F-Term-List

H01L21/60,301;21/60@A;21/60@B

AA00
CONNECTION STRUCTURES WITH PELLET ELECTRODES BY WIRES

AA01

AA02

AA03

AA04

AA05

AA07

AA08

AA09

AA10

. connecting with lead-frames

. connecting with wiring boards

. . plating board wirings

. . having bonding chips on board wirings

. . Arrangements or shapes of board wirings

. connecting with the wiring parts of packages

. . of multilayered wiring parts

. connecting with the leads of stems

. connecting with relay members

AA11

AA12

AA14

AA15

AA18

AA19

AA20

. connecting with members having the same potential as that of mount islands

. connecting with other element electrodes

. Wire connections of pellet electrodes

. . forming protection coats

. Connecting a plurality of wires with a single pad electrode

. connecting a plurality of wires to a single lead

. Arranging wires

H01L21/60,301;21/60@G;21/60@H;21/60@J;21/60@K

BB00
WIRE BONDING DEVICES

BB01

BB02

BB03

BB04

BB05

BB06

BB09

BB10

. Bonding tools

. . having a plurality of bonding tools

. Bonding arm driving parts

. . by cams

. . by magnetism

. Bonding pressure or load adjustment parts

. forming wire balls

. . by hydrogen torches

BB11

BB12

BB13

BB14

BB15

BB16

BB17

BB19

BB20

. . by electric discharges

. . . Structures of discharge electrodes

. . . Discharge atmospheres

. Wire-feeding parts

. Wire clampers

. Wire tension adjustments

. . blowing air

. XY tables

. Placing parts for bonded members

BB21

BB22

BB23

BB25

. pressing lead frames

. Transporting of or mechanical positioning of bonded members

. Prevention of air fluctuations

. Heaters for lead frames or the like

H01L21/60,301;21/60@D

CC00
WIRE BONDING METHODS

CC01

CC02

CC03

CC04

CC05

CC06

CC07

. Preliminary treatments

. After-treatments

. Atmosphere during bondings

. Temperatures heatings or coolings

. Movement of bonding tools

. Bondings with solders waxes or adhesives

. reinforcing bonding parts

H01L21/60,301;21/60@L

DD00
OPTICAL DETECTION OF BONDING POSITIONS

DD01

DD02

DD03

DD04

DD05

DD06

DD07

DD08

DD10

. optical aligning or positioning

. detecting positions

. . detecting the positions of pellets

. . . by outer shapes of pellets

. . . by pad electrodes of pellets

. . . by detection patterns

. . detecting the positions of leads

. . precisely detecting after coarse adjustments

. being position detection parts and bonding parts independent with each other

DD11

DD12

DD13

DD16

DD17

DD18

DD19

DD20

. Automatic bonding

. . Semiautomatic bonding

. . Full-automatic bonding

. Patterns for detecting positions

. . on pellets

. . on leads or wiring boards

. . clarifying the contours of patterns or pellets

. characterised by optical systems

H01L21/60,301;21/60@N

EE00
BONDING PAD ELECTRODES

EE01

EE02

EE03

EE04

EE06

EE07

EE08

. Shapes of pads

. Arrangements of pads

. . arranged in zig-zag order

. Materials of pads

. having multilayer structures of pads

. Pads for examinations

. with preventions against corrosions or improved moisture resistance

EE11

EE12

EE13

EE14

EE15

EE16

EE17

EE18

EE20

. with preventions against mechanical breakages

. with preventions against peelings of pads

. Pads closely engaged with wires

. with preventions against cutting of electrode wires

. with preventions against a purple plague

. with prevention against electrostatic discharge

. Pads with a small stray capacitance

. Forming capacitors by pads

. highly integrated

EE21

. Methods of forming pad electrodes

H01L21/60,301;21/60@F

FF00
METALLIC WIRES FOR BONDINGS

FF01

FF02

FF03

FF04

FF05

FF06

FF08

FF09

FF10

. Wires with insulating coatings

. Wires with metal coatings

. Wire materials

. . mainly composed of noble metals

. . mainly composed of Al

. . mainly composed of Cu

. characterised by shapes

. connected with wires of different thickness

. Processes for manufacturing wires

H01L21/60,301;21/60@B;21/60@M

GG00
LEAD-FRAMES

GG01

GG02

GG03

GG04

GG05

GG07

GG08

GG10

. treated by plating or vapour deposition

. Claddings

. Shapes or arrangements of inner leads

. . Lead-frames having multilayer structures

. . having reinforced leads

. characterised by tabs or tab leads

. . Tab-less lead-frames

. Manufacturing methods or apparatuses of lead-frames

H01L21/60,301;21/60@C

HH00
PREVENTION OF WIRE SHORT CIRCUITS

HH01

HH02

HH04

HH05

HH06

. characterised by shapes or arrangements of leads

. arranging insulating materials or insulating regions

. using auxiliary members in bonding

. blowing gases

. correcting wire loops after bondings

H01L21/60,301;21/60@A-21/60@Z

JJ00
ARTS RELATING TO WIRE BONDINGS

JJ01

JJ03

JJ05

JJ08

. using infra-red radiations or laser beams

. relating to housings or resin sealings

. relating to coolings

. connecting mount islands to leads

H01L21/60,301;21/60@S

KK00
WIRING BOARDS FOR FACE DOWN BONDINGS

KK01

KK02

KK03

KK04

KK05

KK06

KK07

KK08

KK09

