F-Term-List

H01L23/34-23/46@Z

AA00
PURPOSE OTHER THAN COOLING

AA01

AA03

AA05

AA10

. Heating or temperature rise

. Constant temperatures

. Dew condensation prevention

. Others *

BA00
HEAT SINK (FOR PHASE CHANGE COOLANTS, SEE CC)

BA01

BA02

BA03

BA04

BA05

BA06

BA07

BA08

. characterised by fins

. . Shapes of fins

. . . Flat-plate fins

. . . . Flat-plate fins erected on fin bases

. . . . Flat-plate fins stacked at the centres thereof

. . . Pin fins

. . . Corrugated fins

. . . Pieces raised by chipping (skived fins)

BA13

BA14

BA15

. . . Fins with holes slits or louvres

. . . Cross-sectional shapes or top face shapes of fins

. . . Changing the heights of fins

BA22

BA23

BA24

BA26

BA30

. . Arrangement of fins

. . . Radial or spiral fin arrangement

. . . changing the arrangement density of fins

. . Fins subjected to surface treatment

. Heat sinks having no fins

BA31

BA32

BA36

BA37

BA38

. characterised by fin bases

. . Shape of fin bases e.g. slopes

. Manufacturing methods of heat sinks also classified in GA

. . Aligning or laminating unit fin members

. . Implanting or connecting the fins on the fin bases

BB00
HEAT DISSIPATING MEMBER OF PACKAGE

BB01

BB02

BB03

BB04

BB05

BB07

BB09

. Heat dissipating substrates

. . Via holes for heat dissipation

. . Substrates including thermal diffusion materials embedded therein

. . Ceramic circuit substrates (see FA12-FA19)

. . Metal-based circuit boards

. Stems

. Heat dissipating studs or flanges

BB11

BB13

BB14

BB16

BB18

. Thermal diffusion members or submounts for use in mounting the elements

. Heat dissipation from package terminals or leads

. Heat dissipation from lid members

. Filling members inside sealed containers

. Packages with heat sinks attached on the external surfaces

BC00
THERMALLY CONDUCTIVE MEMBER BETWEEN HEATING BODY AND HEAT DISSIPATING MEMBER

BC01

BC02

BC03

BC04

BC05

BC06

BC07

. Greases or gels (filling materials see BB16)

. Solders or low melting point metals

. Heat spreaders

. Thermally conductive members having elasticity

. Insulating members between heating bodies and heat dissipating members

. Shapes of the thermally conductive members

. . Sheet-shaped or film-shaped thermally conductive members

CA00
FORCED AIR COOLING

CA01

CA02

CA03

CA04

CA05

CA06

CA08

CA09

. Fans

. . Fans integral with heat sinks

. . . Arrangement of fans

. . . . Arrangement of fans surrounded by fins

. . . . arranging fans above fins

. . . . arranging fans on the sides of fins

. . Sirocco fans or cross-flow fans

. . Mounting of fans

CA11

CA12

CA13

CA15

CA17

CA18

CA20

. Ducts or wind tunnels

. . Arrangement of heating bodies in ducts

. . Arranging heat sinks of different shapes in ducts

. Air flow produced by travelling

. Adjustment of wind directions or air volumes

. Formation of air turbulent flow

. Purification of cooling gases e.g. filters

CB00
COOLING BY LIQUIDS (EBULLIENT COOLERS, SEE CC31)

CB01

CB03

CB06

CB07

CB08

. dipping the heating elements in the cooling liquid

. Bare chip rear surface coming into contact with the cooling liquid

. Cold plates or water-cooling jackets

. . Cross-sectional shapes of the cooling liquid ducts protrusions or partition members

