F-Term-List

H01L21/68-21/68@Z

CA00
PROCESSING OBJECTS

CA01

CA02

CA04

CA05

CA07

CA09

. Circular boards

. . Wafers

. Rectangular boards

. . Glass boards or liquid crystal boards

. Masks or reticles

. Flexible boards or films

CA11

CA13

CA15

CA17

CA20

. Dummy or monitoring wafers, or the like

. Chips, pellets or dies

. Lead frames

. Finished products after being moulded or sealed

. Other objects

DA00
KINDS OF CONTAINERS

DA01

DA03

DA05

DA08

DA09

. Carriers or cassettes

. . for use in immersion processing (also classified in HA72)

. Trays for horizontal arrangement

. Box-shape containers for housing a plurality of wafers, or the like.

. . Cases for housing wafers with carriers

DA11

DA12

DA13

DA15

DA17

DA19

DA20

. for one sheet or piece

. . Box shape or case shape

. . Open type frames or holding frames or the like

. Protective tapes

. Shelves, stockers, cabinets or lockers

. Packages, e.g. boxes for transportation, sealing bags

. Other containers

EA00
STRUCTURES OF CONTAINERS

EA01

EA02

EA03

EA04

EA06

EA07

EA09

EA10

. Materials

. . using resins whose materials are specified

. . . characterised by fillers, additives, or the like.

. . . having coating layers

. characterised by the structure of carrier grooves

. . Inclined supports

. Structures for preventing housed objects from coming out excluding EA07

. Pressure members, spacers or cushions for preventing rattling

EA11

EA12

EA14

EA16

EA18

EA19

EA20

. Lid structures

. . characterised by engaging parts between lids and bodies

. Airtight structures including ones having ventilatory functions

. Information indicator parts, or information storage parts or built-in memories

. Other structural features

. . Inside of containers

. . Outside of containers

FA00
FORMS OF TRANSFER

FA01

FA02

FA03

FA04

FA05

FA07

FA09

. Transfer of wafers including dummies

. Transfer of boards including dummies other than wafers

. Transfer of containers

. Transfer of masks or reticles

. Other transfers

. for each single sheet or piece, or sheet type

. Batch transfer of a plural sheets or pieces

FA11

FA12

FA13

FA14

FA15

FA17

FA18

FA19

FA20

. Deliveries between containers and transfer means

. Deliveries between transfer means and securing or retaining parts during processing

. Deliveries between transfer means

. . transferring directly between transfer means

. . with intervention of relay parts, e.g. mounting stands

. characterised by attitude during transferring

. . vertical or inclined states

. . . carried in and out from containers in vertical directions

. . Reversed state

FA21

FA22

FA24

FA25

FA30

. rotating between horizontal and vertical states, or reversing from front to back

. . rotating or reversing transfer objects together with containers

. changing spaces or pitches

. . changing spaces of transfer objects while retaining them in transfer means

. Overlapping or peeling of wafers

GA00
TRANSFER DEVICES OR MEANS

GA01

GA02

GA03

GA04

GA05

GA06

GA07

GA08

GA09

GA10

. Retaining parts

. . Forks

. . . having a plurality of forks

. . . . capable of moving each fork independently

. . . characterised by the shape of parts for retaining wafers or the like

. . . . partially retaining with claws, protrusions, or the like or limitation of contact surfaces

. . . characterised by mechanisms for fixing wafers or the like on forks

. . . . vacuum adsorption

. . . . electrostatic adsorption

. . . . Gripping or sandwiching (also classified in GA12-16)

GA12

GA13

GA14

GA15

GA16

GA18

GA19

GA20

. . by gripping or sandwiching

. . . characterised by the structure of contact parts with retention objects

. . . characterised by opening or closing mechanisms of claws or fingers

. . . gripping end faces

. . . gripping front and back sides

. . Hooks

. . . hanging accessories for containers

. . . . hand-held

GA22

GA23

GA24

GA25

GA26

GA28

GA30

. . by vacuum adsorption excluding GA08

. . . for chips or collets

. . . for wafers or other boards

. . . other than for wafers, boards or chips

. . . characterised by adsorption surface structures

. . Bernoulli's chuck

. . Other retention mechanisms

GA32

GA33

GA35

GA36

GA37

GA38

GA40

. . characterised by the material of retaining parts

. . characterised by the methods of manufacturing or processing retaining parts

. . Transfer devices incorporated in additional mechanisms

. . . Sensors (see viewpoint JA)

