| ReturnTo Theme-Group-Choice | Onelevelup |
| 5F063 | DICING | |
| H01L21/78 -21/80 | ||
| H01L21/78-21/80 | AA | AA00 PROBLEMS TO BE SOLVED |
AA01 | AA02 | AA04 | AA05 | AA06 | AA07 | AA08 | AA09 | ||
| . Improving accuracy | . . Accuracy of dicing streets | . Improving chip quality | . . Preventing chipping, crack, break, melting | . . Improving chip strength (AA05 takes precedence) | . . Preventing peeling of films | . . Preventing electrostatic destruction, corrosion, deterioration of metal parts | . . Preventing reduction of chip quality during transfer | |||||
| AA11 | AA13 | AA15 | AA16 | AA18 | ||||||||
| . Countermeasures against thinning chips | . Working environmental countermeasures (example, against heat, humidity, atmosphere) | . Preventing such as contamination, cutting dust, debris (AA24 takes precedence) | . . Preventing adhesive deposit | . Improving tape characteristics (AA16 and AA31 take precedence) | ||||||||
| AA21 | AA22 | AA23 | AA24 | AA25 | AA26 | AA28 | AA29 | |||||
| . Improving tools/equipment | . . Improving life or durability of tools/equipment | . . Exchanging tools | . . Sealing measures against water leakage | . . Generalizing, Responding to a wide variety of products | . . Miniaturizing, Space-saving | . Caring operators, Alarms, Displays (AA40 takes precedence) | . . Improving operability/workability | |||||
| AA31 | AA33 | AA35 | AA36 | AA37 | AA38 | AA39 | AA40 | |||||
| . Problems on expanding | . Problems on picking up | . Improving productivity | . . Improving processes/yield (AA44 takes precedence) | . . Improving processing capacity | . . . Processing a plurality of workpieces | . . . . Concurrent implementation of different processings to multiple workpieces | . . Simplifying maintenance | |||||
| AA41 | AA43 | AA44 | AA46 | AA48 | AA50 | |||||||
| . Preventing danger, abnormality (AA28 takes precedence) | . Reducing cost or environmental load, Dealing waste | . . Reducing consumption of members, Reusing members | . Three-dimensional packaging | . Improving detecting methods and measuring methods | . Others* | |||||||
| BA | BA00 WAFERS OR SUBSTRATES TO BE SUBDIVIDED |
BA01 | BA02 | BA03 | BA04 | BA05 | BA06 | BA07 | BA09 | BA10 | ||
| . Wafers with characteristic overall shape/structure | . . With thick parts (example, for enforcement) | . . . With the thick periphery (circumference) | . . . With thick die streets | . . Non-circular wafers (except for resin-sealed ones) | . . . Subdivided wafers (example, one quarter of a wafer) | . . With characteristic rear side layer/front side layer (BA22 takes precedence) | . . With multiple types of chips on wafers | . . . With different sized/shaped chips on wafers | ||||
| BA11 | BA13 | BA15 | BA17 | BA18 | BA20 | |||||||
| . Bonded substrates with a remnant of the sealing substrate or reinforcing substrate after dicing (except for just SOI) | . With characteristic street shapes before cutting | . With hollow portions (example, movable portions of MEMS) | . Resin-sealed substrates (example, such as CSP) | . . Dividing into pieces after sealing (example, such as WLP) | . With convex portions, bumps | |||||||
| BA21 | BA22 | BA23 | BA25 | BA26 | BA27 | BA28 | BA29 | |||||
| . With exposed electrodes (BA20 takes precedence of only BA21) | . . With electrodes on at least rear side | . . . With lead-through electrodes | . With marks (including alignment marks, TEG, electric contacts) | . . With marks on rear side of the substrates | . . With marks in chip regions | . . With marks on streets | . . . With marks composed of a part of membranes on chips | |||||
| BA31 | BA32 | BA33 | BA34 | BA36 | BA38 | |||||||
| . With characteristic uses of products | . . With MEMS, movable portions | . . Products being light-emitting devices (such as LED) | . . Products being light-receiving devices (such as imaging sensors) | . With dummy patterns, dummy chips | . Dummy wafers, Test wafers (example, for test cutting) | |||||||
| BA41 | BA42 | BA43 | BA44 | BA45 | BA46 | BA47 | BA48 | BA50 | ||||
