F-Term-List

H01L21/68@A-Z

AA00
Subject OF TREATMENT

AA01

AA02

AA03

AA04

AA10

. Type

. . Wafer

. . Glass substrate and flat panel display

. . A chip, a pellet, and a die

. . Others [FW].

AA11

AA12

AA13

AA14

AA15

. Shape (except a circular board)

. . Rectangular substrate

. . A flexible substrate, and a film like substrate

. . Cylindrical board

. . Variants (split wafer etc.)

AA21

AA22

AA23

AA30

. Material (except single crystal Si and glass)

. . Semiconductors other than single crystal Si

. . Resin

. . Others [FW].

AA31

AA32

AA33

AA34

AA40

. Use

. . Crystalline liquid and a plasma display

. . Organic electroluminescence, electrophoresis, and FED

. . Solar battery

. . Others [FW].

BA00
TREATMENT PROCESS

BA01

BA02

BA03

BA04

BA05

. Stage film formation

. . Thermal oxidation

. . PVD (physical vapor growth and physical vacuum evaporation)

. . CVD (chemical vapor deposition and chemical vacuum deposition)

. . Wet plating

BA11

BA12

BA13

BA14

BA15

BA17

BA18

BA19

. Photolithography process

. . Resist application

. . Exposure

. . Development

. . Resist removing and ashing

. Etching step

. . Wet etching

. . Dry etching

BA21

BA22

BA23

BA24

. Doping process

. . Thermal diffusion

. . . Ion implantation

. . Annealing

BA31

BA32

BA33

BA35

BA37

BA39

. Processing process

. . Grinding

. .CMP (chemical machinery polish)

. Electrode formation process

. Washing and drying stage

. An inspection, an examination, and measuring stage

BA41

BA42

BA43

. Wafer manufacturing process

. . Cutting and slicing

. . Polish

BA51

BA52

BA53

BA54

BA60

. An assembly process (post process) and a chip process

. . Dicing

. . Pasting of tape and exfoliation

. . Bonding

. Others [FW].

BB00
ENTIRE CONFIGURATION OF PROCESSING EQUIPMENT

BB01

BB02

BB03

BB04

BB05

. Equipment or the module which accumulates multiple treatment parts

. . Accumulation in the sliding direction

. . Horizontal accumulation

. . . Radial arrangement (multi-chamber etc.)

. . . Object which connects plural carrying chambers

BB11

BB12

BB13

BB14

BB18

. Joint of multiple units of equipment or modules by a carrying path

. . Loop shape

. . . Shape of in-line

. . Branch

. It has the feature in the layout of each equipment (group).

BB21

BB22

BB23

. The feature about the flow of treatment

. . . Continuous or parallel combination of the batch-processing part and the sheet treatment part.

. . Subject matter which can perform the same treatment simultaneously in multiple treatment parts.

CA00
PURPOSE AND PROBLEM

CA01

CA02

CA03

CA04

CA05

CA06

CA07

CA08

CA09

. High quality and reliability

. . Correspondence to the adverse effect by heat

. . . Soak or constant temperature

. . Correspondence to the adverse effect by plasma

. . Prevention from electrification or static elimination

. . Equalization of treatment

. . Modification of the wafer etc. and correspondence to the curve

. . . . . Improvement in the flatness at the time of adhesion to a stage etc.

. . Breakage prevention, such as a wafer

CA12

CA13

CA14

CA15

CA16

CA17

CA18

CA19

. . Pollution control

. . . . . Subject matter for washing a container, a conveyance mechanism, etc.

. . . . . Subject matter which changes the conveyance maintenance part for every process

. . . Prevention of the elution and occurrence of pollutant from a component

. . The identification of traceability and the circulation history

. . . High availability, protraction of time between failure, and extension of life-span

. . Correspondence to a position gap of wafer etc.

. . Vibration proof

CA21

CA22

CA23

CA24

CA25

. High performance and high efficiency

. . Correspondence to enlargement of wafer etc.

