F-Term-List

H01L21/82-21/82@Z

AA00
TYPES OF INTEGRATED CIRCUITS

AA01

AA02

AA03

AA04

AA05

AA06

AA07

AA08

AA10

. Custom integrated circuits (IC)

. . Semi-custom integrated circuits (IC)

. . . Master slices or gate arrays

. . . Reference cells or standard cells

. . . . Polycells

. . . . Building blocks

. . . PLA

. . . . FPLA

. Full wafer elements

AA11

AA13

AA15

AA17

AA20

. Multichip microcircuits

. Three-dimensional elements

. Hybrid integrated circuits

. Printed circuit board

. Other types of integrated circuits *

BB00
INTEGRATED CIRCUIT FUNCTIONS

BB01

BB02

BB03

BB04

BB05

BB06

BB07

BB09

BB10

. Digital-signal processing

. . Logic gates

. . . AND gates

. . . OR gates

. . . NAND gates

. . . NOR gates

. . . NOT or inverter gates

. . Central processing unit (CPU)

. . One-chip microcomputers

BB12

BB13

BB14

BB15

BB16

BB18

BB19

BB20

. . Memory

. . . Random-access memories (RAM)

. . . . Dynamic random-access memories (DRAM)

. . . Read-only memories (ROM)

. . Address decoders

. . Shift registers

. . Flip-flops

. . Counters or frequency dividers

BB21

BB22

BB23

BB24

BB26

BB27

BB28

BB30

. Analog-signal processing

. . Amplifiers

. . . Sense amplifiers

. . . Operational amplifiers

. . Buffers

. . . Input buffers

. . . Output buffers

. . Level conversion

BB31

BB33

BB35

BB37

BB40

. Testing

. Monitoring

. Safety

. Switching

. Other *

CC00
ELEMENTS USED

CC01

CC02

CC03

CC04

CC06

CC07

CC08

CC09

CC10

. Transistors

. . Bipolar transistors

. . . Emitter coupled logic (ECL), current-mode logic (CML) elements

. . . Integrated-injection logic (I2L) elements

. . Field-effect transistors (FET)

. . . Junction field-effect transistors (JFET)

. . . Schottky field-effect transistors (FET)

. . . Metal oxide semiconductor field-effect transistors (MOSFET) (including metal-insulator-semiconductor (MIS) field-effect transistors)

. . . . Transistors with polysilicon gates

CC12

CC13

CC14

CC15

CC16

. . . . Complementary metal-oxide semiconductors (CMOS)

. . . Specific depletion or enhancement types

. . . . Enhancement-depletion metal-oxide semiconductors (EDMOS)

. . Bipolar metal-oxide semiconductors (BiMOS)

. . . Bipolar complementary metal-oxide semiconductors (bi-CMOS)

CC21

CC22

CC23

CC25

CC26

CC30

. Diodes

. Resistors

. Capacitors

. Variants that use material other than silicon

. . Gallium arsenide (GaAs)