| . Characteristic materials | . . Compound semiconductors | . . . Gallium-based (GaN, GaAs) compound semiconductors | . . . Indium-base (InP) compound semiconductors | . . . Silicon-based (SiC, SiGe) compound semiconductors | . . Epitaxial growth substrates | . . . Sapphire (Al2O3) substrates | . . Substrates made of other than semiconductors (such as resin substrates, ceramic substrates) | . Others* | ||||
| BB | BB00 CHIPS AFTER SUBDIVISION |
BB01 | BB02 | BB03 | BB04 | BB05 | ||||||
| . With characteristic shapes/structures in the side view of chips | . . With a R/C/recess/step in corners of chips | . . With chip side faces covered by protective films (CC11 and subdivisions should be considered) | . . With exposed electrodes/conductive parts at chip side faces | . . With protective structures (example, guard rings) before subdivision | ||||||||
| BB11 | BB12 | BB14 | BB16 | |||||||||
| . With characteristic shapes/structures in the top view of chips | . . With R or C in corners of chips | . . With a concave/convex in the side/corner (BB12 takes precedence) | . . Nonsquare chips (BB12 and BB14 take precedence) | |||||||||
| BB21 | BB22 | BB30 | ||||||||||
| . Intentionally left processing strain or processing trace | . . For gettering | . Others* | ||||||||||
| CA | CA00 SUBDIVISION IN ONE STEP (example, full cutting) |
CA01 | CA02 | CA04 | CA06 | CA08 | CA10 | |||||
| . Subdivision from front surface/element-forming surface | . Subdivision from rear surface/element-non-forming surface | . Subdivision with blades | . With leaser beam (including cases when guided by fluids) | . With etching | . With blowing solid/fluid (example. sand blast, water jet) | |||||||
| CA11 | CA13 | |||||||||||
| . With other steps* | . Full cutting portion and non-cutting portion/mixed full cutting portion and half cutting portion (example, non-forming portion is non-cutting of circuit) | |||||||||||
| CB | CB00 SUBDIVISION IN MULTIPLE STEPS (NOT COUNTED EXCEPT SUBDIVIDING STEPS) |
CB01 | CB02 | CB03 | CB05 | CB06 | CB07 | CB08 | CB09 | CB10 | ||
| . The first subdividing step | . . From front surface/element-forming surface | . . From rear surface/element-non-forming surface | . . With blades | . . With leaser beam (including cases when guided by fluids) | . . . Forming modified layers | . . With etching | . . With blowing solid/fluid (example, sand blast, water jet) | . . With other steps* | ||||
| CB11 | CB12 | CB13 | CB14 | CB15 | CB16 | CB17 | CB18 | CB19 | CB20 | |||
| . From the second step to the step before the final step (just before the final subdivision) | . . From front surface/element-forming surface | . . From rear surface/element-non-forming surface | . . . Rear surface thinning, DBG (DD64 must be examined) | . . With blades | . . With leaser beam (including cases when guided by fluids) | . . . Forming modified layer | . . With etching | . . With breaking (including expanding) | . . With other steps (such as grinding/polishing)* | |||
| CB21 | CB22 | CB23 | CB24 | CB25 | CB26 | CB27 | CB28 | CB29 | CB30 | |||
| . The final step of subdivision | . . From front surface/element-forming surface | . . From rear surface/element-non-forming surface | . . . Rear surface thinning, DBG (DD64 must be examined) | . . With blades | . . With leaser beam (including cases when guided by fluids) | . . With etching | . . With breaking | . . . With expanding | . . With other steps (such as grinding/polishing)* | |||
| CC | CC00 OTHER CHARACTERISTICS OF SUBDIVIDING STEP(S) |
CC01 | CC02 | CC03 | CC04 | CC05 | CC07 | CC08 | CC10 | |||
| . Shapes of scribe lines (including laser modified layers)/grooves after dicing and before final subdivision | . . Changing depth/shape/structure/width along the longitudinal direction | . . . Scribe lines and the like formed intermittently in the longitudinal direction | . . . Chip corners having different/not having grooves/modified layers (BB11-BB16 take precedence) | . . . Chip circumferential parts/non-device forming regions having different/not having grooves/modified layers | . . Multiple types of scribe lines with differences in depth/shape/structure/width | . . . Scribe lines with differences depending on directions (example, between the X axis direction and the Y axis direction) | . . Scribe lines with characteristic shape/structure in the side view (BB01-BB05 take precedence) | |||||
