F-Term-List

H01L31/00-31/02@Z;31/08-31/08@Z

AA00
TYPES OF LIGHT-RECEIVING ELEMENTS AND RADIATION DETECTING ELEMENTS

AA01

AA02

AA03

AA04

AA05

AA07

AA08

AA09

. Photodiodes (PD)

. . PN junction type photodiodes

. . . PIN junction type photodiodes

. . Schottky barrier type photodiodes

. . Avalanche photodiodes (APD)

. Phototransistors (PT)

. . Bipolar type transistors

. . Field effect type (FET) transistors

AA11

AA12

AA20

. Photoconductors (light conductive type)

. . P Type photoconductors

. Light-receiving elements of other types

AB00
MATERIAL OF LIGHT-RECEIVING ELEMENT BODY (SUBSTRATE, ELECTRODE, ETC. ARE CLASSIFIED IN VIEWPOINTS FA THROUGH HA).

AB01

AB02

AB03

AB04

AB05

AB07

AB09

. Light-receiving element body materials*

. . group IV materials*

. . . Single crystal and polycrystal group IV materials*

. . . Crystallite group IV materials*

. . . Amorphous group IV materials*

. . Group III-V materials*

. . Group II-VI materials

AB11

AB12

AB13

AB14

AB16

AB17

AB19

. . Organic materials*

. . . Azo dyes

. . . Phthalocyanine compounds

. . . Hydrazone compounds

. Dopant materials for light-receptive device body*

. . Conductive type decision*

. Binder materials (for light-receiving element body only)

BA00
OBJECTIVES AND EFFECTS (EXCLUDING COST REDUCTION) OF LIGHT-RECEIVING ELEMENT IMPROVEMENTS

BA01

BA02

BA03

BA04

BA05

BA07

BA10

. Sensitivity improvement ( i.e., quantum efficiency improvement)

. Response improvement ( i.e., frequency characteristics improvement)

. S/N ratio improvement

. Reduction in dark current

. Dynamic range "enlargement" (i.e., high contrast ratio)

. Energy resolution improvement (e.g., radiation and corpuscular rays)

. Stabilization of light-receiving element performance (i.e., prevention of characteristics change)

BA11

BA13

BA15

BA16

BA18

BA20

. Improvement of light-receiving element resistance to environmental factors (i.e., heat, water, dust, vibration, etc.)

. Prolongation of light-receiving element life

. Miniaturization of light-receiving elements

. Enhanced mounting or fixing of light-receiving elements

. Improvement of light-receiving element manufacturing processes

. Other objectives and effects of light-receiving element improvement

BB00
USES OF LIGHT-RECEIVING ELEMENTS

BB01

BB02

BB03

BB04

BB05

BB06

BB07

BB08

BB10

. Light communication

. Line sensors

. Solid image pickup devices

. Targets for image pickup tube

. Solar cells

. Measurement

. Medical Treatment

. Photoconductors for electrophotography

. Other uses of light-receiving elements

CA00
AMORPHOUS (INCLUDING CRYSTALLITE) MANUFACTURING METHODS AND PROCESSES OF LIGHT-RECEIVING ELEMENT BODY MATERIALS

CA01

CA02

CA04

CA05

CA07

CA08

CA09

CA10

. Chemical vapor deposition (CVD) process for manufacturing light-receiving element materials

. . Plasma CVD (i.e., glow discharging method) for manufacturing light-receiving element materials

. Physical Vapor Deposition (PVD) method for manufacturing light-receiving element materials

. . Vacuum evaporation method

. Amorphous manufacturing system for making light-receiving element materials

. . Structure of film forming cell

. Additional processes (e.g., doping, heat treatment, etc.) in manufacturing of light-receiving element materials

. Other items pertaining to amorphous manufacturing of light-receiving element materials

CB00
METHODS AND PROCESSES FOR MANUFACTURING LIGHT-RECEIVING ELEMENT BODY MATERIALS OTHER THAN AMORPHOUS GROUP IV MATERIALS

CB01

CB02

CB03

CB04

CB05

CB06

CB07

CB08

CB09

CB10

. Crystal growth manufacturing method for light-receiving element materials

. . Liquid phase epitaxy (LPE)

. . Vapor phase epitaxy (VPE)

. . . MOCVD method

. Thin film technology (F-terms from CB01 through CB04 take precedence.)

. . Vacuum evaporation method

. . Sputtering method for depositing film of light-receiving element materials

. Doping

. . Thermal diffusion

. . Ion implantation

CB11

CB12

CB14

CB15

CB17

CB18

CB20

. Heat treatment

. . Photo annealing

. Etching processes

. Electrode forming method

. Light-receiving element division (i.e., dicing and scribing)

. Light-receiving element manufacturing conditions (i.e., temperature, pressure, time, etc.)

. Other light-receiving element manufacturing methods and processes

DA00
LIGHT-RECEIVING ELEMENT STRUCTURES IN GENERAL (VIEWPOINT AA COVERS TYPES AND FA COVERS DETAILS).

