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F-Term-List

H01L21/52-21/52@Z AA AA00
MATERIALS FOR SUPPORTS 		AA01 AA02 AA03 AA04 AA05 AA07 AA08 AA09 AA10
. Stems, bases and headers . . Metals* . . . Cu . . . Fe . . . Mo, W . . Composite materials* . . . C-Cu . . . Kovar, amber . . . Glass epoxy
AA11 AA13 AA14 AA17 AA19
. Lead frames, tabs . Package . . Ceramic cases . Print circuit boards . Submounting
AB AB00
MECHANISM OF SUPPORTS 		AB01 AB02 AB03 AB04 AB06 AB08 AB09 AB10
. Grooves, holes . . For feeding bonding materials . Concave sections for die insertion . . Sections for engagement . Convex sections . Coatings, claddings . . Ni . . Au, Ag
BA BA00
BONDING MATERIALS 		BA01 BA02 BA04 BA05 BA06
. Brazing materials . . Melting point* . . . Hard brazing materials (450 degree C or higher) . . . High temperature solder (250 degree C to 450 degree C) . . . Low temperature solder (lower than 250 degree C)
BA12 BA14 BA15 BA16 BA17 BA18 BA19
. . Materials* . . . Cu systems* . . . Ag systems* . . . Al systems* . . . In systems* . . . Pb systems* . . . Sn systems*
BA21 BA22 BA23 BA24 BA25 BA26
. Resins . . Conditions for hardening . . . Thermal hardening . . . Ultraviolet hardening . . . Hot melt . . . Additions of catalysts
BA32 BA33 BA34 BA35 BA36 BA37 BA38 BA39 BA40
. . Characteristics . . . Thermosetting materials . . . . Epoxy systems . . . . Phenol systems . . . . Polyester systems . . . Thermoplasticity . . . . Polyethylene systems . . . . Polyamide systems . . . Elastomers
BA41 BA42 BA43 BA45
. Eutectic alloys* . . Au-Si . . Au-Ge . Glasses with low melting points
BA51 BA52 BA53 BA54 BA55 BA56 BA58
. Additives* . . Metals, Conductors* . . . Ag, Au . . Dielectrics and insulators* . . Addition of impurities* . . . Addition of impurities for ohmic improvement . Fluxes
BB BB00
FORMS WHEN BONDING MATERIALS ARE ADDED 		BB01 BB02 BB03 BB04 BB05 BB06 BB07
. Solid forms . . Wires . . Ribbons, tapes . . Spheres . . Pellets, chips, plates . . Fibers . . Cladding, plating
BB11 BB13 BB16 BB18 BB19
. Liquid forms . Semi-hardened forms (i.e., B stage) . Feeding to or forming on supports . Feeding to or forming on dies . . Forming on wafers
BC BC00
BONDING STRUCTURES 		BC01 BC02 BC03 BC04 BC06 BC07 BC08 BC09
. Barrier layers * . . Ni* . . Pd* . . Cu* . Binder and contact layers* . . Ti* . . Cr* . . Al*
BC11 BC12 BC13 BC14 BC16 BC17 BC18 BC19
. Protective layer* . . Au . . Ag . . Pt . Insulating layers* . . Oxides* . . . Al203, Alumina . . . BeO
BC21 BC22 BC23 BC24 BC26 BC27 BC29
. . Nitrides* . . . AlN . . . BN . . . Si3N4 . . Carbides* . . . SiC . . Organic materials*
BC31 BC32 BC33 BC35 BC37 BC40
. Buffer layers* . . Mo . . W . Heat sinks . Additives with specific ohmic properties . Other layers*
CA CA00
DIE MATERIALS 		CA01 CA02 CA06 CA08
. Semiconductors (excluding Si) . . Groups III-V* . Superconductors . Light reception, light emission, and lasers
CB CB00
DIE STRUCTURE 		CB01 CB02 CB03 CB05 CB07 CB08
. Formation of reverse surface . . Rough surface working . . Formation of indentations and projections . Variants in which electrodes do not run through the reverse surface . P-type reverse surface of the die . N-type reverse surface of the die
FA FA00
BONDING APPARATUSES 		FA01 FA02 FA03 FA04 FA05 FA07 FA08 FA09
. Die feed elements and table feed . . X-Y tables . . Greek small letter theta tables . . Needles . . Accommodation of multiple types of dies . Die holding elements . . Collets (i.e., absorbing nozzles) . . . Buffer materials and springs
FA11 FA12 FA14 FA15 FA16 FA17 FA18
. . Pincers . . X-correction, Y-correction, and greek small letter theta-correction . Die position correction elements . . X-Y tables . . greek small letter theta tables . . Chucking . . Positioning plates
FA21 FA22 FA23 FA24 FA25 FA26 FA27 FA28 FA29 FA30
. Bonding material feed elements . . Dispensers . . Tape cutting . . Plier dies . . Collets . . Pincers . . Elements that remove surplus bonding materials . . Stirring elements . . Flux feed elements . . Elements that remove oxide films