| CC11 | CC12 | CC13 | ||||||||||
| . Characteristic processing to dividing grooves before the final step (example, forming film, removing stress) (take care of BB03) | . . Forming films remaining after subdivision to dividing grooves | . . . Chips after subdivision integrated by backfilling or films, and subdivided again | ||||||||||
| CC21 | CC22 | CC23 | CC24 | CC25 | CC26 | CC27 | CC28 | CC29 | ||||
| . Cutting portions composed of different materials in different steps | . . Dealing conductive/metallic layers (example, removing) | . . Dealing surface membranes (preventing film peeling) | . . Cutting wafers and cutting dicing sheets in other steps | . . . Cutting die bonding adhesive layers in other steps | . . . . Cutting die bonding adhesive layers by expanding | . . Intentionally cutting the same kinds of materials other than wafer (including protective materials) in multiple steps | . . . Cutting die bonding layers in multiple steps | . . . Cutting surface membranes in multiple steps | ||||
| CC31 | CC32 | CC33 | CC35 | CC37 | CC38 | CC39 | ||||||
| . Simultaneous cutting of wafer and portions composed of other materials | . . Simultaneous cutting of wafer and die bonding adhesive layers | . . Simultaneous cutting of wafer and protective materials | . Cutting based on the crystal orientation | . Multi-times of cutting on the same street with different positions, angles | . . Cutting both sides of the same street (example, for such as avoiding TEG) | . . . Forming stress relaxation grooves (example, for such as preventing layer peeling) | ||||||
| CC41 | CC43 | CC44 | CC46 | CC47 | CC49 | |||||||
| . Intentionally not cutting vertically (CC37 takes precedence) | . Characteristic dicing order in the side view of wafers | . . Ordered cutting from both ends of wafers to the center | . . Largely dividing wafers, the subdividing | . . . Ordered cutting from the center of wafers to both ends | . Subdivision of wafers in depth direction | |||||||
| CC51 | CC52 | CC53 | CC60 | |||||||||
| . Parallel processing | . . Simultaneous processing of multiple streets | . . Simultaneous processing of the same street with multiple processing means | . Others* | |||||||||
| DD | DD00 INDIVUDUAL STEPS/MECHANISMS ASSOCIATED WITH SUBDIVISION (1) |
DD01 | DD02 | DD03 | DD04 | DD05 | DD06 | DD07 | DD08 | DD09 | DD10 | |
| . Rotating blades | . . Materials, structures, manufacturing methods of blades (DD08 takes precedence) | . . Fixing blades to spindles, spindle-supporting structures (DD04-DD08 take precedence) | . . having/utilizing a plurality of blades | . . . Spindles having multiple blades | . . . having multiple spindles | . . . . having three or more spindles | . . . having/utilizing different types of blades (example, width, shape, abrasive grain) | . . Characteristic control, setting up of blades | . . . Rotative directions (example, down cut, and the like) | |||
| DD11 | DD12 | DD13 | DD14 | DD15 | DD16 | DD17 | DD18 | DD19 | DD20 | |||
| . . . Revolutions of blades | . . . Pressing forces | . . . Positioning of blades | . . . . Variable Z-directional positions in feeding direction | . . . Feeding directional speed | . . . Adding vibration such as ultrasonic waves to blades | . . Detection, Examination on blades | . . . Detection of blade positions | . . . . Z-directional positions | . . . Diameters of break, crack, abrasion | |||
| DD21 | DD22 | DD23 | DD25 | DD26 | DD27 | DD28 | DD29 | DD30 | ||||
| . . Structures of blade covers | . . Mechanisms, methods of dressing | . . Cooling measures other than cutting water (example, air cooling) (Cutting water is covered by FF22) | . Dicing with laser beam | . . Forming molten grooves, or characteristic cutting methods | . . Characteristic formation of modified layers (CC01-CC10 take precedence) | . . . Forming while changing positions in the thickness direction | . . . Multiple modified layers formed in the thickness direction | . . Water jet laser | ||||
| DD31 | DD32 | DD34 | DD35 | DD36 | DD37 | DD38 | DD39 | DD40 | ||||