. Other elements used *

DD00
INTEGRATED CIRCUIT STRUCTURES OTHER THAN WIRING

DD01

DD02

DD03

DD04

DD05

DD07

DD08

DD09

DD10

. Disposition or layout of elements, cells, blocks, or the like

. . Automatic disposition or layout

. . Optimization

. . Hierarchical structures

. . Disposition or layout within unit cells or blocks

. . Sizes of elements, cells, or blocks

. . . Enlargement or reduction

. . . Element size

. . Shapes of elements, cells, or blocks

DD12

DD13

DD14

DD15

DD16

DD18

DD19

DD20

. . Direction or angles of elements, cells, or blocks

. . Number or density of elements, cells, or blocks

. . Location or coordinates of elements, cells, or blocks

. . . Symmetry

. . . . Line symmetry

. . Arrangement or pitch of elements, cells, or blocks

. . . Arrays

. . . Blocks

DD22

DD24

DD25

DD26

. . . Close-packed cells

. . Distance between elements, cells, or blocks

. . Input/output terminals of elements, cells, or blocks

. . Handling of unused elements, cells, or blocks

DD31

DD32

DD33

DD34

DD35

DD36

DD37

DD39

. Structures that involve elements, cells, or blocks for specific uses

. . Use for input and output

. . . Both input and output

. . Use for power sources

. . . Voltage sources

. . . . Generation of reference voltages

. . . Current sources

. . Testing

DD41

DD42

DD43

DD44

DD45

DD46

DD47

DD48

DD50

. Structures that involve additional elements

. . Bonding pads

. . . Pad spacing

. . . Power-source pads

. . . Unused pads

. . . Pads for testing

. . Identification marks

. . Passivation and protective films

. Other integrated circuit structures

EE00
WIRING

EE01

EE02

EE03

EE04

EE05

EE06

EE08

EE09

EE10

. Wiring patterns

. . Automatic wiring

. . Optimization of wiring

. . Application of graph theory

. . Wiring in or on unit cells or blocks

. . . Wiring in unused cells or blocks

. . Length of wiring

. . Width of wiring

. . . Width of wiring in relation to current

EE12

EE13

EE14

EE15

EE16

EE17

EE18

EE19

EE20

. . Mesh or grid wiring

. . . Grid points

. . Wiring spaces

. . Number of wires or wiring density

. . Direction or angle of wiring

. . Wiring location or coordinates

. . . Wiring symmetry

. . Wiring arrangement or spacing

. . Wiring termination

EE22

EE23

EE24

EE25

EE26

EE27

EE28

. . Multi-layer wiring

. . . Wiring of three or more layers

. . . Combinations of fixed and pass-through wiring

. . . Use of diffusion layers

. . . Vertical positional relationships

. . . Contact means

. . . Double-sided patterns

EE31

EE32

EE33

EE34

EE35

EE36

. Wiring materials

. . Metals

. . . Aluminum (Al)

. . . Refractory metals

. . . Silicides

. . Polysilicon

EE41

EE42

EE43

EE44

EE45

EE46

EE47

EE48

. Physical properties of wiring or between wires

. . Wiring resistance

. . Electrostatic capacitance

. . Inductance

. . Noise

. . . Crosstalk

. . Delay time

. . Heat generation

EE51

EE52

EE53

EE54

EE56

EE57

EE58

EE60

. Wiring for specific applications

. . Power-source or ground wiring

. . Wiring for bonding pads

. . Clock wiring

. Insulation or separation

. Temporary wiring

. Wiring sequence

. Other wiring

FF00
SWITCHING AND SELECTION

FF01

FF02

FF04

FF05

FF06

FF07

FF08

FF09

. Purpose of switching or selection

. . Switching in redundant systems

. . Characteristics or functions of switching

. . . Switching of resistance values

. . . Switching of electrostatic capacitance

. . . Switching of current or power

. . . Switching of voltage

. . . Switching of the time delay

FF12

FF13

FF14

FF15

FF16

. . Testing or monitoring

. . . Generation of test signals

. . . Self-diagnosis

. . . Checking to see if redundant systems are used

. . . Checking of product type or process

FF21

FF22

FF23

FF24

FF26

FF27

FF28

FF29

FF30

. Elements in switching or selection portions

. . Diodes

. . Transistors

. . . Field-effect transistors (FET)

. . Fuses

. . . Disconnection of fuses

. . . Connection of fuses

. . . Fuses made of specific materials

. . . . Polysilicon

FF32

FF33

FF34

FF36

. . . . Metals

. . . . . Refractory metals

. . . Specific shapes

. . Switches or electric circuits

FF41

FF42

FF43

FF44

FF45

FF46

FF47

FF48

FF49

FF50

. Methods for execution of switching or selection

. . Laser irradiation

. . . Irradiation intensity

. . Electron-beam irradiation

. . Feeding or changing of voltage or current

. . . Changing of voltage input to terminals

. . Preheating

. . Formation or change of wiring

. . . Bonding

. . Division of chips

FF52

FF60

. . Use of software or programs

. Other switching and selection

GG00
TECHNOLOGY RELATED TO MANUFACTURING PROCESSES

GG01

GG03

GG05

GG07

GG10

. Diffusion or ion implantation

. Etching

. Crystal or epitaxial growth

. Heat treatment or annealing

. Other technologies

HH00
COMPUTER-ASSOCIATED TECHNOLOGY IN DESIGN AND MANUFACTURING

HH01

HH02

HH03

HH05

HH06

HH07

HH08

HH09

HH10

. Technology related to hardware

. . Host and terminal configurations

. . Clock signals

. Technology related to software or programs

. . Computer-aided design (CAD)

. . . Interactive systems

. . Languages used

. . Simulation

. . Evaluation, inspection, testing, or monitoring

HH11

HH12

HH13

HH14

HH15

HH16

HH17

HH18

HH19

HH20

. . File structures or handling

. . Use of libraries

. Input

. Output or display

. . Graphic display

. . . Enlarged or reduced display

. . Display related to warning or monitoring

. . Help or menu display

. . Color display

. Other computer-assisted technology

5F064	DESIGN AND MANUFACTURE OF INTEGRATED CIRCUITS (IC)
	H10D89/10 -89/10@Z