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F-Term-List

5F038 SEMICONDUCTOR INTEGRATED CIRCUITS
H10D1/00 -1/68;89/00-89/00,101@Z;89/60
H01L27/04-27/04@V AC AC00
CAPACITOR 		AC01 AC02 AC03 AC04 AC05 AC06 AC07 AC08 AC09 AC10
. Structures . . Electrode regions or portions . . . Semiconductor regions diffusion regions impurities or the like . . . Planar shapes split electrodes or the like . . . Polycrystalline electrodes or metal electrodes . . PN isolation element isolation or parasitic capacitance . . Stacking elements * . . . PN and MIS . . . on transistors e.g. stacked types . . Grooves or surface unevenness e.g. trench types
AC11 AC12 AC13 AC14 AC15 AC16 AC17 AC18 AC19 AC20
. Capacitor dielectrics . . PN junction under reversed bias . . Schottky . . Dielectrics * . . . Materials thereof * . . . Multilayer dielectric films * . . . Film thickness . . . Methods for manufacturing dielectrics * . Capacitors other than semiconductor substrates e.g. chambers or hybrid ICs. . Other capacitors *
AR AR00
FIXED RESISTOR 		AR01 AR02 AR03 AR04 AR05 AR06 AR07 AR08 AR09 AR10
. Dispersed types . . Impurity concentration distributions of resistors . . Element isolation (parasitic capacitance AR27) . . . Isolated bias . . Pinch resistance or JFET effects . Thin-film resistors . . Materials thereof * . . . Silicides . . . Polycrystalline semiconductors . . . . Impurity concentration distributions of polycrystallines
AR11 AR12 AR13 AR14 AR15 AR16 AR17 AR18 AR19 AR20
. Common techniques shared between dispersed resistors and thin-film resistors . . Shapes of resistors . . . angular or longitudinal . . . perpendicular or vertical . . . . contacting interfaces . . . Contact sections . . . Grooves or unevenness . . Composite (CR composite AZ03) . . . Part of wiring . . . Part of elements
AR21 AR22 AR23 AR24 AR25 AR26 AR27 AR28 AR29 AR30
. . arranging multiple resistors; Serial or parallel connections . . . Unit resistors . . . having different characteristics or resistance values . . Dummies (See also CD10) . . stacking elements . . MOS electrodes or surface electrodes . . Parasitic capacitance preventing parasitism or guard rings . . Temperature compensation . . Piezo effects . Other resistors *
AV AV00
VARIABLE IMPEDANCE 		AV01 AV02 AV03 AV04 AV05 AV06 AV07 AV08 AV09 AV10
. Variable elements using their own impedances . . Trimming . . . Energy beams . . Diodes . . Bipolar transistors . . MOSFET . . . Resistor gates . . . EPROM or EEPROM . Use * . . Fine adjustment
AV11 AV12 AV13 AV14 AV15 AV16 AV17 AV18 AV20
. Variable circuits using impedances of other elements . . Mask works . . switched by switching elements . . . unchangeable . . . . Fuses or junction breakdown . . . . Writing circuits including writing terminals . . . changeable . . . . Control circuits . Others *
AZ AZ00
OTHER ELEMENT 		AZ01 AZ02 AZ03 AZ04 AZ05 AZ06 AZ07 AZ08 AZ09 AZ10
. Distributed constants (strip lines DF02) . Elements having specific functions (circuits DF) * . . CR composite elements e.g. for filters . Inductances . . Equivalent inductance circuits . . Parasitic inductances . Sensors * . . sensing temperatures (See also CA08 and BH16) . Bridging structures . Others *
BB BB00
REFERENCE VOLTAGE 		BB01 BB02 BB03 BB04 BB05 BB06 BB07 BB08 BB09 BB10
. Generating voltages . . Threshold voltages or MOS threshold voltages . . Zener voltages . . Constant-voltage circuits . . dividing voltages . . stabilising by capacitors . Adjusting voltages e.g. by trimming . Controlling voltages e.g. by feedback . Use * . Others *
BE BE00
FUNCTION OF TERMINAL 		BE01 BE02 BE03 BE04 BE05 BE06 BE07 BE08 BE09 BE10
. Decreasing the number of terminals . . Multiplexing . . . Coding . . switching terminal functions (switching functions of IC DF) . . . between test functions . . Terminals for switching IC functions . Connecting terminals including bonding . Terminal resistors e.g. pull-up resistors . Power supply terminals . Others (arrangement CA10) *
BG BG00
GENERATING VOLTAGE; BOOSTING 		BG01 BG02 BG03 BG04 BG05 BG06 BG07 BG08 BG09 BG10
. Circuits . . Oscillating . . Boosting . . Rectifying . . Charge pumps . . controlling voltages . Use * . . for writing to erasable programmable read only memories (EPROM) . . for generating substrate bias voltages (See also CD04) . Others *
BH BH00