| . . Characteristic laser processing apparatus | . . . Characteristic control of leaser beam (optical system, oscillation intensity, and the like) | . Dicing with scribing tools | . . Characteristic control of loads | . Etching | . . Etching for dicing | . . . Etching of conductive/metallic layers | . . . Etching also having other objectives than subdivision | . . . . Etching also for removing process strain/improving strength | ||||
| DD41 | DD42 | DD43 | DD44 | DD45 | DD46 | DD47 | DD48 | DD49 | DD50 | |||
| . . . Overall etching not using masks | . . . Etching with masks (characteristic masks are covered by DF) | . . . . Etching with continuous mask removing (example, removing masks in etching chambers) | . . Etching not for subdivision, for such as removing strain | . . . Etching performed after final subdivision | . . Dry etching, Plasma etching | . . . Isotropic etching | . . . Repeated side-wall protection and etching, BOSCH (a registered trademark) process | . . Wet etching | . . . Crystal anisotropic etching | |||
| DD51 | DD52 | DD55 | DD56 | DD58 | DD59 | DD60 | ||||||
| . . Characteristic etching apparatuses | . . . Etching apparatuses integrated into such as cutting apparatuses, dicing apparatuses | . With blowing solid/fluid (example, sand blast, water jet) (DD30 takes precedence) | . . With characteristic apparatuses, control | . Polishing, CMP, Cutting (take care of DD91) | . . Polishing , cutting not directly related to making pieces (simply thinning) (DD91 takes precedence) | . . . Polishing from the front surface/element formation surface and the like (example, for electrodes) | ||||||
| DD61 | DD62 | DD63 | DD64 | DD65 | DD67 | DD68 | DD69 | DD70 | ||||
| . . . characteristic apparatuses (example, integrated into dicing apparatuses) | . . Forming enforcing portion in periphery | . . Removing apparatuses for modified layers caused by laser beam | . . Polishing for subdivision into pieces (example, dicing Before grinding) | . . . Characteristic polishing apparatuses and the like | . Expanding | . . With breaking | . . Without breaking | . . Multistep expanding | ||||
| DD71 | DD72 | DD73 | DD74 | DD75 | DD76 | DD78 | DD79 | DD80 | ||||
| . . Characteristic holding methods of expanded state | . . . Using expanding rings | . . Characteristic expanding apparatuses (DD72 takes precedence) | . . . Mechanisms extending in each of X-direction and Y-direction | . . . Mechanisms extending in the diametrical direction | . . . Expanding apparatuses integrated with other apparatuses | . Breaking (DD68 takes precedence) | . . Utilizing heat | . . Utilizing vibration (example, ultrasonic waves) | ||||
| DD81 | DD82 | DD83 | DD85 | DD86 | DD87 | DD89 | DD90 | |||||
| . . Folding cutting | . . . Utilizing rollers | . . . . Characteristic apparatuses, control | . Picking up (DG19-DG36 take precedence) | . . Characteristic picking up apparatuses | . . . With mechanisms for enhancing peeling (example, absorbing methods of sheets, DG23-DG36 take precedence) | . Other processes while integrally holding chips after subdivision (including re-cover of tapes) (DD45 and DD67 take precedence, take care of DD59) | . . Forming layers | |||||
| DD91 | DD93 | DD95 | DD96 | DD97 | DD98 | DD99 | ||||||
| . . Thinning back sides | . Processing in unusual circumstances (cooling, heating) | . Additional steps other than subdivision | . . Laser marking | . . Processing to outer peripheral enforcing portions | . . Forming films (DD90 takes precedence) | . Others* | ||||||
| DE | DE00 INDIVUDUAL STEPS/MECHANISMS ASSOCIATED WITH SUBDIVISION (2), ALIGNMENT, EXAMINATION, DETECTION |
DE01 | DE02 | DE03 | DE04 | DE05 | DE06 | DE07 | ||||
| . Alignment | . . Alignment performed from front face of wafers | . . Alignment performed from rear face of wafers | . . Performing pre-alignment | . . With multiple alignment means (example, multiple cameras) (DE04 takes precedence) | . . characteristic registration/recognition means of target patterns | . . Utilizing already processed portions | ||||||
| DE11 | DE12 | DE13 | DE14 | DE16 | DE17 | DE18 | DE19 | DE20 | ||||
