On this page, you can select 「MainGroup」 or 「Facet」 in C23C. |
HB:Handbook | ||||
Select the desired 「MainGroup」 or 「facet」 etc. |
CC:Concordance |
Coating by applying the coating material in the molten state[4] | |||||
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Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor [4] | HB | CC | 4K027 | |
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Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge (built-up welding B23K, e.g. B23K 5/18, B23K 9/04; spraying guns B05B; making alloys containing fibres or filaments by thermal spraying of metal C22C 47/16; plasma guns H05H) [4] | HB | CC | 4K031 | |
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Coating by casting molten material on the substrate [4] | HB | CC | 4K031 | |
Solid state diffusion into metallic material surfaces[4] | |||||
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Solid state diffusion of only non-metal elements into metallic material surfaces (diffusion of silicon C23C 10/00); Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals (C23C 14/00 takes precedence) [4] | HB | CC | 4K028 | |
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Solid state diffusion of only metal elements or silicon into metallic material surfaces [4] | HB | CC | 4K028 | |
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Solid state diffusion of at least one non-metal element other than silicon and at least one metal element or silicon into metallic material surfaces [4] | HB | CC | 4K028 | |
Coating by vacuum evaporation, by sputtering or by ion implantation[4] | |||||
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Coating by vacuum evaporation, by sputtering or by ion implantation [4] | HB | CC | 4K029 | |
Chemical deposition or plating by decomposition; Contact plating[4] | |||||
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Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes (reactive sputtering or vacuum evaporation C23C 14/00) [2006.01] | HB | CC | 4K030 | |
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Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating [4] | HB | CC | 4K022 | |
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Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating [4] | HB | CC | 4K022 | |
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Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals [4] | HB | CC | 4K026 | |
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Coating starting from inorganic powder (spraying of the coating material in molten state C23C4/00; solid state diffusion C23C8/00-C23C12/00) [4] | HB | CC | 4K044 | |
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Coating not provided for in groups C23C 2/00-C23C 24/00 [4] | HB | CC | 4K044 | |
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Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups C23C 2/00-C23C 26/00, or by combinations of methods provided for in subclasses C23C and C25D [4] | HB | CC | 4K044 | |
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Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process (C23C 26/00, C23C 28/00 take precedence) [4] | HB | CC | 4K044 | |