FI (Note)/(Index) list

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H10P54/00 Cutting or separating of wafers, substrates or parts of devices[2026.01]

Note(s)
    This group covers cutting or separating of wafers or substrates having semiconductor or solid-state devices formed, or to be formed, therein or thereon. The cutting may be partial, e.g. for making a groove.[2026.01]