F-Term-List

H01L33/00@H;33/00@L;33/48-33/64

AA00
PURPOSES

AA01

AA02

AA03

AA04

AA05

. optical

. . improving light output

. . . preventing light absorption

. . . using reflection

. . . preventing reflection or improving extraction of light on the interface or between layers

AA12

AA13

AA14

. . of intensity distribution of light

. . . Diffusion or uniforming of light

. . . Light convergence

AA22

AA23

AA24

AA25

AA26

. . of color tone or wavelengths

. . . for achieving white color light

. . . for achieving multiple colored light, limited to those changing luminous colors

. . . of color rendering, reproduction or temperatures

. . . preventing irregular color

AA31

AA32

AA33

AA34

AA35

AA36

AA37

. electrical

. . preventing disconnection

. . preventing short circuiting

. . reducing energy consumption

. . reducing resistance

. . improving characteristics of anti-static electricity

. . preventing overcurrents

AA41

AA42

AA44

AA46

AA48

. thermal

. . improving heat dissipation

. . Measures against heat distortion

. . Cooling

. . Compensating temperatures

AA51

AA52

AA54

AA56

AA58

AA60

. mechanical

. . Measures against tension or distortion, excluding heat distortion

. . improving accuracy in positioning

. . Down-sizing, thinning or weight-saving

. . improving adhesiveness

. . removable

AA61

AA62

AA63

AA64

AA65

AA66

AA67

. preventing deterioration

. . Phosphors

. . Sealing members

. . Reflection members

. . Conductive members, e.g., lead or wire

. . LED chips

. . Other members *

AA72

AA73

AA74

AA75

AA76

AA77

. . improving moisture- or water-proof property

. . improving anti-oxidation property

. . improving anti-sulfidation property

. . caused by heat

. . caused by light

. . Other causes *

AA81

AA82

AA84

AA86

AA88

. Others *

. . reducing the number of process steps

. . saving materials or reducing parts-count

. . improving yields

. . Marking

BA00
MODES OR TYPES OF PACKAGES

BA01

BA02

BA03

. Implementation of packages

. . Surface-types

. . . Side-view types

BA12

BA13

BA14

. . inserting members for mounting

. . . Can-types

. . . Cannon-ball types

BA21

BA22

BA23

BA24

. Chip mountings

. . Lead frames

. . . having the ends on which chips are mounted

. . . having the planes on which chips are mounted

BA32

BA34

. . Substrates or carriers (for the definitions, see the classification manual.)

. . having submounts

CA00
DETAILS OF PACKAGE STRUCTURES; BONDING

CA01

CA02

CA03

. Wire bonding

. . bonding both anodes and cathodes by wire

. . bonding either of anodes or cathodes by wire

CA11

CA13

CA14

CA16

. Flip-chip bonding, or mounting chips without using wire bonding

. using solder or conductive adhesives

. . having reservoirs thereof

. Other bondings *

CB00
DETAILS OF PACKAGE STRUCTURES; MODES OF MOUNTING

CB01

CB03

CB05

CB07

. Mounting chip substrates sides

. Mounting chips upside down or mounting LED structure sides

. Mounting chip sides

. Mounting thin-film chips or chips from which growth substrates are removed

CB11

CB12

CB13

CB14

CB15

CB16

CB17

CB18

. Mounting monolithic array chips or multiple chips

. . using chips having the same wavelengths

. . using chips having the different wavelengths

. . . using three types of chips in Red-Green-Blue (RGB) colors

. . Multiple chips electrically connected in series

. . Multiple chips electrically connected in parallel

. . Multiple chips electrically connected in series-parallel

. . using monolithic array chips

CB22

CB23

CB24

. . arranged in a one-dimensional array

. . arranged in a matrix or two-dimensional array

. . having separated reflection parts by chip

CC00
DETAILS OF PACKAGE STRUCTURES; LEAD FRAMES

CC01

CC02

CC03

CC04

. having lead frames

. . Modes of arrangement

. . . projecting vertically from packages

. . . projecting horizontally from packages

CC12

CC14

CC15

CC16

CC17

. . characterized by the materials

. . characterized by the shapes or structures

. . . characterized by the thickness

. . . . changing the thickness in the middle

. . . characterized by the attachment members by which lead frames are mounted on package mounting substrates

CC22

CC23

CC24

CC25

CC26

CC27

CC28

. . Members by which lead frames are fixed, excluding bonding layers

. . . Metal

. . . Semiconductors

. . . Insulators

. . . . Resins

. . . . Ceramics

. . . combining multiple materials

CD00
DETAILS OF PACKAGE STRUCTURES; SUBSTRATES OR CARRIERS

CD01

CD02

. having substrates or carriers (for the definitions, see the classification manual.)