. . . Correspondence to making a wafer etc. thin

. . . Correspondence to the wafer etc. of which the shape and size differ

. . Small-quantity various kinds

CA31

CA32

CA33

CA34

CA35

CA36

CA37

CA38

CA39

. Increase in efficiency and optimization

. . Productivity improvement and shortening of the lead time

. . Reduction of processes and concentration

. . Smoothing of the load and confusion avoidance

. . The optimal path or detour at the time of conveyance

. . Other schedule controlling and production control

. . Simplification of the device structure

. . Miniaturization of equipment

. . Space-saving and footprint reduction

CA41

CA42

CA43

CA44

CA45

CA46

CA47

CA48

CA49

. Convenience

. . Automation and mechanization

. . Correspondence to layout change

. . Correspondence to the change of the process and the system.

. . Improvement in maintainability

. . . The object which makes the attachment and detachment or the exchange of components easy

. . Making assembly operation easy

. . . Modularization

. . Improvement in operativity

CA51

CA52

CA53

CA54

CA55

CA56

CA59

. Safety and monitoring

. . A worker's safety

. . Prevention of malfunction and safety management

. . Characteristic control and recovery methods at the time of error occurrence

. . Interference avoiding

. . Sorting or removal of inferior goods

. Countermeasures against calamities

CA61

CA62

CA63

CA67

CA68

CA69

CA70

. Environment

. . Energy saving and saving resources

. . Reuse and recycling

. The problem based on the use of the chip (it is also covered by AA40)

. The problem of electrostatic adsorption (also covered by EB22-28)

. The problem of a sensor (it is also covered by KA61-68)

. Other purposes and problems [FW]

H01L21/68@A-C

DA00
FORM OF CONVEYANCE

DA01

DA02

DA03

DA05

DA07

DA08

DA09

. Conveyed object

. . Glass substrate and a flat panel display

. . A chip, a pellet, a die

. . Storing container

. . Substrate for non-products (wafer form fixture etc.)

. . . Dummy wafer

. . . A mask and a reticle

DA12

DA13

DA14

DA16

DA20

. . Reinforced substrate (wall-thickness outer circumference wafer, etc.)

. . . Holding with a ring frame and adhesive tape

. . . Sticking a tape or a thin strip

. . Reinforcement components of a substrate (ring frame etc.)

. . Others (inserting paper, etc.) [FW]

DA21

DA22

DA23

DA24

DA25

. Conveyance place

. . Conveyance within a process (treatment part <=> treatment part or the storage part)

. . Conveyance between processes (storage part <=> storage part)

. . Conveyance between floors

. . Interplant conveyance

DA32

DA33

DA34

DA35

DA36

DA37

. . Delivery by a container <=> carrying means

. . . Delivery in the adhesion maintenance part at the time of carrying means <=> processing

. . Delivery by a carrying means <=> carrying means

. . . Direct delivery between carrying means

. . . Relay parts (an installation stand etc.) intervene.

. . Delivery by a carrying means <=> storage part

DA41

DA42

DA43

. Number of sheets or number of carried objects

. . Single wafer processing for every one sheet (piece)

. . Multiple sheets (pieces) package and batch processing

DA51

DA52

DA53

DA54

DA55

. Posture of a carried object

. . Vertical state

. . . Objects of which taking in and out from and to the container is vertical

. . Reverse state or downward state

. . Inclination state

DA61

DA62

DA63

DA64

DA65

DA66

DA67

DA68

. Conveying operation

. . Change of posture (horizontal <=> vertical, the surface and rear, etc.)

. . . Rotation and reversion as a whole container

. . Mutual change of the gaps (pitch) of the carried objects

. . . Change in the state where it held by the carrying means

. . The container is made to go up and down, and one sheet is taken in and out at a time in order.

. . Mutual superposition and exfoliation of the wafers, etc.

. . Characteristic method for the treatment part to replace.

H01L21/68@A

DB00
CONVEYING MACHINE OR THE MEANS (1)

DB01

DB02

DB03

DB04

DB05

DB06

. Holding part

. . Fork

. . . Subject matter equipped with a plurality of forks

. . . . Subject matter which can move each fork independently

. . . Characteristic shape of the part of holding a wafer, etc.

. . . . Held selectively by a nail, a projection, etc.

DB12

DB13

DB14

DB15

DB16

. . Subject matter which is depended on grip or pinching

. . . . . Feature in the structure of the contact part with the held object.

