate)

. . . Subject matter that is characterized with substrate (middle layer) material or properties

. . . Subject matter that is characterized with adhesive material or properties

. . . Subject matter that is characterized with properties as an entire sheet

. . . Subject matter that is characterized with sheet structure or layer composition

. . Retention board and material of retention jig (carrier material and the like)

EC21

EC23

EC24

EC25

EC26

EC27

EC29

EC30

. Adhesive material for the purpose other than fixing a workpiece

. Material comprising a device

. . Material comprising a processing head

. . . Material of a retainer ring

. . Material for a platen

. . Protection film to prevent contamination, rust and abrasion

. Other supplemental material

. . Cleaning liquid

FA00
PERIPHERAL TECHNOLOGY AND RELEVANT DEVICE *

FA01

FA02

. Subject matter that is characterized with structure or composition of a processing system

. . Subject matter that is characterized with arrangement of constituents

FA11

FA12

FA13

FA14

FA15

FA16

FA17

FA18

FA19

FA20

. Retention *

. . Workpiece retention (including retention for an ingot)

. . . Subject matter via adsorption

. . . . Water adhesion (utilizing backing material and the like)

. . . Subject matter via adhesion

. . . . Subject matter via adhesive sheet

. . . Subject matter of which side is sandwiched (carrier structure and the like)

. . . Substrate pressure adjustment

. . . . Subject matter that is characterized with a structure of pressure application

. . . Retainer ring

FA21

FA22

FA23

FA24

FA25

FA27

FA28

FA30

. . . . Subject matter that is characterized with structure allowing vertical movement

. . . Subject matter via supporting plate

. . . Subject matter that utilizes a spacer or dummy members

. . Tool retention

. . . Subject matter that is characterized with retention of an abrasive cloth

. Protection *

. . Workpiece protection (Material: EC11 to 290)

. Attachment and exfoliation

FA31

FA32

FA33

FA34

FA35

FA36

FA37

FA39

. Transfer a workpiece

. . Transfer, put on and remove from a processing apparatus (FA34 is prioritized)

. . Workpiece alignment

. . Transfer into or from a cassette or its structure

. . Transferring and storage under a special circumstance (storage in the water and the like)

. Cleaning mechanism (including drying)

. . Workpiece cleaning mechanism

. Mechanism of tool conditioning and dressing

FA41

FA42

FA43

FA44

FA45

FA46

FA48

FA50

. Supply and collect liquid

. . ,Mechanism to supply a processing liquid to a processing point (Method: GA07)

. . Circulate processing liquid and dispose waste liquid

. . . Recycle processing liquid

. . Dispose liquids other than processing liquid

. Observation or recognition mechanism (Except for end point detection)

. Control device circumstances and atmosphere (Thermal treatment: DA37)

. Other peripheral technologies and relevant apparatuses *

GA00
CONTROL *

GA01

GA02

GA03

GA04

GA05

GA06

GA07

GA08

GA09

GA10

. Control processing conditions *

. . Control pressure and load

. . Control velocity and rpm

. . Control temperature and humidity (GA07 for processing liquid)

. . . Cooling

. . Control time

. . Control supply or processing liquid (amount, temperature, ultrasonic, etc.)

. . Control polishing torque

. . Subject matter that has different treatment condition for front and back

. . . Subject matter that uses different abrasive clothes for front and back

GA11

GA12

GA13

GA15

GA16

GA17

. Monitor processing status

. . Subject matter that detects the end point of processing

. . Subject matter that is characterized with monitoring position of processing status

. Subject matter that is characterized with a method to set processing conditions

. . Subject matter that is based on obtained data

. . Subject matter that utilizes simulation

GA21

GA22

GA23

GA24

GA25

GA27

GA28

GA29

GA30

. Subject matter that compensates irregularities of the surface to be processed

. . Subject matter that forms a film at a dent

. . Subject matter that partially removes protrusions

. . Correction by pattern layout design

. . . Subject matter that provides a dummy pattern

. Control operation of an apparatus (Dressing: GA28)

. Dressing control

. . Control dressing of an abrasive cloth

. Other control *

GB00
DETECTION AND MEASUREMENT *

GB01

GB02

GB03

GB04

GB05

GB06

GB07

. Detection method * (Consider after GB11)

. . Optical detection

. . Electric detection

. . Load detection

. . . Detection of driving current and voltage

. . Chemical detection

. . Thermal detection

GB11

GB12

GB13

GB14

GB15

GB16

GB17

GB18

GB19

GB20

. Measured amount *

. . Dimension and shape

. . . Thickness (film thickness)

. . . Warp

. . Surface precision *

. . . Roughness and planarity

. . Surface status *

. . . Number of defects

. . . Brightness and glossiness (including transmittance)

. . Optical intensity, spectrum, absorbance and the like

GB21

GB22

GB23

GB24

GB25

GB26

GB27

GB28

GB30

. . Velocity and rpm

. . Vibration (Acoustic vibration: GB34)

. . . Acceleration

. . Pressure and load

. . Torque

. . Friction (Friction coefficient)

. . Tensile strength

. . Wear amount (other than workpiece)

. . Distance and angle

GB31

GB32

GB34

GB35

GB37

GB38

GB39

GB40

. . Displacement and location

. . Volume and weight

. . Noise and AE (including elastic wave)

. . Crystalline and distortion

. . Chemical amount

. . . Density

. . . Color development of reagent

. . Temperature, humidity and calorie (amount of infrared irradiation)

5F057	MECHANICAL TREATMENT OF SEMICONDUCTOR
	H01L21/304 -21/304,631;21/463