. . having wiring layers

CD12

CD13

CD14

CD15

CD16

CD17

CD18

. . Materials

. . . Metal

. . . Semiconductors

. . . . Silicon

. . . Insulators

. . . . Resins

. . . . Ceramics

CD23

CD24

CD25

. . . characterized by the materials

. . . . Flexible substrates

. . . . Substrates comprising layers of two or more types of materials

CD32

CD33

CD34

. . characterized by the shapes or structures

. . . characterized by the thickness

. . . characterized by the attachment members by which lead frames are mounted on package mounting substrates

CD42

CD43

CD44

CD45

CD46

CD47

CD48

CD49

CD50

. . Structures of conductive members formed at substrates or carriers

. . . arranged on substrates or carriers through insulating layers

. . . arranged inside substrates or carriers

. . . arranged on the sides of substrates or carriers

. . . . having arc holes or notches on the sides of substrates or carriers

. . . on the back sides of substrates or carriers

. . . having substrate or carriers as conductive materials

. . . characterized by the conductive members formed at substrates or carriers

. . . . characterized by the parts electrically making contact with package mounting substrates

CE00
DETAILS OF PACKAGE STRUCTURES; REFLECTION PARTS

CE01

CE02

CE03

CE04

CE06

CE08

. having reflection parts

. . having concaves, excluding mere concave mirrors

. . . comprising separate reflection frames from the sides of concaves

. . without concaves

. . having reflection films on the back

. . having mountings on which chips are mounted as reflection parts

CE12

CE13

CE14

CE15

CE16

CE17

CE18

. . Materials

. . . Metal

. . . Semiconductors

. . . Insulators

. . . . Resins

. . . . Ceramics

. . . characterized by the materials

CE22

CE23

. . reflecting light to the direction other than those to which chips mainly emit light

. . . reflecting light to the opposite direction to those to which chips mainly emit light

CE32

. . characterized by the shapes or structures

CF00
DETAILS OF PACKAGE STRUCTURES; HEAT DISSIPATION PARTS

CF01

CF02

CF03

. having heat dissipation parts

. . having chip mountings as heat dissipation parts

. . . exposed to or embedded in the openings of substrates or carriers

CF12

CF13

. . having separate heat dissipation members from chip mountings

. . . on the back sides of the chip mountings

CF22

CF23

CF24

CF25

CF26

CF27

. . Materials

. . . Metal

. . . Semiconductors

. . . Insulators

. . . . Ceramics

. . . characterized by the materials

CF32

CF33

CF34

. . having heat dissipation fins

. . containing heat dissipation fillers

. . by liquid cooling

CF42

. . characterized by the shapes or structures

CG00
DETAILS OF PACKAGE STRUCTURES; SEALED PARTS

CG01

CG02

CG03

CG04

CG05

CG06

CG07

. having sealed parts

. . Materials

. . . Resins

. . . . of epoxy systems

. . . . of silicon systems

. . . Glass

. . . Others *

CG13

CG14

CG15

CG16

. . . characterized by the materials

. . . . characterized by the refractive indices

. . . . characterized by the coefficient of thermal expansion

. . . . characterized by the hardness or viscosity

CG22

CG23

CG24

CG25

CG26

CG27

. . having rough surfaces or in a concave-convex shape

. . having lens functions

. . having reflection functions

. . having light diffusion functions

. . having two or more types of sealing members

. . having wiring materials formed on the surface of or inside of sealing members

CG32

. . characterized by the shapes or structures

CG42

CG43

CG45

. . having additives in sealing members, excluding wavelength converters

. . . Light diffusion members

. . having structures to prevent outflow of sealed parts, e.g., dam structures.

DA00
WAVELENGTH CONVERTERS, INCLUDING THOSE ARRANGED OUTSIDE PACKAGES

DA01

DA02

DA03

. for gaining the desired colors

. . of white color

. . of specified color temperatures, chromaticity coordinates, scopes of color reproduction, or color rendering indices

DA11

DA12

DA13

DA14

DA15

DA16

. Positioning

. . Sealed parts

. . Window members, including lenses

. . formed integrally with LED chips

. . outside packages

. . Others *

DA21

DA22

DA23

DA24

DA26

. having multiple types of the materials

. . having two types of the materials

. . having three types of the materials

. . having four or more types of the materials

. . using cascade excitation

DA32

DA34

DA35

DA36

. . having mixtures of multiple materials of wavelength converters

. . having multiple wavelength conversion layers

. . . with the layers laminated

. . . with the layers arranged laterally

DA41

DA42

DA43

DA44

DA45

DA46

DA47

DA48

DA49

. Materials

. . inorganic [claims only]

. . . Nitride systems, e.g., CASN [claims only]

. . . Oxynitride systems, e.g., sialon [claims only]

. . . Oxide systems, e.g., YAG [claims only]