. . . Feature in the opening-and-closing mechanism of a nail and a finger

. . . Grip of the edge face

. . . Grip of the rear surface

DB22

DB23

DB24

DB25

DB27

DB29

. . Holding by vacuum absorption

. . . Holding by electrostatic adsorption

. . Holding by adhesion

. . . Feature in the structure of the adsorption face or the adhesive face

. . Bernoulli chuck

. . Hook

DB32

DB34

DB36

DB37

. . Feature in the construction material of the holding part

. . Feature in the production method or processing method of the holding part.

. . Multiple switchable retention parts

. . . Switching of the retention part before and after treatment

DB42

DB43

DB44

DB45

. . Subject matter which has united the additional function with conveying machine

. . . . . Sensor (see KA and KB)

. . . Heating or cooling function

. . . Positioning mechanism of carried objects by type fitting

DB51

DB52

DB53

DB54

DB57

DB58

. Arm part

. . Level multi-joint objects

. . Vertical multi-joint objects

. . Movement slide

. . Subject matter which has a plurality of arms

. . . Subject matter which can move each arm independently

DB61

DB62

DB63

DB64

DB65

. Operation of the holding part or the whole arm part

. . Subject matter which goes up and down in the sliding direction

. . . Subject matter which goes up and down along with column

. . . . . Subject matter which goes up and down with the elastic mechanism (telescopic, etc.).

. . . Subject matter which goes up and down by the link mechanism

DB72

DB73

DB76

DB77

DB78

. . Subject matter which moves horizontally

. . . Horizontal migration by the whole rise-and-fall mechanism

. . Subject matter which rotates in the level surface

. . . Rotating with the whole rise-and-fall mechanism

. . . Going up and down in a rotation mechanism

DB81

DB82

DB83

DB86

DB87

DB88

. Drive mechanism

. . Link mechanism

. . . Pantograph mechanisms (frog leg etc.)

. . Direct motion mechanism

. . . Linear motor drive

. . . Ball screw

DB92

DB93

DB95

DB97

DB99

. . Pulley & belt

. . Gear

. . Multiplex shaft drive

. . Others [FW].

. The feature in wiring, piping, or conduit

DC00
THIS PLACE COVERS A CONVEYING MACHINE OR A MEDIUM (2)

DC01

DC02

DC03

DC04

DC05

DC06

DC09

. Truck

. . Automatic guided vehicle

. . . Subject matter with a ground traveling track (RGV etc.)

. . . Subject matter which has no ground traveling track (AGV etc.)

. . . Head-lining run monorail type (OHS etc.)

. . . . . Ceiling run suspended patterns (OHT, etc.)

. . A hand-pushed truck or a handcart

DC11

DC12

DC13

DC14

DC15

DC16

DC17

DC18

DC19

. Floating conveyance

. . Floating by using jet

. . . The feature in the arrangement and structure of the exhaust nozzle

. . . . Subject matter which carries out parallel translation by jet

. . . . Subject matter having a suction hole

. . . . Subject matter which performs a turn or a posture change

. . Floating by using supersonic wave

. . Floating by using electromagnetism

. . The feature for holding carried objects and sending means

DC21

DC22

DC23

DC26

DC28

DC30

. Conveyor

. . Roller conveyor

. . Belt conveyer

. Vertical conveying machines (an elevator, a lift, etc.)

. Hand tools (a pincette, a harness, etc. held by hand)

. Others [FW]

H01l21/68A-C

DD00
CONVEYANCE CONTROL

DD01

DD02

DD03

DD10

. Conveying machine used as a controlled system

. . Automatic guided vehicle

. . Robot

. . Others [FW]

DD11

DD12

DD13

DD14

DD16

DD17

DD18

DD19

. Connection relation between the control parts

. . The feature in centralized control

. . . . . Subject matter which carries out coordination control of multiple conveying machines

. . . . Subject matter which has relation of master and servant between conveying machines

. . The feature in decentralized control

. . . Individual control of multiple conveying machines

. . . Control for every module

. . . Subject matter which communicates between controllers

DD21

DD22

DD23

DD24

DD25

DD26

DD27

DD28

DD29

DD30

. Conveyance control in a specific scene

. . At the time of abnormalities

. . . Traffic congestion

. . . Deadlock

. . . At the time of maintenance

. . At the initial starting time and at the completion or pilot-run time

. . At the time of schedule change or interruption

. . At the time of layout change

. . At the time of supply to the processing equipment or delivery

. . Others [FW]

