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| 5F061 | ENCAPSULATION OF AND COATINGS FOR SEMICONDUCTOR OR SOLID STATE DEVICES | |
| H01L21/56 -21/56@Z | ||
| H01L21/56-21/56@Z | AA | AA00 TYPES OF SEALING |
AA01 | AA02 | AA03 | AA04 | ||||||
| . Resin sealing | . . Multi-layer resin sealing (i.e., including protective film layers) | . Glass sealing | . Sealing by other than resin or glass | |||||||||
| BA | BA00 FORMS OF MEMBERS FOR MOUNTING ELEMENTS |
BA01 | BA02 | BA03 | BA04 | BA05 | BA07 | |||||
| . Lead-frame-mounted types | . . Variants mounted onto stepped or bent frames | . Substrate-mounted types | . . Types mounted on printed circuit board | . Types mounted on films or tape carriers (i.e., including printed circuits) | . Others | |||||||
| CA | CA00 MOLDING APPARATUSES (I.E., INCLUDING ACCESSORY APPARATUSES) |
CA01 | CA02 | CA03 | CA04 | CA05 | CA06 | CA07 | CA08 | CA09 | CA10 | |
| . Casting (i.e., dies are removed afterward) | . Injection of liquid materials into a case, e.g., resins | . Melting of pellets, tablets, or powders | . Potting (i.e., excluding the aforementioned methods) | . . Drip coating | . . . Means for preventing flowing out | . Dipping | . . Dipping into liquid materials, e.g., resins | . . Dipping into fluid powders, e.g., resins | . Coating (i.e., excluding the aforementioned methods) | |||
| CA11 | CA12 | |||||||||||
| . . Roller coating | . . Screen or print coating | |||||||||||
| CA21 | CA22 | CA24 | CA26 | |||||||||
| . Injection or transfer molding | . Press molding | . Heat shrinking of resin films | . Others | |||||||||
| CB | CB00 PROCESSING INTO SEALING LAYERS OR PROTECTIVE FILM LAYERS |
CB01 | CB02 | CB03 | CB04 | CB05 | CB06 | CB07 | ||||
| . Layers in which materials are selectively processed | . . Sealing layers | . . . Epoxy resin layers | . . Protective film layers | . . . Insulating film layers | . . . . Inorganic film layers | . . . Conductive film layers | ||||||
| CB11 | CB12 | CB13 | ||||||||||
| . Processing into sealing layers or protective film layers | . . Pre-treatment | . . After-treatment | ||||||||||
| DA | DA00 MOLDING APPARATUSES (I.E., INCLUDING ACCESSORY APPARATUSES) |
DA01 | DA02 | DA03 | DA04 | DA05 | DA06 | DA07 | DA08 | DA09 | ||
| . Dies | . . Fluid sections, e.g., resins | . . . Pots (i.e., including cull sections) | . . . Runners (i.e., pots take precedence) | . . . Gates | . . . Cavities | . . . Combinations of runners, gates, and cavities | . . Gas exhaust sections | . . Variants characterized by die materials | ||||
| DA11 | DA12 | DA13 | DA14 | DA15 | DA16 | |||||||
| . Molding machines | . . Press-in plunger devices | . . . Multiple plunger apparatuses | . . Die tightening and opening or clamping apparatuses | . . Incorporation of ejector devices | . . Incorporation of heating or cooling devices | |||||||
| DB | DB00 CONTROLLING AND AUTOMATION OF MOLDING APPARATUSES |
DB01 | DB02 | |||||||||
| . Controlling of molding conditions (e.g., temperature and pressure) | . Continuous automation of multiple processes | |||||||||||
| DC | DC00 MOLDING APPARATUS MAINTENANCE |
DC01 | ||||||||||
| . Molding apparatus maintenance | ||||||||||||
| DD | DD00 LEAD FRAMES FOR SEALING, AND LOADING, UNLOADING AND PROCESSING THEREOF |
DD01 | DD02 | DD03 | DD04 | |||||||
| . Lead frame loading and unloading apparatuses | . . Feed and storage apparatuses | . . . Loading apparatuses | . . Combination with mold processing | |||||||||
| DD11 | DD12 | DD13 | DD14 | |||||||||
| . Lead frames for sealing | . . Variants characterized by shape | . . Manufacturing or processing | . . . Film and coating processing | |||||||||
| DE | DE00 PELLETS, TABLETS, AND POWDERS (I.E., INCLUDING ACCESSORY APPARATUSES) |
DE01 | DE02 | DE03 | DE04 | DE05 | DE06 | |||||
| . Pellets, tablets, and powders | . . Variants characterized by shape | . . Variants characterized by materials | . . Manufacturing or processing | . . . Variants that include preheating | . . Feed and storage apparatuses | |||||||
| EA | EA00 MEASURES AGAINST BURRS OR FLASH IN RESIN AND THE LIKE |
EA01 | EA02 | EA03 | ||||||||
| . Prevention or reduction of the occurrence of burring | . . Die processing | . . Lead frame processing | ||||||||||
| EA11 | EA12 | EA13 | EA14 | EA15 | EA16 | EA17 | ||||||
| . Removal of burrs | . . Dry processing | . . . Mechanical processing | . . . Thermal processing | . . Wet processing | . . . Chemical and electrochemical processing | . . Combinations of the aforementioned types of processing | ||||||
| FA | FA00 APPLICATIONS |
FA01 | FA02 | FA03 | FA04 | FA05 | FA06 | |||||
| . Use for optical semiconductors | . Use for hybrid integrated circuits (HIC) | . Use for integrated circuit cards | . Use for preventing alpha-ray irradiation | . Use for heat radiation | . Others | |||||||
| GA | GA00 OTHERS |
GA01 | GA02 | GA03 | GA05 | |||||||
| . Indication and identification processing | . Unsealing | . Testing, measuring, and evaluating of sealing | . Others |