. . Arrangement of cooling liquid flow passages

CB11

CB12

CB13

CB15

CB17

CB18

. Pipings valves or nipples for cooling liquids

. Bellows for cooling liquid

. Pumps for cooling liquid or liquid feeding devices

. Adjusting volumes of cooling liquid

. Control of cooling liquid temperatures

. . Secondary cooling of cooling liquid

CB21

CB22

CB23

CB25

CB27

CB28

. Prevention of leakage of cooling liquid

. Measures to leaked cooling liquid

. . Replenishing of cooling liquid

. Purification of cooling liquid

. Cooling liquid other than water

. Mixing or combining two kinds or more of cooling liquid

CC00
COOLING BY PHASE CHANGE COOLANTS

CC01

. using latent heat of melting or sublimation

CC11

CC12

CC13

CC14

CC16

CC17

CC18

CC20

. Heat pipes

. . Internal structures of heat pipes

. . Container shapes of heat pipes

. . . Flat plate type heat pipes or vapour chambers

. . Fins of heat pipes

. . . Fin shape or arrangement of heat pipes

. . Heat receiving blocks of heat pipes

. . Blowing means to heat pipes

CC22

CC23

CC24

CC26

CC27

. . using a plurality of heat pipes

. . . Using heat pipes with different shapes

. . . Arrangement of heat pipes

. . Mounting of heat pipes

. . . Embedded heat pipes

CC31

CC32

CC34

CC35

CC37

CC38

CC40

. Ebullient coolers

. . Dipping heating bodies in evaporators

. . Evaporators of ebullient coolers

. . . Internal structures of evaporators

. . Condensers of ebullient coolers

. . . Fin configuration or arrangement of ebullient coolers

. . Structures for gas-liquid separation or liquid return in ebullient coolers

DA00
COOLING OBJECT

DA01

DA02

DA03

DA04

DA05

DA06

DA07

DA08

DA09

. Resin sealed devices

. . Chip size packages (CSP)

. . part of a chip being exposed

. . part of a lead frame tab being exposed

. . Heat spreaders separated from lead frames

. . . Tabless lead frames

. . . part of a heat spreader being exposed

. . Resin sealed devices using package substrates

. . Single in-line types

DA11

DA13

DA14

DA15

DA16

DA17

. Hermetically sealed devices

. bare chips

. . Shapes or structures of bare chip backsides

. . . Plated heat sinks (PHS)

. . Heat dissipation from electrodes or bumps of bare chips

. . Bare chips subjected to face-down bonding

DA21

DA22

DA23

DA24

DA25

DA26

DA27

DA28

. Devices for use in high power

. . Dissipating heat from both sides of chips

. . Members for thermal expansion buffering

. . . Members for thermal expansion buffering other than Mo or W

. . Flat elements

. . Case type packages

. . Power modules

. . . Screwing base plates to heat dissipating members

DA31

DA33

DA34

. Devices for high frequency

. Light emitting elements or light receiving elements

. . Semiconductor lasers

DA41

DA42

DA43

DA44

DA50

. cooling a plurality of heating bodies

. . Heights of heating bodies being different

. . Calorific values of heating bodies being different

. . Multichip modules ( for electric power; see DA27)

. Others *

EA00
MOUNTING OF HEAT DISSIPATING MEMBERS OR HEATING BODIES

EA01

EA02

EA03

EA04

EA05

. Mounting of heat dissipating members on heating bodies

. . Mounting by screwing

. . . Screwing heating bodies or heat dissipating members

. . . . Screwed flanges

. . . Threaded heat dissipating members to packages

EA12

EA13

EA14

EA15

EA16

. . Mounting by bonding

. . . Mounting using brazing materials or solders

. . . . Brazing or solder materials

. . . . . Lead-free solders

. . . . Combined use of brazing or solder materials with different melting points

EA23

EA24

EA25

EA26

EA27

EA29

. . . Adhesion using adhesives

. . . . Materials of adhesives

. . . . . Conductive adhesives

. . . . . Adhesives containing fillers

. . . . Surface states of adhesion surfaces e.g. surface roughening groove formation or the like

. . . Mounting using adhesive sheets

EA32

EA33

EA35

EA36

EA38

EA40

. . Mounting by clips

. . . clipping to heat dissipating members themselves

. . Mounting using press members

. . . Press members having elasticity

. . Mounting by pressure welding

. . Regulation of mounting positions

EA41

EA42

EA43

EA44

EA45

. Mounting of heat dissipating members to printed circuit boards

. . Mounting of surface mounted heat dissipating members

. . . Mounting using screws bolts or pins

. . . Mounting using elastic press members

. . . . Elastic members engaged with sockets or frames

EA52

EA53

EA56

. . Mounting of heat dissipating members for single in-line types

. . . Mounting while bending leads

. . Structures of legs of heat dissipating members

EA61

EA62

EA66

EA70

. Mounting of heating bodies onto printed circuit boards

. . Bonding of heating bodies to heat dissipating via holes or wiring

. Mounting of heating bodies or heat dissipating members onto chassis or casings

. Others *

FA00
MATERIAL OF HEAT DISSIPATING MEMBERS

FA01

FA02

FA03

FA04

FA05

FA06

FA07

. Metals

. . Al or Al alloys

. . Cu or Cu alloys

. . Mo or W

. . Mo alloys or W alloys

. . Ni alloys (42 alloys Kovars or the like)