DD31

DD32

DD33

DD34

DD35

. Input of the control part

. . The design finished beforehand

. . . A program and sequence

. . . Production planning, the schedule and the time chart

. . . A map and map information

DD42

DD43

DD44

DD45

DD46

DD47

DD49

. . Real time

. . . Sensor information (it is also covered by KB58)

. . . Abnormal information or alarm information

. . . Operation by a worker

. . . A vacancy or congestion situation

. . . Trigger from other controllers

. . The history or value of the past

DD52

DD53

DD54

DD56

DD57

DD59

. . Information about the carried object

. . . A recipe or quality

. . . Form, quantity, or lot size

. . Information about the conveying machine

. . . The target transportation route or target position

. . Information about the container

DD62

DD63

DD65

DD67

DD69

DD70

. . Information about the processing equipment

. . . Information about the layout of the equipment

. . . Information about the storage

. . Information about atmosphere

. . An order received or mechanism

. . Others [FW]

DD71

DD72

DD73

DD74

DD75

DD76

DD78

DD79

. Output of the control part

. . Distance or position

. . . Conveyance destination or conveyance source of the carried object

. . . The transportation route, migration locus, or alternative route

. . . The distance or the gap between the carried objects under conveyance

. . . Position gap compensation of the carried object

. . Velocity or acceleration

. . . Transportation speed

DD82

DD83

DD84

DD85

DD86

DD88

DD89

. . Time, order or timing

. . . The conveyance order or processing order

. . . Stand by time

. . . Timing of the taking-out and carrying-in to the treatment part

. . . Timing of opening and closing of the shutter etc.

. . Quantity

. . . Quantity of the carried objects

DD92

DD93

DD94

DD95

DD99

. . Others [FW]

. . . The orientation or the posture of the carried object

. . . Outputs, such as an abnormal stop or alarm

. . . Allotment, selection, or calling-in of carrying means

. . The feature in the operation method of the target command value

H01L21/68@A-Z

EA00
ADHESION MAINTENANCE BY A STAGE (1)

EA01

EA02

EA03

EA04

EA05

EA06

EA07

EA10

. Use of a stage

. . . For precise positioning and alignment

. . For plasma treatment

. . For heat treatment

. . . For processing

. . . For wet treatment

. . For sticking and removal of a tape etc.

. . Others [FW]

EA11

EA12

EA13

EA14

EA15

EA16

EA17

EA18

EA19

. Structure of a stage

. . A gate type and gantry type

. . Concrete composition about the stand of the stage

. . Concrete composition about the actuator

. . Concrete composition about the guide

. . Inhibition or removal of vibration of slight movement table

. . . Subject matter which serves as the taking-out and carrying-in parts into and out of the treatment room

. . Feature in attachment to the processor body

. . Connection of multiple stages

EA21

EA22

EA23

EA24

EA25

EA27

. Operation of a stage

. . Advancing-side-by-side movement to a horizontal direction (XY)

. . Advancing-side-by-side movement in the perpendicular direction (Z)

. . Rotation of the circumference of the perpendicular axis (theta)

. . Tilt to the level surface

. . Subject matter of overlapping the slight movement stage and the rough movement stage

H01L21/68@N-R

EB00
ADHESION HOLDING BY A STAGE (2)

EB01

EB02

EB03

EB04

EB05

. Vacuum absorption

. . The feature in the arrangement or structure of an adsorption hole or an adsorption groove

. . Subject matter using porous material

. . The feature in the suction source, or the passage to the suction source

. . Plural suction parts can be detached independently mutually.

EB11

EB12

EB13

EB14

EB15

EB16

EB17

EB18

EB19

. Electrostatic adsorption

. . Adsorption by Johnsen-Rahbek effect

. . Adsorption by gradient force

. . Concrete composition of the electrode part

. . . The feature in the form and arrangement of the electrode

. . . Subject matter equipped with a plasma electrode

. . . Concrete composition of the power source and the electric supply part

. . Concrete composition of the dielectric layer

. . . Concrete numerical value range of the volume resistivity

EB22

EB23

EB24

EB25

EB26

EB27

EB28

. . The problem of electrostatic adsorption (it is also covered by CA68)

. . . Improvement in adsorption power

. . . Removal of the residual adsorption power

. . . Improvement in environment-proof

. . . . . Improvement in the elevated-temperature characteristics

. . . Self-bias is taken into consideration.