| . Examination, Detection, Observation (except for alignment) | . . Examination of cut faces and modified layers during dicing | . . . Examination of test cutting (example, dummy wafers) | . . . Examination of laser modified layers | . . Dealings after examination | . . . Adjusting positions of such as processing tools based on examination results | . . . Additional processing in case of subdivided portions | . . . Sorting non-defective chips and defective chips | . . Detecting existence or absence of wafers | ||||
| DE23 | ||||||||||||
| . . Characteristic examination apparatuses (example, arrangement of members) | ||||||||||||
| DE31 | DE32 | DE33 | DE34 | DE35 | DE36 | DE37 | DE38 | DE40 | ||||
| . Detecting means | . . Utilizing optical means, electromagnetic waves | . . . Detection by imaging means (example, image recognition, cameras) | . . . . Detection by infrared rays | . . . Detection by laser beam | . . . characteristic arrangement, structure of optical means | . . Detecting by heat | . . Detecting by sounds | . Others* | ||||
| DF | DF00 INDIVUDUAL STEPS/MECHANISMS ASSOCIATED WITH SUBDIVISION (3), DEALING OF PROTECTIVE MATERIALS, PROTECTIVE MATERIALS THEMSELVES (DICING SHEETS ON SURFACE ARE NOT PROTECTIVE MATERIALS, BUT ARE SHEETS, WHAT WHOSE MAIN OBJECTIVES ARE TO SUPPORT WORKPIECES ARE NOT PROTECTIVE MATERIALS) |
DF01 | DF02 | DF03 | DF04 | DF06 | ||||||
| . Characteristic covering mechanisms/methods | . . Patterned protective materials | . . . Characteristic exposure of photo resists (example, slit exposure for only dicing lines) | . . . characteristic patterning other than exposing photo resists (example, patterning by laser beam) | . . Forming protective materials by coating, spraying | ||||||||
| DF11 | DF12 | DF13 | DF14 | DF15 | DF16 | DF17 | DF18 | DF19 | DF20 | |||
| . Types/compositions of protective materials (example, masks) | . . Sheet-like protective materials | . . Characteristic removing methods/mechanisms | . . . Remaining/not removed protective materials after subdivision | . . . Removable protective materials with temperature (including room temperature)/wind | . . . Volatility, sublimability of protective materials | . . . Removable protective materials by ashing (example, photo resists) | . . . Removable protective materials by liquids | . . . . Water-soluble/water-removable protective materials | . . . . Protective materials removed in washing step | |||
| DF21 | DF23 | DF24 | DF30 | |||||||||
| . . . Characteristic removing mechanisms/methods (others) | . having characteristic uses | . . Protective materials for laser dicing | . Others* | |||||||||
| DG | DG00 INDIVUDUAL STEPS/MECHANISMS ASSOCIATED WITH SUBDIVISION (4), ATTACHIG/PEELING SUCH AS DICING TAPES |
DG01 | DG03 | DG04 | DG05 | DG06 | ||||||
| . Processing on the same holding member as that of the preceding step (take care of EE85) | . Processing on a re-covered holding member from that of the preceding step | . . Attaching dicing tapes then peeling back grind tapes | . . Attaching dicing tapes after peeling back grind tapes | . . Grinding rear side -> Film forming -> Attaching holding materials | ||||||||
| DG11 | DG12 | DG13 | DG14 | DG16 | DG17 | DG19 | DG20 | |||||
| . Re-covering by other holding materials after subdivision into chips | . . Re-covering after enlarging distance between chips (in the state of enlarged distance between chips) | . . Re-covering by well-expanding tapes | . . Re-covering by tapes having excellent etching resistance/resistance to chemical solutions | . Performing specified dealings after attaching dicing tapes to wafers (DG24 takes precedence) | . . Changing properties of tapes (example, by UV hardening on dicing lines) | . Performing specified dealings after peeling from wafers (including picking up) | . . Housing tapes/ring frames in cassettes | |||||
| DG21 | DG23 | DG24 | DG25 | DG26 | DG27 | DG28 | DG29 | DG30 | ||||
| . Restoring slacked tapes by expanding | . Characteristic attaching, peeling mechanisms/methods | . . Cutting tapes corresponding to shapes such as wafers | . . . Cutting along ring frames | . . . Pre-cut tapes | . . Attaching by rollers | . . Attaching by means other than rollers | . . Characteristic attaching/peeling directions | . . . Characteristic attaching/peeling directions in the top view (example, diagonal directions of chips) | ||||