. . . Heating or cooling functions

. . . Positioning mechanisms by pressing transferring objects against moulds (see viewpoint KA)

. . having a plurality of retaining parts that are usable by switching

GA41

GA42

GA43

GA44

GA45

GA46

GA47

GA48

GA49

GA50

. Arm parts

. . Drive mechanisms

. . . Link mechanisms

. . . Pantagraph mechanisms

. . . Articulated robot arms or manipulators

. . Operations

. . . Rotatable arms

. . . Entire arm support parts transferring in the horizontal direction

. . . Entire arm support parts transferring in the vertical direction

. . having a plurality of arms

GA51

GA52

GA53

GA54

GA55

GA56

GA57

GA58

GA59

GA60

. Belts or chains

. Walking beams or feed claws

. Rollers

. Rotary tables

. Pressures or pushrods

. Use of inclined surfaces

. Hand trucks (Flotation types are classified in GA61-65.)

. . Unmanned carriers

. . controlling the travel of hand trucks or unmanned carries

. Other mechanical transfers

GA61

GA62

GA63

GA64

GA65

GA67

GA68

GA69

. Floating transfer

. . Use of jets

. . . characterised by the arrangement or structure of nozzles

. . using magnetism

. . . Linear motors

. Hand-held tweezers

. . Grips

. . Adsorption

HA00
SECURING OR RETAINING DURING PROCESSING

HA01

HA02

HA03

HA05

HA06

HA07

HA08

HA09

HA10

. Stages, chucks or susceptors

. . characterised by the material of stages or the like

. . characterised by the manufacturing methods or processing methods of stages or the like

. . characterised by the contact surfaces with wafers or the like

. . . Projecting shapes

. . . Recessed shapes

. . . Unevenness or protrusions for limiting contact surfaces

. . . retaining wafers or the like while exposing the back side thereof

. . . only contact surfaces being different materials

HA12

HA13

HA14

HA16

HA17

HA18

HA19

. . Securing or retaining mechanisms

. . . Vacuum adsorption

. . . . characterised by the arrangement or structure of adsorption holes or grooves

. . . Electrostatic adsorption

. . . . characterised by electrode parts

. . . . . characterised by the shape or arrangement of electrodes

. . . . characterised by power sources or feeding parts

HA23

HA24

HA25

HA26

HA27

HA28

HA29

HA30

. . . Clamp or grip

. . . . gripping partially the periphery of wafers or the like, e.g. claw shape members

. . . . gripping the whole periphery of wafers or the like, e.g. ring shape members

. . . . Method of pressing wafers or the like

. . . . . pressing end faces by opening and closing claw shape pressing members

. . . . . pressing front and back sides by pinching them with placing parts and pressing members

. . . . . characterised by methods or mechanisms of generating pressing force

. . . . . . using elastic materials, e.g. springs

HA32

HA33

HA34

HA35

HA37

HA38

HA39

HA40

. . releasing securing forces or separating from retention surfaces

. . . Lift pins (Chip push-up is classified in MA40.)

. . . Gas jet

. . . removing residual charges in electrostatic adsorption

. . Heating mechanisms

. . Cooling mechanisms

. . supplying heat-conductive gases in the clearance between stages and wafers or the like

. . . having grooves for gas diffusion

HA42

HA44

HA45

HA46

HA48

HA50

. . Batch retention of a plurality of wafers or the like

. . having securing or retaining surfaces facing other than horizontally upward

. . . vertical

. . . downward

. . for wet treatment ( Immersion is classified in HA71.)