. . . Uniform adsorption power

EB31

EB32

EB33

EB34

EB35

EB36

EB37

EB38

. A clamp and grip

. . Grip of a part of peripheries, such as wafer

. . Grip of all the circumferences, such as a wafer

. . How to give the thrust to the wafer etc.

. . . Press the end face by opening and closing of presser-foot components, such as a claw.

. . . Subject matter presses the surface and the rear with the installation part and the presser-foot component.

. . . . . The feature in the development method of thrust or the mechanism

. . . . Subject matter which uses elastic bodies (spring etc.)

EB41

EB42

EB43

EB44

EB46

. Non-contact support

. . Subject matter which uses jet (Bernoulli chuck)

. . . The feature in the arrangement and structure of the exhaust nozzle

. . Subject matter which uses a supersonic wave

. Adhesion

EB51

EB52

EB53

EB54

EB55

EB56

EB57

EB58

. The concrete configuration of the contact surface with a wafer etc.

. . The shape of a convex

. . Concave

. . . Unevenness and projection (limitation of the contact surface)

. . . Make the rear faces, such as a wafer, exposed and held

. . Subject matter of which only the contact surface is made of different construction material

. . Contact with only the outer peripheral parts, such as a wafer

. . Contact surface with elasticity

EB61

EB62

EB63

EB64

EB66

EB67

EB68

. Subject matter of which the adhesion buildup areas are other than level facing up

. . Vertical

. . Facing down

. . Inclination

. Subject matter which carries out package holding of multiple wafers

. . Subject matter which is arranged on the level surface

. . . Subject matter which is put in order perpendicularly

EB71

EB72

EB73

EB75

EB78

EB79

. Release of the fixing force and secession from the buildup area

. . Lift pin

. . Gas injection

. The conveyable type object which can be used as a transportation vessel

. Specification of the construction material of a stage

. The feature in the production method of the stage and the processing method.

EB81

EB82

EB84

EB85

EB87

EB89

. Heating mechanism

. Cooling mechanism

. Supply of the heat transfer gas to the gap with a wafer etc.

. . Subject matter which has a slot for gaseous diffusion

. Subject matter which has a heat insulation or heat reflective means

. Supply of fluids other than for treatment, holding, secession, and heat transfer

H01L21/68@N

EC00
ADHESION HOLDING BY OTHERS

EC01

EC02

EC03

EC05

EC08

. The boat for heat treatment

. . Vertical mold boat

. . Width type boat

. . Holding and conveyance of the boat

. . The feature in the production method and the assembly procedure

EC12

EC13

EC14

EC15

EC17

EC18

. . Concrete composition about the configuration

. . . The feature in the form of a slot (contact portion with a wafer)

. . . . Inclined support of the wafer

. . . Lay a wafer in the boat indirectly.

. . The feature in the material, surface roughness, coating, etc.

. . . The feature in the construction material of the contact portion, surface roughness, coating, etc.

EC21

EC22

EC23

EC24

. Immersion treatment to the liquid tub

. . Immersion in the state where the wafer etc. are held in the container (GA27 is also assigned).

. . Immersion in the state where the wafer etc. are directly held in the retention part

. . The feature in the structure for the drainer procedure and the drainer

EC31

EC32

EC33

EC34

EC35

EC36

EC37

. Sticking and removing of a tape, a thin strip, etc.

. . A tape and a film

. . . Dicing tape

. . . Surface protection tape

. . . A die-bonding tape and die attaching film

. . . Resist film

. . . Release tape

EC42

EC43

EC44

. . Thin strip

. . . Support plate for reinforcement

. . . Ring frame

EC52

EC53

EC54

EC55

. . Component members, such as a tape and a thin strip

. . . Subject matter of which the construction material of the base material is specified.

. . . Subject matter of which the construction material of the adhesive-bond layer is specified

. . . Multilayer structure

EC62

EC63

EC64

EC65

EC66

EC67

EC68

EC69

. . Pasting

. . . Pressing means

. . . For heating

. . . Inside of the decompressed atmosphere

. . . The feature in the pasting angle and the direction of pasting

. . . Subject matter which performs attaching directly

. . . Cutting of a tape

. . . The sending part of the tape

EC72

EC73

EC74

EC75

EC76

EC77

. . Exfoliation

. . . Adhesive power fall treatment

. . . Pressing a chip from below

. . . Expanding of a tape

. . . Pull and exfoliate with a release tape.