PROTECTION OR MALFUNCTION 		BH01 BH02 BH03 BH04 BH05 BH06 BH07 BH08 BH09 BH10
. Effects of use * . . Resistors . . Capacitors or inductances . . Diode forward characteristics . . Junction breakdowns . . Bipolar transistors . . MOS transistors . . Pinch-off or JFET . . Guard rings (See also AR27) . . Shielding
BH11 BH12 BH13 BH14 BH15 BH16 BH17 BH18 BH19 BH20
. Objects from which circuits are protected * . . Input and output . . . Static electricity . . . Incorrect connections . . . High voltages e.g. power supply lines . . Heat (See also AZ08) . . Light . . Parasitic effects e.g. latch-up (See also CA09) . . Malfunctions e.g. software errors or noises . Others *
CA CA00
LAYOUT 		CA01 CA02 CA03 CA04 CA05 CA06 CA07 CA08 CA09 CA10
. Layout on chip surfaces . . arranging elements . . arranging circuit blocks . . . Gate arrays or master slices . . setting regions . . Symmetrical arrangements . . Dispersed arrangements . . involving thermal couplings . . preventing parasite . . arranging electrode pads (pads for testing DT04)
CA11 CA12 CA13 CA14 CA15 CA16 CA17 CA18 CA20
. Crystal axis or plane orientations (See also AR29) . Arranging chips on the back or both sides of substrates . Using scribe regions e.g. dicing lines . Changing dicing lines . Wafer-scale ICs . Three-dimensional elements or layered structures . Arranging elements using CAD or automatic layout methods . Dummy patterns . Others *
CD CD00
DISTRIBUTING ELECTRIC POWER; WIRING 		CD01 CD02 CD03 CD04 CD05 CD06 CD07 CD08 CD09 CD10
. Use * . . for wiring power supply lines . . for wiring for reference voltages . . Substrate earthing or bias wiring to isolation regions . . Signal lines e.g. crossing . . . Clock wiring . . . Bus lines . . . Signal buffers (buffer amplifier circuit DF) . Delay . Dummy wiring (See also BH10)
CD11 CD12 CD13 CD14 CD15 CD16 CD17 CD18 CD19 CD20
. Current division . Wiring resistance e.g. superconductivity . Wiring capacitance e.g. parasitic capacitance (See also BH10) . . adding capacitance for stabilisation . Changing connections e.g. switching power supplies (See also BE04) . . controlling turning-on or turning-off . Controlling voltages e.g. for regulating voltage drops . Materials of wiring * . . Silicides . Others *
DF DF00
FUNCTION OF INTEGRATED CIRCUIT OR STRUCTURE OF CIRCUIT BLOCK 		DF01 DF02 DF03 DF04 DF05 DF06 DF07 DF08 DF09 DF10
. Circuits having specific functions or single functions * . . Microwave monolithic integrated circuits (MMIC) (See also AZ01) . . Analogue/digital or digital/analogue converters . . CPUs or microprocessors . . Memories . Auxiliary functions * . . adjusting or controlling functions . . Power saving . . Radiation resistance . . Protection; Preventing copying
DF11 DF12 DF14 DF16 DF17 DF20
. Multiple functions; Mounting or connecting circuit blocks . . mounting both analogue and digital circuits . . arranging circuit blocks independently of chip arrangements . . Structures for switching functions of circuits (test modes DT) . . . controlling switching . Others *
DT DT00
INSPECTION FUNCTION BEING MOUNTED 		DT01 DT02 DT03 DT04 DT05 DT06 DT07 DT08 DT09 DT10
. Test tools * . . switching modes e.g. of test modes (See also DF) . . inputting and outputting data . . . Terminals dedicated to testing (See also BE05) . . . controlling input and output . . . Scan paths . . generating test patterns . . Circuits for self-diagnosis . . switching power supplies for testing (See also CD15) . Testing methods *
DT11 DT12 DT13 DT14 DT15 DT16 DT17 DT18 DT19 DT20
. Objects to be inspected * . . Elements or circuits for monitoring . . Identifying signals . . . detecting use of redundant circuits . . inspecting chip functions . Processing . . storing results . . switching circuits according to test results (See also DF16) . . Indicating . Others *
EZ EZ00
OTHER TECHNIQUE 		EZ01 EZ02 EZ03 EZ04 EZ05 EZ06 EZ07 EZ08 EZ09 EZ10
. Materials * . . Compound semiconductors e.g. of Groups III-V . . Organic materials . Structures of the bodies . . SOS . . SOI . . Multichips . Designing . . CAD or DA . . evaluating simulations
EZ11 EZ12 EZ13 EZ14 EZ15 EZ16 EZ17 EZ18 EZ19 EZ20
. Manufacturing methods * . . Diffusing . . Ion implantation . . Epitaxial growth or deposition . . Etching . . Oxidation . . Heat treatment . . Self-alignment * . . Scribing . Others e.g. purposes *
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