. . characterised by the mounting on processing device bodies

HA52

HA53

HA55

HA56

HA57

HA58

HA59

HA60

. . Operations

. . . Fine-adjustment tables or precise positioning

. . . . suppressing or removing the vibration of fine-adjustment tables

. . . Operations of stages other than fine-adjustment tables

. . . . Transfer in horizontal directions

. . . . Transfer in vertical directions

. . . . Rotation

. . . . Stages combined with a mechanism for carrying processing objects in/out of a processing chamber

HA61

HA62

HA63

HA64

HA65

HA66

HA67

. Heat treatment boats

. . characterised by materials

. . characterised by manufacturing methods

. . characterised by structures

. . . characterised by the structures of grooves or contacting parts with wafers

. . . . supporting wafers in an inclined state

. . Retaining or transferring of boats

HA71

HA72

HA73

HA74

HA78

HA80

. relating to immersion treatments into liquid tanks

. . Immersion of wafers or the like while they are retained in containers or jigs

. . Immersion of wafers or the like while they are directly retained in retaining parts

. . characterised by draining methods or draining structures

. Tapes or films

. Other securing or retaining

JA00
DETECTION

JA01

JA02

JA03

JA04

JA05

JA06

JA07

JA08

JA09

JA10

. Means or sensors

. . Optical sensors

. . . Line sensors

. . . Area sensors or cameras

. . . Detection of transmitted light

. . . Detection of reflected light

. . . characterised by optical path formation

. . Contact type sensors or pressure-sensitive sensors

. . Ultrasonic sensors or electrostatic capacitance sensors

. . Pressure sensors

JA12

JA13

JA14

JA15

JA17

JA19

. . Detection objects and sensors relatively moving during detection

. . . Movable sensors

. . . Movable detection objects

. . . Rotatary detection objects such as wafers

. . mounting a plurality of sensors relative to one detection object

. . Batch detection of a plurality of detection objects with a plurality of sensors

JA21

JA22

JA23

JA25

JA27

JA28

JA29

JA30

. Detection purposes

. . Presence or absence of existence, or existing positions, e.g. addresses

. . . Objects being grooves of boats or carriers, or housed wafers or the like.

. . Displacement in containers, e.g. inclination or extrusion

. . Deviations of securing or retaining position

. . . Deviations of direction or orientation

. . . Centre deviations

. . . Height deviation or inclination

JA31

JA32

JA33

JA34

JA35

JA36

JA37

JA38

JA39

JA40

. Detected information

. . Dimensional information, e.g. distance, thickness or angle

. . Information on shapes

. . . Orientation flats

. . . Notches

. . . Edges or end faces excluding JA34 and JA35

. . . Characteristic patterns

. . . . Positioning marks

. . . . Scribe lines

. . . Overviews, outward appearances or sizes

JA42

JA43

JA45

JA46

JA47

JA49

JA50

. . Front and back sides

. . The number of sheets or pieces

. . Physical quantities

. . . Temperature

. . . Pressure

. . Identification information, e.g. bar codes or memory information

. . . Information added to wafers and boards

JA51

. characterised by processing of detected signals

KA00
POSITIONING

KA01

KA02

KA03

KA04

KA05

KA06

KA07

KA08

KA10

. moving only wafers or the like

. . pressing objects against moulds

. . Tapers, steps or positioning pins

. . Rotation by rollers

. moving objects to be positioned together with placing parts such as stages

. . Horizontal directions or X to Y

. . Vertical directions or Z, or inclination

. . Rotation or theta

. controlling transfer means to move wafers or the like

KA11

KA12

KA13

KA14

KA15

KA17

KA18

KA20

. aligning centres

. aligning directions or orientations

. . aligning orientation flats

. . aligning notches

. Other positioning of wafers or boards

. characterised by attitude in positioning, e.g. inclined state

. positioning in two steps or more

. Positioning of objects other than wafers or boards

LA00
OPERATION MECHANISMS OR THE LIKE

LA01

LA02

LA03

LA04

LA06

LA07

LA08

LA09

LA10

. characterised by bearings or sliding parts

. . Contactless support or floating support

. . . by jets

. . . using magnetic forces

. characterised by power sources

. . Motors

. . . Linear motors excluding GA65

. . . Stepping motors

. . Piezoelectric effect

LA11

LA12

LA13

LA14

LA15

LA16

LA18

. Power transmission mechanisms

. . Ball screws or transfer screws

. . Belts or chains

. . Gears

. . Cylinders or pistons

. . Links or pantagraph mechanisms excluding GA43 and GA44

. characterised by cable parts, e.g. signals or sources

MA00
PROCESSING DEVICES

MA01

MA02

MA03

MA04

MA06

MA07

MA09

. Devices or modules comprising an integration of a plurality of processing units