KK10

. Boards

. . Resin boards

. . . Flexible boards

. . Ceramic boards

. . Semiconductors or metallic boards

. . Transparent boards

. . Multilayer wiring boards

. . Auxiliary boards or chip carriers

. characterised by circuit patterns

. . Double-sided wirings

KK11

KK12

KK13

KK14

KK15

KK16

KK17

KK18

KK19

. characterised by electrodes

. . Pad patterns

. . Metallic multilayer

. . . Solder coatings

. . Solder dams

. . Bumps

. . . Shapes or arrangements

. . . Materials

. . . Manufacturing methods

KK21

KK23

KK25

KK27

. Alignment marks

. Chip positioning structures

. provided with bonding openings

. provided with boards having resin injection holes

LL00
FACE DOWN BONDINGS

LL01

LL02

LL04

LL05

LL07

LL09

. direct soldered

. . Soldering of boards via through-holes

. Soldering methods

. . Heating methods

. with conductive pastes or adhesives

. by anisotropic conductive materials

LL11

LL13

LL15

LL17

LL19

. with chips closely contacting to wirings by using insulating materials

. connecting through intermediates

. by contacts

. Spacers between boards and chips

. Solder packing

H01L21/60,301;21/60@R;21/60@W;21/60@Q

MM00
FILM CARRIERS

MM01

MM02

MM03

MM04

MM06

MM07

MM08

. Types

. . with only metallic layers

. . with one layer of metallic foil on an insulating film

. . with multilayered metallic foils

. Insulating film tapes

. . with slits or grooves on films

. . Reinforcing films

MM11

MM13

MM14

MM15

MM16

. Adhesives

. Device holes

. . with a plurality of lines

. . with a plurality of types

. . without device holes

MM21

MM22

MM23

MM24

MM25

MM26

MM27

MM28

. Leads

. . Materials

. . platings or coatings with solders

. . Prevention of lead deformations

. . Inner leads

. . Outer leads

. . Element holding conductors

. . Stress relaxation patterns

MM31

MM32

MM33

MM34

MM35

MM38

MM39

MM40

. Bumps

. . by etching

. . by transferring

. . by pressing

. . by plating

. Test pads

. Outer lead holes

. Sprocket holes

MM41

MM42

MM43

MM44

MM45

MM46

MM47

MM48

MM49

MM50

. Identifications or property indications

. Holes or marks for alignments

. Prevention of static electricity

. Prevention of short circuits

. Solder dams

. with electric elements formed on films

. shielding alpha rays

. Methods of forming film carriers

. Apparatuses for manufacturing film carriers

. Curved or bent film carriers

H01L21/60,301;21/60@R;21/60@Q

NN00
FILM CARRIER BONDINGS

NN01

NN02

NN03

NN04

NN05

NN06

NN07

NN08

NN09

NN10

. Inner lead bonding

. . Bonded devices

. . Bonding methods

. . . using solders

. . . using anisotropic conductive materials

. . . using electro conductive adhesives

. . . by compression bondings

. . . by alloy bondings

. . . Gang bondings

. . . bondings per electrode

NN11

NN12

NN13

NN14

NN15

NN17

NN18

NN19

NN20

. Outer lead bondings

. . Bonded objects

. . . to wiring boards

. . . to lead-frames

. . . to the conductive layer or pins of packages

. . Bonding methods

. . . using solders

. . . using anisotropic conductive materials

. . . using conductive adhesives

NN21

NN22

NN24

. . . using photo-curing insulating resins

. . . by compression bondings

. . Cutting of films or leads; Correction of lead shapes

H01L21/60,301;21/60@T

PP00
WIRELESS BONDING APPARATUSES

PP01

PP02

PP03

PP04

PP05

PP06

PP07

PP08

PP09

. Inner lead bonding apparatuses

. . Bonding tools

. . Aligning or positioning

. . Placing tables

. . Configuration plates or trays for chips

. . Film carrier guides

. . Removing static electricity

. . detecting or removing defective chips

. . Heating parts or cooling parts

PP11

PP12

PP13

PP15

PP16

PP17

PP18

PP19

. Outer lead bonding apparatuses

. . Bonding tools

. . Aligning or positioning

. Face down bonding apparatuses

. . Bonding tools

. . Aligning or positioning

. . Configuring plates or trays for chips

. . Heating parts

H01L21/60,301;21/60@Q

QQ00
SEMICONDUCTOR CHIPS FOR WIRELESS BONDINGS

QQ01

QQ02

QQ03

QQ04

QQ05

QQ06

QQ07

QQ08

QQ09

. Bump electrodes

. . Shapes or arrangements

. . Materials

. . Methods of manufacturing

. . Substrate metallic layers for bumps

. Pad electrodes

. with electrodes on both sides of chips

. Prevention of short circuits

. Holes or marks for identification and alignment

H01L21/60,301;21/60@Q-21/60@Z

RR00
ARTS RELATING TO WIRELESS BONDINGS

RR01

RR02

RR03

RR04

RR06

RR08

RR10

. bonding a plurality of chips

. . Bondings between chips

. . Bondings of layered chips

. . bonding a plurality of chips to the same lead

. connecting the rear face of chips to leads

. Combination of wire and wireless bondings

. Heat radiations

RR12

RR14

RR16

RR17

RR18

RR19

. using lasers or infra-red rays

. Spacers for film carriers

. Housings or sealings

. . Sealing materials

. . Sealing structures

. . Sealing methods

5F044	Wire Bonding
	H01L21/447 -21/449;21/60-21/607@Z