| ReturnTo Theme-Group-Choice | Onelevelup |
| 5F036 | Cooling of semiconductor or solid state devices | |
| H01L23/34 -23/46@Z | ||
| H01L23/34-23/46@Z | AA | AA00 PURPOSE |
AA01 | AA02 | AA04 | AA06 | AA08 | |||||
| . Cooling | . . Cryogenic cooling | . Heating | . Ventilating | . Constant temperatures | ||||||||
| BA | BA00 COOLING METHODS |
BA01 | BA03 | BA04 | BA05 | BA06 | BA07 | BA08 | BA09 | BA10 | ||
| . Coolants | . . Gases | . . . Air | . . Liquids | . . . Cooling using coolants that change state | . . . . Cooling with changes between the liquid and gas states | . . . . . Boiling and cooling accompanied by condensation | . . . . Cooling with changes between the solid and liquid states | . . . Water | ||||
| BA12 | BA14 | |||||||||||
| . . . Coolants made from two or more types of liquids | . . Solids (BA09 takes precedence) | |||||||||||
| BA21 | BA23 | BA24 | BA25 | BA26 | BA28 | |||||||
| . Systems | . . Heat transmission | . . . Convection heat transmission | . . . . Air cooling using air flow produced by movement | . . . Natural convection | . . Radiation | |||||||
| BA32 | BA33 | |||||||||||
| . . Cooling by electrical means | . . . Cooling using the Peltier effect | |||||||||||
| BB | BB00 COOLING APPARATUSES |
BB01 | BB03 | BB05 | BB06 | BB08 | BB09 | |||||
| . Heat radiating members (including heat sinks) | . . Plated heat sinks | . . Fins or irregularities for increasing heat radiation | . . . Split pieces (e.g., skived fins) | . . Substrates with built-in heat-radiating elements | . . . Stems | |||||||
| BB12 | BB14 | BB16 | BB18 | |||||||||
| . . Heat-radiating studs | . . Airtight containers for housing elements | . . Leads (i.e., terminals) | . . Electrodes | |||||||||
| BB21 | BB23 | |||||||||||
| . Members that conduct heat from elements to heat radiating members | . . Fillers in airtight containers | |||||||||||
| BB31 | BB33 | BB35 | BB37 | BB39 | ||||||||
| . Air cooling elements | . . Wind tunnels | . . Fans | . . Adjustment of wind flow and direction | . . Cleaning of air (e.g., filters) | ||||||||
| BB41 | BB43 | BB44 | BB45 | BB46 | BB48 | BB49 | ||||||
| . Elements through which liquid coolant flows | . . Liquid cooling pipes | . . . Pipe shape | . . . Prevention of liquid leakage | . . . Cleaning of liquid | . . Flow-through elements whose shape can be changed | . . . Bellows | ||||||
| BB51 | BB53 | BB54 | BB56 | BB58 | BB60 | |||||||
| . Boiling and cooling element that are accompanied by condensation | . . Coolant evaporators | . . . Variants whose surfaces are made irregular | . . Coolant condensers | . . Variants having coolant evaporators and coolant condensers in airtight element containers | . . Heat pipes | |||||||
| BC | BC00 ATTACHMENT FOR COOLING |
BC01 | BC03 | BC05 | BC06 | BC08 | BC09 | |||||
| . Attachment of elements to heat radiating members | . . Attachment with screws | . . Attachment by adhesion | . . . Variants using brazing materials or solder | . . Attachment with pressing members | . . . Variants in which the pressing members are elastic | |||||||
| BC12 | BC17 | |||||||||||
| . . Attachment by sandwiching with one heat radiating member | . . Control of the position of attachment | |||||||||||
| BC22 | BC23 | BC24 | ||||||||||
| . . Insulation between heat radiating members and elements | . . . Insulating sheets | . . . Insulating compounds | ||||||||||
| BC31 | BC33 | BC35 | ||||||||||
| . Attachment associated with members other than heat radiating members | . . Variants associated with printed circuit boards | . . Variants associated with chassis | ||||||||||
| BD | BD00 MATERIALS FOR THE COOLING APPARATUS COMPONENT |
BD01 | BD03 | BD05 | BD07 | |||||||
| . Metals | . . Aluminum | . . Bi-metals | . . Shape memory alloys | |||||||||
| BD11 | BD13 | BD14 | BD16 | |||||||||
| . Non-metals | . . Ceramics | . . . Non-oxide ceramics | . . Diamonds | |||||||||
| BD21 | BD22 | |||||||||||
| . Composite materials with resin or rubber as one component | . . Variants made only of resin or rubber | |||||||||||
| BE | BE00 ELEMENTS AND STRUCTURES THAT ARE COOLED |
BE01 | BE03 | BE06 | BE09 | |||||||
| . Resin-sealed elements | . . Single in-line types | . Flat elements (i.e., with heat radiating members provided on both sides of the elements and excluding liquid cooling, or boiling and cooling) | . Flip chips | |||||||||
| BF | BF00 MONITORING OR CONTROL OF COOLING |
BF01 | BF03 | BF05 | BF07 | |||||||
| . Control based on values detected by heat-sensitive sensors | . . Control of coolants | . . Control of operating elements | . Monitoring of the amount of coolant |