FI (Note)/(Index) list

Descriptions for H10P70/00 and notes/indexes are displayed on this screen.

H10P70/00 Other manufacture or treatment[2026.01]

Note(s)
    This group does not cover the cleaning of package elements, package parts or other constructional details, e.g. cleaning of packages after moulding, which are covered by the related groups of subclass H10W.[2026.01]