| DG31 | DG32 | DG33 | DG34 | DG35 | DG36 | DG40 | ||||||
| . . Attaching/peeling under specified circumstances/after specified dealings | . . . Characteristic heating/temperature, apparatuses therefore | . . . . Local dealings (example, heating specific chips only) | . . . Characteristic irradiation of light (including UV light) and radioactive rays, and apparatuses therefore | . . . . Local dealings (example UV irradiation to specific chips only) | . . Integrated attaching/peeling apparatuses with other apparatuses | . Others* | ||||||
| EE | EE00 DICING TAPES, DICING SHEETS, RING FRAMES, ENFORCING PLATES, JIGS (PROTECTIVE LAYER MATERIALS ARE COVERED BY DF) |
EE01 | EE02 | EE03 | EE04 | EE05 | EE07 | EE08 | EE09 | |||
| . Characteristic base layers of tapes/sheets | . . Containing antistatic agents | . . Porous base layers, base layers with pores | . . Characteristic dealing/shape/property in front surface side (pressure-sensitive adhesive layer side) of base layers | . . Characteristic dealing/shape/property in rear surface side (opposite side to pressure-sensitive adhesive layer) of base layers | . . Characteristic materials or properties of base layers | . . . Multiple base layers (including intermediate layers and the like) | . . . . . Direct attaching of base layers (without pressure-sensitive adhesive layers) | |||||
| EE11 | EE12 | EE13 | EE14 | EE15 | EE16 | EE17 | EE18 | |||||
| . Dicing die-bonding tapes | . . Pressure-sensitive adhesives and adhesives in the same layers | . . Pressure-sensitive adhesives and adhesives in different layers | . . Characteristic materials or properties of pressure-sensitive adhesive layers | . . . Multiple pressure-sensitive adhesive layers | . . Characteristic materials or properties of adhesive layers | . . Characteristic properties of dicing die-bonding tapes as a whole | . . Characteristic laminating structures of dicing die-bonding tapes as a whole (example,. intermediate layers) (EE15 takes precedence) | |||||
| EE21 | EE22 | EE23 | EE25 | EE27 | EE28 | EE29 | EE30 | |||||
| . Dicing tapes without die-bonding layers | . . Characteristic materials or properties of pressure-sensitive adhesive layers | . . . Multiple pressure-sensitive adhesive layers | . . Characteristic properties of dicing tapes as a whole | . . Characteristic laminating structures of dicing tapes as a whole (example, intermediate layers) (EE23 takes precedence) | . . . Remaining layer such as a sealing layer after subdivision into chips | . . . . For rear side of chips | . . . . Protective layers for front side of chips | |||||
| EE31 | EE32 | EE34 | EE36 | EE37 | EE38 | EE40 | ||||||
| . Rolled, long tapes | . . Characteristic structures of surplus portions outer side of tapes | . Characteristic structures, materials, and properties of dicing frames | . Characteristic structures, materials, and properties of enforcing plates (bonded substrates take precedence) | . . Porous enforcing plates, enforcing plates with pores | . . Characteristic adhesives for enforcing plates (when needed, also covered by EE41-EE50) | . Characteristic structures, materials, and properties of holding jigs (DD72 takes precedence) | ||||||
| EE41 | EE42 | EE43 | EE44 | EE45 | EE46 | EE48 | EE50 | |||||
| . With variable properties | . . With thermally variable properties | . . Characterized by light, UV, radioactive rays | . . Hardening materials | . . Materials generating air bubbles | . . . Materials which sublime, evaporate, disappear | . . Materials which constrict | . . Changing, adjusting properties for objectives other than facilitating picking up | |||||
| EE51 | EE52 | EE53 | EE54 | EE56 | EE58 | EE59 | EE60 | |||||