. . . The feature in the peel angle and the exfoliation direction

H01L21/68A-Z

FA00
POSITIONING AND ALIGNMENT

FA01

FA02

FA03

FA10

. Subject of positioning (except a substrate)

. . Housing

. . A chip, a pellet, a die

. . Others [FW]

FA11

FA12

FA13

FA14

FA15

FA17

FA19

. Positioning means

. . Subject matter which moves chisels, such as a wafer

. . . Pressing mold

. . . A taper, a level difference, gage pin

. . . Rotation with a roller

. . Subject matter which moves the whole installation parts, such as . slight movement stage

. . Subject matter which moves the container in which the wafer etc. are stored

FA22

FA23

FA24

FA25

FA26

. . Features in the posture at the time of positioning (inclined position etc.)

. . Subject matter which positions in more than 2 steps

. . Subject matter which positions multiple sheets simultaneously

. . Subject matter which uses a jig

. . Subject matter which controls the carrying means and moves a wafer etc.

FA31

FA32

FA33

FA34

FA35

FA37

FA39

. Purpose

. . Subject matter which doubles a center

. . Subject matter which matches the direction and orientation

. . . Subject matter which doubles an orientation flat

. . . Subject matter which doubles a notch

. . Other positioning to a wafer etc.

. . Subject matter which inclines and doubles flatness

H01L21/68@T-Z

GA00
CONTAINER

GA01

GA02

GA03

GA05

GA09

. The type of container

. . Open type container

. . . . . A carrier and a cassette (open cassette etc.)

. . . A tray and a palette

. . Packed bodies (the housing for transportation, the bag for hermetic seal, etc.)

GA12

GA13

GA14

GA15

GA16

GA18

GA19

. . Closed mold container

. . . A carrier and a cassette

. . . . FOUP

. . . . . . . FOSB

. . . . . . . MAC (multi-application carrier)

. . . The case to store each carrier

. . . . SMIF pod

GA21

GA22

GA23

GA24

GA26

GA27

GA30

. Use of a container

. . A glass substrate and a flat panel display

. . For a chip, a pellet and a die

. . For a mask, a reticle and a pellicles

. . Used also during processing

. . . . . Subject matter used for immersion treatment (also assigned to EC22).

. . . Others [FW]

GA31

GA32

GA33

. The maximum accommodation number of sheets

. . . For 1 sheet (including containers to be stacked)

. . . A few sheets (two to ten sheets)

GA41

GA42

GA43

GA44

GA45

. Storage posture in the container

. . Subject matter in which a plurality of sheets are arranged on the same horizontal plane.

. . Vertical posture

. . Inclined posture

. . Vertical

GA51

GA52

GA53

GA54

GA55

. Structure of a container

. . Material

. . . Resin (whose material is specified)

. . . . Fillers, fillers, additives are identified.

. . . . . . . Subject matter with coating layer.

GA62

GA63

GA64

GA65

GA66

GA67

GA68

GA69

. . Structure inside the package body

. . . Support the end in a support slot.

. . . . . . . Inclined support

. . . Wire support on the undersurface.

. . . Placed in a recess

. . . Surfacing object which carries out non-contact support

. . . Subject matter with securing and holding mechanism

. . . . . Subject matter with retainer and shock absorbing structure

GA72

GA73

GA74

GA75

GA76

GA77

. . Structure of the outside of the package body

. . . Retention parts for conveying machines (robot flange etc.)

. . . . . Retention parts for workers (manual handle etc.)

. . . . . Guidance parts at the time of conveyance (side rail etc.)

. . . . . Positioning parts (bottom plate etc.)

. . . Pile part of containers

GA82

GA83

GA84

GA85

GA87

GA88

. . Structure of a lid

. . . Features (latch mechanism etc.) in the engagement part of the lid and the main part.

. . . . . The features (gasket etc.) in the fitting part of the lid and the main part

. . . The feature in the retainer prepared inside the lid.