FA31 FA32 FA33 FA34 FA35 FA36 FA38 FA39
. Base material feeding and conveying elements . . Guide rails . . . Variants having synchronized structures . . Fixed advance and position correction . . . Variants having advancing pawls . . Loaders and unloaders . Elements for scrubbing . . Variants with fine adjustment mechanisms provided on mounting arms
FA41 FA42 FA43 FA44 FA45 FA46 FA47 FA48 FA49 FA50
. . Ultrasonic vibration . . Cams . . . Eccentric cams . . Drive motors . . . Pulse motors . . Load means . . . Adjustable variants . . Variants that adjust scrubbing directions (e.g., X, Y, greek small letter theta) . . Variants that adjust scrubbing speed . . Variants that adjust scrubbing time
FA51 FA52 FA53 FA54 FA55 FA56 FA57 FA58 FA59
. Heating elements . . Heat blocks . . . Formation of indented and projecting sections or grooves . . . Variants having support holding mechanisms . . Infrared rays . . Microwaves . . Lasers . . Heated gases . . . Inert or reducing gases
FA61 FA62 FA63 FA65 FA66 FA67 FA68 FA69 FA70
. Closed-environment elements, baking, and curing . . Inert gases . . Reducing gases . Blower elements . . Blowers for scattering of debris and the like . . Blowers for suction . . Blowers for inhibiting oxidation . . Blowers for cooling . . Blowers for stirring
FA71 FA72 FA73 FA74 FA75 FA77 FA79
. Elements for recognition and detection . . Variants that handle dies . . . Position and inclination detection . . . Pass/fail detection . . . Detection of dies on feed elements during wafer formation . . Variants that handle bending materials . . Variants that handle supports
FA81 FA82 FA83 FA84 FA90
. . Temperature sensing . . Pressure sensing . . Light sensing . . Contact sensing . Other elements*
JA JA00
PRESSING TYPES (AS DESCRIBED IN REPRESENTATIVE FIGURES) 		JA01 JA02 JA03 JA04 JA05 JA06 JA07 JA08 JA09 JA10
. Semiconductor base materials and elements . . Cathodes and anodes . . Gate electrodes . Passivation films and encapsulating materials . Bonding materials (e. g. , solder) . Metal plates (e. g. , soft plates) . Temperature compensation and heat buffer plates . . Molybdenum (Mo), tungsten (W) . . C-Cu . External electrodes
JA11 JA12 JA13 JA14 JA15 JA16 JA17 JA18 JA20
. Guide rings . gate terminals, gate leads, and springs . Ring-shaped metal plates . Insulating tubes and casings . Cooling elements (e.g., fins) . . Elements for water cooling . Filling substances and tubes . Pressing by bolts . Other elements*
JB JB00
PRESS-IN TYPES CHARACTERIZED BY SHAPE AND STRUCTURES 		JB01 JB02 JB03 JB04 JB05 JB06 JB07 JB08 JB09 JB10
. Semiconductor base materials and elements . . Cathodes and anodes . . Gate electrodes . Passivation films and encapsulating materials . Bonding materials (e.g., solder) . Metal plates (e.g., soft plates) . Temperature compensation and heat buffer plates . . Molybdenum (Mo) and tungsten (W) . . C-Cu . External electrodes
JB11 JB12 JB13 JB14 JB15 JB16 JB17 JB18 JB20
. Guide rings . Gate terminals, gate leads, and springs . Ring-shaped metal plates . Insulating tubes and casings . Cooling elements (e.g., fins) . . Elements for water cooling . Filling substances and tubes . Pressing by bolts . Other elements*
JC JC00
PRESS-IN TYPES CHARACTERIZED BY MATERIALS 		JC01 JC02 JC03 JC04 JC05 JC06 JC07 JC08 JC09 JC10
. Semiconductor base materials and elements . . Cathodes and anodes . . Gate electrodes . Passivation films and encapsulating materials . Bonding materials (e.g., solder) . Metal plates (e.g., soft plates) . Temperature compensation and heat buffer plates . . Molybdenum (Mo) and tungsten (W) . . C-Cu . External electrodes
JC11 JC12 JC13 JC14 JC15 JC16 JC17 JC18 JC20
. Guide rings . Gate terminals, gate leads, and springs . Ring-shaped metal plates . Insulating tubes and casings . Cooling elements (e.g., fins) . . Elements for water cooling . Filling substances and tubes . Pressing by bolts . Other elements*
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