F-Term-List

H01L23/50-23/50@Z

AA00
PURPOSE OR EFFECT *

AA01

AA02

AA03

AA04

AA05

AA06

AA07

AA08

AA09

AA10

. Miniaturisation

. Stacking or interconnection of elements

. Heat radiation

. Improvement of moisture resistance e.g. improvement of adhesion to resins

. Prevention of lead detachment

. Absorption of stress caused by differences in thermal expansion between resins and leads

. Prevention of resin cracks

. Protection of external leads e.g. moulds

. Removal or prevention of burrs or metal burrs

. Increasing the number of pins

AA11

AA12

AA13

AA15

AA16

AA18

AA19

AA20

. Prevention of curved lead frames

. Detection or correction of lead-frame bending

. Facilitating attachment of leads on printed circuit boards

. Prevention of solder bridges

. Prevention of solder flows

. Prevention of unwanted contact e.g. prevention of contact with bonding wires or internal leads

. Inspection e.g. inspection during manufacturing

. Lead frames for clocks

AB00
TYPE OF ELEMENT *

AB01

AB02

AB03

AB04

AB07

AB08

AB09

AB10

. Single in-line type

. Dual in-line type

. Quad in-line type i.e. those projecting leads in four sides

. Leadless-type e.g. chip carriers

. Pin-grid arrays (PGA)

. Ceramic-type

. Cylindrical integrated circuits (IC)

. Transistors

BA00
LEAD FRAME *

BA01

BA02

BA03

BA04

BA05

BA06

BA08

BA09

BA10

. Two-row lead frames

. . with n rows and m columns types i.e. multi-row and multi-column lead frames

. characterised by lead patterns

. . Sharing external leads on lead frames

. Dummy leads including empty leads

. Element support leads

. Formation of easy to cut or bend sections

. Formation of identification symbols on frames

. Positioning holes e.g. pilot holes

BB00
INTERNAL LEAD, I.E. LEAD INSIDE RESIN MOULD *

BB01

BB02

BB03

BB04

BB05

BB06

BB07

BB08

BB10

. characterised by shapes of internal lead tips

. . Internal lead tips formed in zigzag shape

. . Internal lead tips branched on the same plane

. . Formation of unevenness or holes on internal lead tips

. . Formation of internal lead tips in square bracket shapes or C shapes

. . . Tips branched into three parts

. . . Adhering to both sides of element substrates

. . Internal lead tips being commonly supported

. Plating on internal lead tips

BB11

BB12

BB13

BB14

BB15

BB16

BB18

BB19

BB20

. Leads used as both internal leads and tab leads

. Brazing i.e. characterised by brazing components *

. Connection parts fixed with glass e.g. ceramic-types

. Formation of protective material for internal lead connection parts

. characterised by shapes structure or arrangement of electrode pads for internal lead connection

. Internal lead tips concentrated on two short sides of chips

. Connection of internal leads by welding

. Connection of internal leads by thermo-compression bonding

. characterised by brazing materials for attaching PGA pin leads *

BC00
EXTERNAL LEAD *

BC01

BC02

BC03

BC04

BC05

BC06

BC07

BC08

BC09

. Attaching external leads to printed circuit boards

. . Positioning

. . . different in lead lengths e.g. sequential differences

. . . different in lead widths

. . . Formation of projections in the middle of leads

. . Zigzag leads i.e. horizontally or vertically

. . characterised by attaching positions or shapes of external leads of printed circuit boards

. . J-leads

. . Identification terminals i.e. external terminals

BC11

BC12

BC13

BC14

BC15

BC16

BC17

BC18

BC20

. External leads and sealants

. . Leads projecting on bottoms only

. . Leads projecting on sides and bottoms

. . Leads projecting on tops and bottoms

. . Notch formation in sealants

. . . Periodically spaced notches

. . Leads projecting from sides where leads are not normally projected

. . External leads where sections extending to other sides are formed

. Formation of recesses on sides or upper and lower surfaces for connecting elements