. . . Subject matter which forms a lid in the top face

. . . Subject matter which forms a lid on the side and front faces

GA92

GA94

GA99

. . . Airtight structure (Subject matter which has a ventilation function is included)

. . Structure for running-out prevention of a housed article

. . Clamping prevention clamp, spacer and cushion

H01L21/68@T-V

GB00
STORAGE

GB01

GB02

GB03

GB04

. Storage subject

. . Housing

. . Subject matter which keeps a processing object as it is

. . Subject matters other than processing objects are also kept.

GB11

GB12

GB13

GB14

. Storage place

. . The inside of the processing equipment and the shelf formed in one with the processing equipment

. . Momentary stay part and buffer which are formed in the carrying path within a process

. . Automatic warehouse and stocker linked to the carrying path between processes

GB21

GB22

GB23

GB24

GB25

GB27

GB28

GB29

. Configuration of a storage means

. . Feature in the storage rack (a buffer stage is also included).

. . . . . Storage rack rotates.

. . . Storage rack goes up and down.

. . . Immobilization with a storage rack and a storage subject and positioning means

. . Subject matter which has a stacker crane

. . The feature in conveyance to the storage rack

. . Subject matter which prepared the additional function in the storage part

H01L21/68@A-Z

HA00
TECHNOLOGY RELEVANT TO OTHER CONVEYANCES

HA01

HA02

HA04

HA05

HA06

HA07

HA08

HA09

. Loading parts, such as a wafer, to the equipment

. . Feature in the conveyance system of the loading part

. . Feature in the charge of a container (carrier part) to the equipment

. . . Feature in the arrangement (a position, a direction, etc.) of a container

. . . Feature in immobilization with the container and equipment

. . . Delivery by worker's hands.

. . . Subject matter equipped with a stand which temporarily appears frequently at the time of charge

. . . Subject matter equipped with a means to convey from a conveying machine

HA12

HA13

HA14

HA15

. . A load lock chamber, a load lock chamber and a preliminary vacuum chamber

. . . Subject matter equipped with both the object for loading, and the object for unloading

. . . Subject matter equipped with the buffer inside

. . . Subject matter equipped with the manipulator inside

HA21

HA22

HA23

HA24

HA25

HA28

HA29

. Chamber

. . The feature to the structure of the chamber itself

. . The feature in the connection part between chambers

. . The feature in the arrangement of an internal treatment means and a carrying means

. . Subject matter which prepared the additional function in chamber

. A gate and a shutter

. . The feature in the mechanism which opens and closes the lid of a box-like a container

HA31

HA32

HA33

HA35

HA36

HA37

. Interface part between equipment

. . Mechanical interface

. . The data and the control signal which are transmitted and received at the time of delivery

. . Processing-equipment <=> conveying machine

. . Conveying machine <=> conveying machine

. . Storage equipment <=> conveying machine

HA41

HA42

HA43

HA44

. User interface

. . Surveillance monitor

. . Alarm

. . . Command input operation part

JA00
ATMOSPHERE MANAGEMENT

JA01

JA02

JA03

JA04

JA05

JA06

JA07

JA08

JA09

JA10

. The place which manages atmosphere

. . Inside of a truck

. . Inside of a manipulator

. . The inside of a container (also covered by GA92)

. . Storage part

. . Conveyance tunnel and a clean tunnel part

. . Gate and shutter parts

. . Conveying room and a transfer chamber

. . A load lock chamber, a load lock chamber and a preliminary vacuum chamber

. . Others [FW]

JA11

JA12

JA13

JA14

JA15

JA16

JA20

. Object to manage

. . Pressure

. . Air capacity, wind pressure, wind direction

. . Temperature

. . Humidity

. . Dust

. . Others [FW]

JA21

JA22

JA23

JA24

JA25

JA26

JA27

JA28

JA29

. Management tool

. . . Protection against dust and removal of dust

. . . Suction

. . . Blowing away, ventilation or purge gas

. . . Subject matter which makes one space positive pressure

. . . Dustproof covering and isolation of the dust source

. . Formation, introduction, or the passage of air

. . . Dust rolling-up prevention (downflow etc.)

