Japanese
close

FI-MainGroup/Facet-Choice

Building up of layers, structures or materials[2026.01]
  • H10P10/00
    		•  Building up of layers, structures or materials[2026.01]
    		HB CC 5F120
  • H10P14/00
    		•  Formation of materials, e.g. in the shape of layers or pillars[2026.01] HB CC 5F152
    Modification of layers, structures or materials[2026.01]
  • H10P30/00
    		•  Modification of layers, structures or materials[2026.01] HB CC 5F054
  • H10P32/00
    		•  Diffusion of dopants within, into, or out of wafers, substrates or parts of devices (during formation of materials H10P0014000000)[2026.01] HB CC 5F042
  • H10P34/00
    		•  Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices[2026.01] HB CC 5F054
  • H10P36/00
    		•  Gettering within semiconductor bodies[2026.01] HB CC 5F054
    Removal of layers, structures or materials[2026.01]
  • H10P50/00
    		•  Removal of layers, structures or materials[2026.01] HB CC 5F004
  • H10P52/00
    		•  Grinding, lapping or polishing of wafers, substrates or parts of devices[2026.01] HB CC 5F057
  • H10P54/00
    		•  Cutting or separating of wafers, substrates or parts of devices[2026.01]
    		HB CC 5F057
  • H10P56/00
    		•  Debonding of wafers, substrates or parts of devices[2026.01] HB CC 5F120
  • H10P58/00
    		•  Singulating wafers or substrates into multiple chips, i.e. dicing[2026.01]
    		HB CC 5F063
    Other manufacture or treatment[2026.01]
  • H10P70/00
    		•  Other manufacture or treatment[2026.01]
    		HB CC 5F157
  • H10P72/00
    		•  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof[2026.01] HB CC 5F131
  • H10P74/00
    		•  Testing or measuring during manufacture or treatment of wafers, substrates or devices[2026.01] HB CC 4M106
  • H10P76/00
    		•  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography[2026.01] HB CC 5F246
  • H10P90/00
    		•  Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement[2026.01]
    		HB CC 5F116
  • H10P95/00
    		•  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass[2026.01] HB CC 5F117
    TOP