BD00
TAB LEAD *

BD01

BD02

BD03

BD04

BD05

BD06

BD08

BD10

. One lead supporting tabs i.e. cantilever

. Two leads supporting tabs

. . Two tab leads not being straight

. Three leads supporting tabs

. Four or more leads supporting tabs

. Tabs and tab leads having the same width

. Tab lead supported by means other than external frames

. Coining including two or more steps

BE00
TAB *

BE01

BE02

BE03

BE04

BE05

BE06

BE07

BE08

BE09

BE10

. Tabs with uneven thickness

. . formed on front and back surfaces e.g. recesses through-holes or unevenness surfaces

. . Projections for holding pellets

. Thick tabs e.g. tabs used as heat radiation plates

. Tabs other than rectangle in shapes

. Divided tabs e.g. islands

. forming projections outward tabs

. Tabs formed of members different from tab leads

. Chips facing downward

. without tabs on insulating films

CA00
HEAT RADIATION *

CA01

CA02

CA03

CA04

CA05

CA06

CA07

CA08

CA10

. Heat radiation plates e.g. radiators

. . Heat radiation plates contacting with tabs

. . Chips fixed to heat radiation plates

. . Heat radiation plates also used as attaching plates for elements

. . Heat radiation plates provided in moulds or resin sealing

. . Heat radiation fins

. used as both heat radiation plates and tab leads

. Materials e.g. resins or non-metals

. Folded lead frames

CB00
STACKING OR INTERCONNECTION *

CB01

CB02

CB03

CB04

CB05

CB06

CB07

CB08

. Deformation of leads for connection to other components e.g. notches

. . for interconnection of integrated circuits (IC)

. Formation of recesses on sides or upper and lower surfaces for connecting elements

. projecting leads laterally or upwardly

. projecting leads upwardly or downwardly

. Lead formation on both sides through insulations

. . Leads with three or more layers

. Two or more pellet substrates i.e. fixed plates

CC00
SUPPORT OF A PLURALITY OF LEADS BY INSULATION *

CC01

CC02

CC03

CC04

CC05

CC06

CC07

CC08

CC09

CC10

. Objects to be supported

. . Support of chips or internal leads

. . Internal leads only i.e. inside moulds

. . . forming a part of leads only

. . External leads only i.e. outside moulds

. Support materials

. . Resins

. . Heat-resistant insulations e.g. tapes

. . Insulating boards including insulating boards adhered to metal plates

. Devices for adhering tapes

CD00
CIRCUIT CHARACTERISTIC *

CD01

CD02

CD03

CD04

CD06

CD07

CD08

CD10

. Terminal arrangement

. . Symmetrical terminal arrangement

. . characterised by positional relationship of ground (GND) terminals with other terminals

. . Arrangement of PGA terminals

. Signal connection lines or terminals for diagnosis

. Inspection electrodes corresponding to external leads on a one-to-one basis

. Conductive short-circuiting materials for protection of elements e.g. shield materials

. Circuit components other than pellets e.g. capacitors

DA00
MANUFACTURE *

DA01

DA02

DA05

DA07

. with coherent formation processes

. . Separation into elements after characteristic inspection

. Combination of a plurality of components

. Stacked lead frames

DA11

DA12

DA13

DA14

DA15

DA16

DA17

DA18

DA20

. Formation of lead frames by pressing

. . Formation of patterns asymmetrical in relation to lead end faces

. . Plating before pressing

. . Forming by a plurality of times of pressing

. . Formation of internal and external leads in separate processes

. Photo-etching

. . Cross-sections of leads

. . Shapes of internal leads

. Welding

DB00
FORMING, CUTTING, SHAPING, OR CORRECTING *

DB01

DB02

DB03

DB04

DB05

DB06

DB07

DB09

DB10

. Devices or methods for forming leads

. . including two or more processes

. . including movement other than linear movement

. . equipped with rollers or rotary bodies

. . . with two or more rollers

. . including both forming or cutting processes

. . Use of jet flows

. Jigs for inspection

. . Methods or jigs for detecting or correcting bent of leads

DC00
PLATING *

DC01

DC02

DC03

DC04

DC05

DC06

DC07

DC09

DC10

. Plating devices

. . Masks

. . . Elastic masks

. . Plating jigs

. . . Nozzles or jet openings

. . Plating tanks or plating conditions

. . Coherent plating processes

. Cladding including application of metal foils or tapes

. Plating methods other than electro-plating

DC11

DC12

DC13

DC14

DC15

DC16

DC17

DC18

DC19

DC20

. Plating areas e.g. full-surface plating

. . External leads only

. . Bonding areas e.g. internal lead tips

. . Tabs

. . Bonding areas and tabs

. Metals used for plating *

. . Noble metals e.g. silver (Ag) or gold (Au)