. . . Sulfide systems, e.g., ZnS [claims only]

. . . Oxysulphide systems, e.g., Y2O2S [claims only]

. . . Halide systems [claims only]

. . organic [claims only]

DA52

DA53

DA54

DA55

DA56

. . Activation agents [claims only]

. . Eu [claims only]

. . Ce [claims only]

. . characterized by the materials

. . . characterized by the compositions

DA61

DA62

DA63

DA64

DA65

DA66

. characterized by the shapes or structures

. . characterized by the thickness

. . characterized by the particle sizes

. . . Nano phosphors

. . characterized by the added amount

. . characterized by the distribution of concentration

DA71

DA72

DA73

DA74

DA80

. of specified peak wavelengths (colors) of excitation sources

. . 380 nm or less (excluding purple)

. . . 380 nm or more and 490 nm or less (purple, blue)

. . Others

. Other characteristics *

DB00
OTHER MEMBERS

DB01

DB02

DB03

. Members of packages

. . Protective members, e.g., covers or caps.

. . . covering in an air-tight manner

DB12

DB13

DB14

DB15

DB16

DB17

DB18

DB19

DB20

. . Lenses

. . Fresnel lenses

. . Refractive members, e.g., prism

. . Polarization members

. . Light diffusion members

. . Shading members

. . Light guiding members

. . . Optical fibers

. . Wavelength separation elements (wavelength filters)

DB22

DB24

DB26

DB28

DB30

. . Receptors

. . Driving elements

. . Wavelength sensors

. . Temperature sensors

. . Others *

DB31

DB32

DB33

DB34

DB35

DB36

DB37

DB38

DB39

DB40

. Members outside packages

. . Lenses

. . . Fresnel lenses

. . Refractive members, e.g., prism

. . Polarization members

. . Light diffusion members

. . Shading members

. . Light guiding members

. . . Optical fibers

. . Wavelength separation elements (wavelength filters)

DB42

DB44

. . Reflection members

. . Heat dissipation members

DB52

DB54

DB56

DB58

DB60

. . Receptors

. . Driving elements

. . Wavelength sensors

. . Temperature sensors

. . Others having characteristic features *

EA00
ATTACHING PACKAGES

EA01

EA02

EA04

EA06

EA08

EA10

. Members on which packages are directly attached

. . Circuit boards

. . Flexible substrates

. . having special shapes

. . . characterized by the head dissipation

. . characterized by the wiring

EA11

EA12

EA14

EA16

EA18

EA20

. Structures by which packages are attached

. . by trenches or holes

. . holding elastically

. . by screws or nuts

. . by bonding or welding

. . removable

EA21

. using auxiliary tools

EA31

EA32

EA34

. Members on which multiple packages are attached

. . arranged in a one-dimensional array

. . arranged in a matrix or two-dimensional array

FA00
MANUFACTURING METHODS

FA01

FA03

. characterized by forming lead frames

. characterized by forming substrates or carriers

FA11

FA12

FA14

FA16

FA18

. of forming sealed members

. . Potting

. . Coating

. . Transfer molding

. . characterized by forming sealed members

FA21

FA23

FA24

FA26

FA28

FA30

. characterized by forming reflection members

. of forming wavelength conversion members

. . attaching the members (finished members)

. . by coating or printing

. . characterized by forming wavelength conversion members

. characterized by forming electrodes or wiring

FA31

FA32

FA34

FA36

FA38

FA40

. characterized by the mounting methods

. . transferring chips

. . characterized by bonding

. characterized by heating

. characterized by manufacturing devices

. Categorizing or ranking

FA41

FA42

FA44

FA46

FA48

FA50

. Manufacturing multiple LED packages in a bundled state

. . integrally sealed

. . separately sealed

. . Chip scale packages (CSP)

. . characterized by the separating method

. Other characteristic manufacturing methods *

GA00
USE

GA01

GA02

GA04

GA06

GA08

GA10

. Displays

. . Matrix

. . 7 segments

. Printer, copying machines, facsimiles or scanners

. Optical communication

. Decoration

GA11

GA12

GA14

. Light sources of back light for displays

. . directly under liquid crystal panels

. . edge lit

GA21

GA22

GA24

GA26

GA28

GA29

. Lights (GA11-GA14 take precedence)

. . LED light bulbs

. . Straight tube LED lights

. . Surface illuminance LED lights

. . for vehicles

. . . Head lamps

GA31

GA33

GA40

. for radiation of ultraviolet rays

. for radiation of infrared rays

. Others *

HA00
DRAWINGS

HA01

HA03

HA05

. of spectrum

. of directivity or intensity distribution of light

. of chromaticity

5F142	LED DEVICE PACKAGES
	H10H20/00@H ;20/00@L;20/01@A;20/85-20/858