F-Term-List

5F036 Cooling of semiconductor or solid state devices
H01L23/34 -23/46@Z
H01L23/34-23/46@Z AA AA00
PURPOSE
AA01 AA02 AA04 AA06 AA08
. Cooling . . Cryogenic cooling . Heating . Ventilating . Constant temperatures
BA BA00
COOLING METHODS
BA01 BA03 BA04 BA05 BA06 BA07 BA08 BA09 BA10
. Coolants . . Gases . . . Air . . Liquids . . . Cooling using coolants that change state . . . . Cooling with changes between the liquid and gas states . . . . . Boiling and cooling accompanied by condensation . . . . Cooling with changes between the solid and liquid states . . . Water
BA12 BA14
. . . Coolants made from two or more types of liquids . . Solids (BA09 takes precedence)
BA21 BA23 BA24 BA25 BA26 BA28
. Systems . . Heat transmission . . . Convection heat transmission . . . . Air cooling using air flow produced by movement . . . Natural convection . . Radiation
BA32 BA33
. . Cooling by electrical means . . . Cooling using the Peltier effect
BB BB00
COOLING APPARATUSES
BB01 BB03 BB05 BB06 BB08 BB09
. Heat radiating members (including heat sinks) . . Plated heat sinks . . Fins or irregularities for increasing heat radiation . . . Split pieces (e.g., skived fins) . . Substrates with built-in heat-radiating elements . . . Stems
BB12 BB14 BB16 BB18
. . Heat-radiating studs . . Airtight containers for housing elements . . Leads (i.e., terminals) . . Electrodes
BB21 BB23
. Members that conduct heat from elements to heat radiating members . . Fillers in airtight containers
BB31 BB33 BB35 BB37 BB39
. Air cooling elements . . Wind tunnels . . Fans . . Adjustment of wind flow and direction . . Cleaning of air (e.g., filters)
BB41 BB43 BB44 BB45 BB46 BB48 BB49
. Elements through which liquid coolant flows . . Liquid cooling pipes . . . Pipe shape . . . Prevention of liquid leakage . . . Cleaning of liquid . . Flow-through elements whose shape can be changed . . . Bellows
BB51 BB53 BB54 BB56 BB58 BB60
. Boiling and cooling element that are accompanied by condensation . . Coolant evaporators . . . Variants whose surfaces are made irregular . . Coolant condensers . . Variants having coolant evaporators and coolant condensers in airtight element containers . . Heat pipes
BC BC00
ATTACHMENT FOR COOLING
BC01 BC03 BC05 BC06 BC08 BC09
. Attachment of elements to heat radiating members . . Attachment with screws . . Attachment by adhesion . . . Variants using brazing materials or solder . . Attachment with pressing members . . . Variants in which the pressing members are elastic
BC12 BC17
. . Attachment by sandwiching with one heat radiating member . . Control of the position of attachment
BC22 BC23 BC24
. . Insulation between heat radiating members and elements . . . Insulating sheets . . . Insulating compounds
BC31 BC33 BC35
. Attachment associated with members other than heat radiating members . . Variants associated with printed circuit boards . . Variants associated with chassis
BD BD00
MATERIALS FOR THE COOLING APPARATUS COMPONENT
BD01 BD03 BD05 BD07
. Metals . . Aluminum . . Bi-metals . . Shape memory alloys
BD11 BD13 BD14 BD16
. Non-metals . . Ceramics . . . Non-oxide ceramics . . Diamonds
BD21 BD22
. Composite materials with resin or rubber as one component . . Variants made only of resin or rubber
BE BE00
ELEMENTS AND STRUCTURES THAT ARE COOLED
BE01 BE03 BE06 BE09
. Resin-sealed elements . . Single in-line types . Flat elements (i.e., with heat radiating members provided on both sides of the elements and excluding liquid cooling, or boiling and cooling) . Flip chips
BF BF00
MONITORING OR CONTROL OF COOLING
BF01 BF03 BF05 BF07
. Control based on values detected by heat-sensitive sensors . . Control of coolants . . Control of operating elements . Monitoring of the amount of coolant
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