. . . . . Air curtain

JA32

JA33

JA34

JA35

JA36

JA40

. . Concrete configuration about a fan or a filter

. . Concrete composition in the boot configuration

. . Timing of pressure control and gate valve opening and closing

. . Substitution of gas

. . Static elimination

. . Others [FW]

KA00
DETECTION (1)

KA01

KA02

KA03

KA04

KA05

KA06

KA10

. Subject of detection (except a substrate)

. . Carrying means

. . Adhesion holding mechanism

. . Chamber

. . Housing

. . Atmosphere

. . Others [FW]

KA11

KA12

KA13

KA14

KA15

KA16

KA17

. Means (sensor)

. . Optical sensor

. . . Line sensor

. . . An area sensor and a camera

. . . Transmission detection

. . . Reflected light detection

. . . The feature to formation of visual leg

KA22

KA23

KA24

KA25

KA27

KA28

. . Pressure sensor

. . Temperature sensor

. . Humidity sensor

. . Flow rate sensor

. . Acceleration sensor

. . Velocity sensor

KA32

KA33

KA34

KA35

KA37

KA38

KA40

. . A strain gage and a load cell

. . Ultrasonic sensor

. . Capacitance sensor

. . Magnetometric sensor

. . Timer

. . Manually-operated switch

. . Others [FW]

KA41

KA42

KA43

KA44

KA45

KA47

KA48

KA49

. Form of detection

. . The detecting object and the sensor move relatively at the time of detection.

. . . The sensor moves.

. . . Detecting objects, such as a wafer, move.

. . . . Detecting objects, such as a wafer, rotate.

. . . Install multiple sensors to one detecting object.

. . Multiple objects to be detected are detected at once by multiple sensors.

. . Multiple objects to be detected are detected at once by one sensor.

KA51

KA52

KA53

KA54

KA55

KA56

KA57

KA60

. Setting position of a sensor

. . . A fork and hand

. . Truck

. . Stage and adhesion holding mechanism

. . A chamber and a gate valve

. . Housing

. . Substrate

. . Others [FW]

KA61

KA62

KA63

KA64

KA65

KA66

KA67

KA68

KA70

. Problem of a sensor

. . Prevention from erroneous detection

. . Improvement in sensitivity and precision improvement

. . Damage prevention

. . Environment-proof nature

. . . Heat resistance

. . . Use in vacuum

. . . Water resistance and water proof

. . Others [FW]

KA71

KA72

KA73

. Detection signal

. . The concrete configuration about the treatment of detection signal

. . The concrete configuration about the transfer of detection signal

H01L21/68A-V

KB00
DETECTION (2)

KB01

KB02

KB03

KB04

KB05

KB06

KB07

KB08

KB09

. Information to detect

. . Information of the form

. . . Orientation flat

. . . Notch

. . . Edge and edge face

. . . Characteristic pattern

. . . . Alignment mark

. . . . Scribe line

. . . A global image, appearance and size

KB12

KB13

KB14

KB15

KB16

KB17

. . Information on the size, including distance, thickness, angle, etc.

. . Material, and the quality of the material

. . Rear surface

. . Number of sheets and the number of units

. . Mass

. . Vibration, sound

KB22

KB23

KB24

KB30

. . Identification information (a bar code, memory information, etc.)

. . . . . Subject matter attached to the substrate itself, such as a wafer

. . . . . Subject matter attached to the containers, such as a cassette

. . Others [FW]

KB31

KB32

KB33

KB35

KB36

KB38

. The purpose of detection

. . The existence of existence and the existence position (Address)

. . . Mapping of slots, such as a carrier, and a storage wafer

. . The types of boards (the size of a substrate, a thick film, form, etc.)

. . Types of containers

. . Individual identification of a substrate and a container (KB22-24 are also assigned)

KB42

KB43

KB44

KB45

KB46

KB48

KB49

. . Curvature, modification and bending of a board

. . Absorption state

. . Degree of contamination of a substrate, equipment, or atmosphere

. . The abnormalities and degradation

. . . . . Defect of a substrate processing state

. . Contact and interference

. . Obstacle

KB52

KB53

KB54

KB55

KB56

KB58

KB60

. . The position gaps within the container (inclining projection etc.)

. . . Gap of the adherence maintenance position

. . . Gap of the orientation and the direction

. . . Gap of the center

. . . The gap of the height and inclination

. . . Subject matter used for conveyance control (also DD43 is assigned)

. . Others [FW]

5F131	CONTAINER, CONVEYANCE, ADHERENCE, POSITIONING, OF WAFER
	H01L21/68 -21/68@Z