. . Plating with two or more layers *

. . . Plating with three or more layers *

. characterised by thickness (FW: Atomic symbol and thickness thereof (micrometres)) *

DD00
SOLDERING *

DD01

DD02

DD03

DD04

DD05

DD06

DD07

DD08

DD09

DD10

. Devices or methods for soldering

. . Holding devices for pre-soldering

. . characterised by soldering tanks

. . . Reflow soldering devices

. . . Immersion in soldering tanks

. . Holding solder by leads

. . Soldering processes of single lead pin

. Solder materials whose components are specified *

. Removal of unwanted solder

. Layers to prevent adhesion of solder

DE00
SEALING AND BURR REMOVAL, OR BURR PREVENTION *

DE01

DE02

DE03

DE04

DE05

DE06

DE07

DE08

DE09

DE10

. Resin sealing e.g. moulds or plastic

. . characterised by locations or shapes of mould injecting holes

. . Thin sections for air vent during moulding

. . Two-layer moulds including potting

. . Devices for injecting resins

. . Plastic sealing

. . Absorption of stress caused by differences in thermal expansion from resins

. . . Lead frames

. . . Tabs or tab leads

. . . Internal leads

DE11

DE12

DE13

DE14

DE15

DE16

DE17

DE18

DE19

DE20

. Glass sealing i.e. characterised by processes of sealing glass

. . Formation of unevenness on ceramic substrates

. . Plated layers on leads

. Prevention of resin burrs

. . Formation of horizontal projections on tie bars

. . Formation of coatings on tie bars e.g. with metals or resins

. . Formation of holes or grooves in tie bars i.e. dams

. . Formation of projections on upper and lower surfaces of leads

. Removal of resin burrs *

. Metal burrs on lead frames or tabs

DF00
BONDING, OR PREVENTION OF CONTACT BETWEEN BONDING WIRES AND INTERNAL LEADS *

DF01

DF02

DF03

DF04

DF05

DF06

DF07

DF08

DF09

. Use of bonding wires

. . characterised by shapes of internal leads

. . . Formation of thin sections by coining or etching

. . . Formation of identifiers near tips

. . . Formation of unevenness on bonding sections

. . Plating on internal lead tips

. . Internal lead tips displaced vertically or in front and back.

. . Internal lead bonding tips concentrated on the two short sides

. . equipped with relay electrodes for bonding

DF11

DF12

DF13

DF14

DF15

DF16

DF17

DF18

DF20

. Prevention of contact between bonding wires and internal leads

. . Formation of insulation layers around tabs or thin sections on peripheries

. . Interposing insulations between tabs and internal leads

. . Formation of projections on internal lead tips

. . Changing shapes of internal lead tips e.g. recesses projections or coining

. . making tabs smaller than chips

. . Formation of tab bottoms lower than internal lead bottoms

. . Horizontal or front and back displacement of tabs and lead tips

. without using bonding wires

EA00
LEAD FRAME MATERIAL *

EA01

EA02

EA03

EA04

EA05

EA06

EA07

EA08

EA09

EA10

. Alloys containing iron (Fe) as the main components *

. . Iron-nickel (Fe-Ni) alloys *

. . Iron-chromium (Fe-Cr) or stainless steel alloys *

. Alloys containing copper (Cu) as the main components *

. Materials containing other metals as the main components *

. . Aluminium alloys *

. Cladding *

. External leads formed of bimetals

. Shape memory alloys

. characterised by heat treatment processes during manufacturing alloys

5F067	LEAD FRAMES FOR INTEGRATED CIRCUITS
	H01L23/50 -23/50@Z