. . integrated in the upward and downward directions

. . horizontally integrated

. . . Radial arrangement

. combining a plurality of devices or modules via transfer paths

. . characterised by interface parts between devices and transfer paths

. characterised by the layout of each device or device groups (specified mutual positional relations or arrangements between devices or device groups)

MA11

MA13

MA15

MA16

MA17

. characterised by parts for loading wafers or the like on devices

. . characterised by transfer systems of loading parts

. . characterised by loading devices with containers, e.g. carriers

. . . characterised by the arrangements, e.g. position, direction of containers

. . . characterised by fixing of containers to devices

MA21

MA22

MA23

MA24

MA25

MA26

MA27

MA28

MA29

MA30

. Processes

. . Polishing

. . Cleaning (Cleaning of containers or transfer mechanisms is classified in PA24.)

. . Wet etching or developing

. . Plating

. . Resist coating or other spin coating

. . Exposure

. . CVD or diffusion

. . PVD, e.g. sputtering or vacuum deposition

. . Heat treatment or annealing

MA31

MA32

MA33

MA34

MA35

MA37

MA38

MA39

MA40

. . Ion implantation

. . Dry etching

. . Tests, measurements or inspections

. . Dicing or scribing

. . Bonding or mounting

. . Adhesion of tapes

. . Tape peeling

. . . Adhesion-reducing treatments

. . . Chip push-up

NA00
ATMOSPHERE CONTROL

NA01

NA02

NA03

NA04

NA05

NA07

NA08

NA09

NA10

. Atmosphere

. . Clean air

. . . characterised by the formation or introduction of air

. . Inert gas

. . Vacuum

. Loading and unloading, or transfer in atmosphere

. . characterised by transfer tunnels or clean tunnel parts

. . characterised by gate or shutter parts

. . . characterised by the mechanisms for opening or closing lids of box-shape containers

NA11

NA13

NA14

NA15

NA16

NA17

NA18

NA20

. Monitoring of atmosphere including dust particles

. Dust proof or dust removal

. . Absorption

. . Blowing off or ventilation

. . . Control of airflow, e.g. direction

. . making one space under positive pressure

. . Dust proof covers or isolation of dust generating sources

. Other atmosphere controls

PA00
SPECIAL PURPOSES

PA01

PA02

PA03

PA04

PA05

PA06

PA07

PA08

PA09

PA10

. Process control or production control

. . Transfer control

. . . controlling the timing of carrying transfer objects in and out of transfer parts

. . . including control of processing devices as well

. . responsive to processes or system changes

. . Improvement of maintenance characteristics

. . . facilitating the detachment and attachment, or replacement of members

. . Malfunction prevention or safety supervision

. . Improvement of operability, e.g. use of touch panels

. . characterised by control during occurrence of errors or recovery methods

PA11

PA13

PA14

PA16

PA18

PA20

. responsive to adverse thermal effects

. responsive to deformations or warpages of wafers or the like

. . Improvement of flatness during securing of wafers to stages or the like

. responsive to wafers or the like of irregular shapes or various sizes

. responsive to upsizing of wafers or the like

. Prevention of failures of wafers or the like

PA21

PA23

PA24

PA25

PA26

PA30

. Antistatic measures or electricity removal excluding HA35

. Contamination prevention excluding viewpoint NA

. . cleaning containers or transfer mechanisms, or the like

. . changing transfer retention parts for each process (see viewpoint GA)

. . Prevention of elution or generation of contaminants from members

. Other purposes

5F031	Containers, movement, fixing, and positioning of semiconductor wafers
	H01L21/68 -21/68@Z