| . Characteristic predetermined shapes in the top view, structures, properties (EE34, EE36, and EE40 take precedence) | . . Shapes responding to street/chip spacing | . . . With grooves/incisions responding to streets | . . . With pre-formed portions having different properties (example, UV hardening) | . . Dicing tapes supporting wafer outer peripheral portions/non-chip forming regions (not supporting the central portion) | . . Dicing tapes having different structures/properties in wafer-attaching portions and outer portions | . . . Dicing tapes having different structures/properties in wafer-attaching portions and close to frame portions | . . . Dicing tapes having lower extensibility in outer peripheral portions than in wafer-attaching portions | |||||
| EE61 | EE62 | EE63 | EE64 | |||||||||
| . Dicing tapes having marks/signs | . . With elements specifying types of wafers (example, bar codes) | . . With positioning marks | . . With marks for verifying incision depth | |||||||||
| EE71 | EE72 | EE73 | EE75 | EE76 | EE78 | EE79 | ||||||
| . Uses | . . Dicing tapes holding multiple wafers | . . Dicing tapes having excellent expanding property | . . Dicing sheets for blade dicing | . . . With blade dressing function | . . Dicing sheets for laser dicing | . . . Dicing sheets for water jet-guided laser dicing | ||||||
| EE81 | EE83 | EE85 | EE86 | EE87 | EE90 | |||||||
| . . Dicing sheets for breaking | . . Dicing sheets for dicing with blowing solid/fluid (example, sand blast, water jet) (EE78 takes precedence) | . . Dicing sheets for rear side thinning step | . . . Dicing sheets for rear side thinning step in DBG | . . . Dicing sheets for rear side thinning step and serial dicing step from rear side | . Others* | |||||||
| FF | FF00 OTHER PERIPHERAL APPARATUSES |
FF01 | FF02 | FF03 | FF04 | FF05 | FF06 | FF07 | FF08 | FF09 | FF10 | |
| . Chuck tables | . . Shapes, structures, properties, materials corresponding to streets | . . . Grooves | . . With characteristic suction/aspiration structures, control (FF02 takes precedence) | . . Workpiece holding means other than vacuum aspiration (example, clampers) | . . With off-level table surface | . . Processing tables not movable in other angle, feeding direction | . . With multiple processing tables | . . Respondable to wafers with different sizes, shapes | . . Respondable to wafers with recesses in rear side | |||
| FF11 | FF13 | |||||||||||
| . . Chuck tables composed of characteristic materials | . Washing/cleaning mechanisms with other than liquids (FF21- FF38 take precedence.) | |||||||||||
| FF21 | FF22 | FF23 | FF24 | FF25 | FF26 | FF27 | FF28 | |||||
| . Providing/collecting liquids | . . Liquids for blades (example, cutting water, cooling water) | . . . .characteristic compositions | . . . . Liquids containing processing ingredients (example, for etching) | . . . . Liquids containing washing ingredients for such as workpieces | . . . . Liquids containing antistatic agents (example, carbon dioxide) | . . . . Liquids containing dressing ingredients for blades | . . . Characteristic providing mechanisms/methods | |||||
| FF31 | FF33 | FF34 | FF35 | FF36 | FF37 | FF38 | ||||||
| . . Liquids for etching | . . Liquids for washing FF25 takes precedence) | . . . With characteristic compositions | . . . With characteristic providing mechanisms/methods | . . . . Washing during dicing (FF25 takes precedence) | . . Characteristic control/setting of temperature | . . Liquid providing for other purposes | ||||||
| FF41 | FF42 | FF43 | FF44 | FF45 | FF46 | FF48 | FF49 | |||||
| . Conveying mechanisms | . . Carrying-in into dicing apparatuses and carrying-out from dicing apparatuses, mounting/dismounting (FF43 takes precedence) | . . Carrying-in/-out into/from cassettes | . . . Characteristic structures of cassettes | . . With waiting positions other than cassettes | . . Conveying, storage under special environments (example such as underwater storage) | . Covers of apparatuses/mechanisms (DD21 takes precedence) | . . Bellow-type covers | |||||
| FF51 | FF52 | FF54 | FF55 | FF57 | FF60 | |||||||
| . characteristic whole constitution of apparatuses | . . characteristic arrangement of individual mechanisms, components | . . Installation environment, atmospheric control | . . . Static elimination mechanisms | . . Overall control of processing apparatuses (example, by electric power, etc.) | . Others* |