H10P90/00	Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement[2026.01]
	Note(s) This group covers multistep processes for the preparation of wafers before the subsequent manufacture of semiconductor devices or solid-state devices therein or thereon.[2026.01]This group does not cover the single-crystal growth of semiconductor ingots, which is covered by subclass C30B.