DA01

DA03

DA05

. Photodiode structures

. Phototransistor structures

. Photoconductor structures

DA11

DA13

DA14

DA15

DA17

DA20

. Layer structure (i.e., tandem)

. Intermediate coupling layers for light-receiving elements

. . Buffer layer (i.e., grating constant matching)

. . Block layer

. Light-receiving element shape (including surface shapes)

. Other elements of light-receiving element structure

EA00
MODULARIZATION OF LIGHT-RECEIVING ELEMENTS

EA01

EA02

EA03

EA04

EA06

EA07

EA08

EA09

. Modules combined with plurality of the same type of light-receiving elements

. . Arrays of the same type of light-receiving elements

. . . One dimensional arrays (Line Sensor)

. . . Two dimensional arrays (i.e., solid image pickup devices)

. Light-receiving modules combined with different types of elements

. . Composing With Amplifying Devices

. . Coupling with switching elements

. . Coupling with light-emitting elements

EA11

EA13

EA14

EA16

EA20

. Layout of light-receiving modularized elements

. Isolating structures

. . Insulating isolation

. Electrical connections among light-receiving modularized devices

. Other elements pertaining to modularization of light-receiving elements

FA00
ELECTRODES (TERMINALS ARE COVERED IN VIEWPOINT JA)

FA01

FA02

FA03

FA04

FA05

FA06

FA09

. Electrode materials*

. . Transparent electrodes*

. . . Stannum dioxide (tin dioxide)

. . . ITO

. . Metal electrodes*

. . Organic materials for electrodes*

. Electrode shape and layout

FA11

FA12

FA14

FA15

FA20

. Electrode structure

. . Multi-layered electrode structure

. Electrode functions

. . Reflective film dual purpose

. Other items pertaining to electrodes

GA00
LIGHT-RECEIVING ELEMENT BODY SUBSTRATES (ON WHICH DEVICE BODY IS FORMED)

GA01

GA02

GA03

GA04

GA05

GA07

GA08

GA09

GA10

. Substrate materials (Viewpoint AB takes precedence.)

. . Insulation substrates (e.g., glass)*

. . Semiconductor substrates*

. . . Group IV*

. . . Group III-V*

. Shapes (including surface shape) of light-receiving element substrates

. Structure of light-receiving element substrates

. . Multi-layered structure

. Other features pertaining to light-receiving element body substrates

HA00
OTHER LIGHT-RECEIVING ELEMENT CONSTITUENTS

HA01

HA02

HA03

HA05

HA06

HA07

HA09

HA10

. Antireflection film for light-receiving elements

. . Antireflection film materials*

. . . Inorganic materials

. Filter film for light-receiving elements

. . Materials*

. . Structures*

. Reflection film (excluding electrode) for light-receiving elements

. Shading film and radiation shielding film (excluding electrode) for light-receiving elements.

HA11

HA12

HA13

HA15

HA20

. Surface protection coats for light-receiving elements

. . Surface protection coat materials*

. . . Silicon dioxide

. Scintillators (having a different body from device in JA17)

. Other items pertaining to this article

JA00
CASES AND MOUNTINGS FOR LIGHT-RECEIVING CHIPS OR PELLETS

JA01

JA02

JA03

JA05

JA06

JA07

JA09

JA10

. Mountings of light-receiving element chips or pellets

. . Terminals on lead frames

. . On bases

. Cases, bases, and packages for light-receiving chips or pellets

. . Molding dies

. . Can sealing

. Bonding of light-receiving element chips or pellets

. . Wire bonding

JA11

JA12

JA13

JA14

JA16

JA17

JA18

JA20

. Coupling of light-receiving element chips or pellets with optical members

. . Lens

. . Optical filter

. . Optical fiber (light guide)

. Radiation shielding plate

. Scintillator plate for light-receiving element chips or pellets

. Terminals, lead frames

. Other items pertaining to cases and mountings of light-receiving element chips and pellets

KA00
PERIPHERAL CIRCUITS OF LIGHT-RECEIVING ELEMENTS

KA01

KA02

KA03

KA06

KA08

KA10

. Bias circuits

. . Including amplifying circuits

. . Including switching circuits

. Detecting circuits for feedback (e.g., temperature detection)

. Reading circuits of light-receiving elements

. Other peripheral circuits of light-receiving elements

LA00
LIGHT-RECEIVING WAVELENGTH BAND OF LIGHT-RECEIVING ELEMENTS OR DETECTION OBJECT OF RADIATION DETECTING ELEMENTS

LA01

LA03

LA05

LA07

LA08

LA09

. Infrared light-reception by light-receiving elements

. Visible light-reception by light-receiving elements

. Ultraviolet light-reception by light-receiving elements

. Radiation detection by radiation detecting elements

. . X-ray detection by radiation detecting elements

. Reception of wide-range light (including reception of multi-color light)

5F088	LIGHT-RECEIVING ELEMENTS I (COMMON ITEMS, RADIATION DETECTION)
	H01L31/00 -31/02@Z;31/08-31/08@Z