. . Metal fibres or metal wools

FA11

FA12

FA13

FA14

FA15

FA16

FA17

FA18

FA19

. Nonmetals

. . Ceramics

. . . Oxide ceramics

. . . . Aluminas

. . . Non-oxide ceramics

. . . . AlN

. . . . SiC

. . . . SiN

. . . Mixed or laminated two kinds or more of ceramics

FA22

FA23

FA24

FA25

FA26

. . Carbons or carbonaceous materials

. . . Graphites

. . . Diamonds

. . . Carbonaceous fibres

. . . Carbon-carbon composite materials (C-C composite materials)

FA31

FA32

FA33

FA34

. Complexes of metals

. . Complexes containing Al or Al alloys

. . Complexes containing Cu or Cu alloys

. . Complexes containing brazing materials brazing layers or solders

FA41

FA42

FA43

FA44

FA45

. Complexes of metals and non-metals (see FA01-26)

. . using non-metal sintered products

. . using non-metal fibres

. . using two or more kinds of metals

. . using two or more kinds of non-metals

FA51

FA52

FA53

FA54

FA55

FA56

FA59

. Resins or rubbers

. . Epoxy resins

. . Silicone resins

. . Polyimide resins

. . Resin additives including fillers *

. . Mixed or laminated two or more kinds of resins

. Heat insulating materials

FA61

FA62

FA63

FA64

FA65

FA66

FA67

FA68

FA70

. Fillers

. . Metal fillers

. . Non-metal fillers

. . Needle fillers

. . using two or more kinds of fillers

. . . Fillers with different material qualities

. . . Fillers with different particle sizes

. . . Fillers with different shapes

. Other materials *

FA71

FA72

FA73

FA74

FA75

FA76

. Arrangement or mixing of materials

. . Tile or mosaic-shaped arrangement

. . Striped arrangement

. . Arranging other materials only at particular portions

. . Superposition or lamination

. . Graded composition

FA81

FA82

FA83

FA84

FA85

FA86

FA87

FA88

. Physical properties of materials

. . Heat conductivity

. . Coefficients of thermal expansion

. . Elastic moduli

. . Hardness

. . Melting points softening temperatures or glass-transition temperatures

. . Curability

. . Anisotropic heat conductivity

GA00
METHOD OF MANUFACTURING HEAT DISSIPATING MEMBERS

GA01

GA02

GA04

GA06

GA08

. Bonding (mounting of heating bodies see EA12)

. . Brazing or soldering

. Welding

. Caulking

. Press-fit

GA11

GA12

GA13

GA14

GA15

GA17

GA18

. Extrusion

. Press

. Forging

. Casting or die casting

. . Internal chills insert

. Cutting

. . Skiving by chipping

GA21

GA22

GA23

GA24

GA26

GA28

GA30

. Plating ion plating or electroforming

. . Kinds of metals for plating or the like

. . Layer thicknesses of plating or the like

. . Laminated structures of plating or the like

. Resin coating resin electrodeposition or resin coating

. Insulation processing

. Roughening processing

GA31

GA32

GA33

GA35

GA37

GA40

. Sintering

. . Powder metallurgy

. Impregnation

. Resin moulding or mould

. Particle beam processing or energy line processing

. Others *

HA00
MONITORING OR CONTROLLING OF COOLING (LIQUID COOLING, SEE CB15-CB18)

HA01

HA03

HA10

. using temperature sensing elements

. Calorific value control of heating bodies

. Others *

JA00
OTHER COOLING

JA01

JA03

JA05

JA10

. Cryogenic cooling

. using Peltier elements

. using thermal radiation or heat radiation

. Others *

5F136	COOLING OR THE LIKE OF SEMICONDUCTORS OR SOLID STATE DEVICES
	H01L23/34 -23/46@Z