H10P10/00

Building up of layers, structures or materials[2026.01]

Note(s) This group covers bonding of wafers or substrates either (i) before the step of making of any interconnections or (ii) before the step of packaging of devices, whichever step comes first.[2026.01]Attention is drawn to the following: aspects of bonding involving chips, package parts or interconnections, e.g. chip-on-chip bonding or chip-on-wafer bonding, are classified in subclass H10W, e.g. in group H10W 80/00.