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| 4K029 | PHYSICAL VAPOUR DEPOSITION | |
| C23C14/00 -14/58@Z | ||
| C23C14/00-14/58@Z | AA | AA00 SUBSTRATE |
AA01 | AA02 | AA04 | AA05 | AA06 | AA07 | AA08 | AA09 | ||
| . Materials | . . Metallic materials | . . Inorganic materials | . . . Boron | . . . Silicon | . . . Aluminium oxide (Al2O3) | . . . Silicon dioxide or silica | . . . Glass | |||||
| AA11 | ||||||||||||
| . . Organic materials | ||||||||||||
| AA21 | AA22 | AA23 | AA24 | AA25 | AA26 | AA27 | AA29 | |||||
| . Shape | . . Grains powders or spheres | . . Wires | . . Sheets | . . Films strips or long bodies | . . Containers | . . Tubes | . having differences in surface levels | |||||
| BA | BA00 COATING MATERIAL |
BA01 | BA02 | BA03 | BA04 | BA05 | BA06 | BA07 | BA08 | BA09 | BA10 | |
| . Metallic materials | . . Elemental metals | . . . Aluminium | . . . Silver | . . . Gold | . . . Cobalt | . . . Chromium | . . . Copper | . . . Iron | . . . Indium | |||
| BA11 | BA12 | BA13 | BA14 | BA15 | BA16 | BA17 | BA18 | |||||
| . . . Molybdenum | . . . Nickel | . . . Platinum | . . . Antimony | . . . Tin | . . . Tantalum | . . . Titanium | . . . Zinc | |||||
| BA21 | BA22 | BA23 | BA24 | BA25 | BA26 | |||||||
| . . Alloys | . . . Alloys based on noble metals | . . . Alloys based on aluminium | . . . Alloys based on cobalt | . . . Alloys based on nickel | . . . Alloys based on iron | |||||||
| BA31 | BA32 | BA33 | BA34 | BA35 | ||||||||
| . Inorganic materials | . . Elements | . . . Boron | . . . Carbon | . . . Silicon | ||||||||
| BA41 | BA42 | BA43 | BA44 | BA45 | BA46 | BA47 | BA48 | BA49 | BA50 | |||
| . . Compounds | . . . Fluorides | . . . Oxides | . . . . Aluminium oxides (AlO) | . . . . Indium oxides (InO) | . . . . Silicon oxides (SiO) | . . . . Tin oxides (SnO) | . . . . Titanium oxides (TiO) | . . . . Zinc oxides (ZnO) | . . . . Double oxides | |||
| BA51 | BA52 | BA53 | BA54 | BA55 | BA56 | BA57 | BA58 | BA59 | BA60 | |||
| . . . Sulfides | . . . Silicides | . . . Borides | . . . Carbonitrides | . . . Carbides | . . . . Silicon carbide (SiC) | . . . . Tungsten carbide (WC) | . . . Nitrides | . . . . Boron nitride (BN) | . . . . Titanium nitride (TiN) | |||
| BA62 | BA64 | |||||||||||
| . Organic materials | . Mixtures | |||||||||||
| BB | BB00 COATING STRUCTURE |
BB01 | BB02 | BB03 | BB04 | BB07 | BB08 | BB09 | BB10 | |||
| . Coating form | . . Multi-layer coating | . . Partial or patterned coating | . . Double-sided coating | . Crystal structure | . . Polycrystalline | . . Monocrystalline | . . Non-crystalline or amorphous | |||||
| BC | BC00 COATING PROPERTY |
BC01 | BC02 | BC03 | BC04 | BC05 | BC06 | BC07 | BC08 | BC09 | BC10 | |
| . Corrosion resistance | . Abrasion resistance | . Conductivity | . . Superconductivity | . Electrical resistance | . Magnetic properties | . Optical properties | . . Translucency or transparency | . Transparency and conductivity | . Thermal properties | |||
| BD | BD00 USE OF COATING |
BD01 | BD02 | BD03 | BD04 | BD05 | BD06 | BD07 | BD08 | BD09 | BD10 | |
| . Semiconductor devices | . . Lead frames or wiring materials | . Mechanical parts | . . Sliding members | . Tools | . Decorative articles | . Clock parts | . Photosensitive materials for electrophotography | . Reflective mirrors or reflective films | . Transfer foils | |||
| BD11 | BD12 | |||||||||||
| . Magnetic recording media | . . Photomagnetic recording media | |||||||||||
| CA | CA00 COATING TREATMENT METHOD |
CA01 | CA02 | CA03 | CA04 | CA05 | CA06 | CA07 | CA08 | CA09 | CA10 | |
| . Vacuum deposition | . . Reactivity | . Ion plating or ion beam vapour deposition | . . Reactivity | . Sputtering | . . Reactivity | . Ion beam mixing | . . using both sputtering and ion beam irradiation | . . using both vapour deposition and ion beam irradiation | . Ion implantation | |||
| CA11 | CA12 | CA13 | CA15 | CA17 | ||||||||
| . Polymerisation of organic monomers | . . using plasma | . providing the substrate with bias potential | . Diagonal irradiation of substrates by particle beams | . Vibration or rotation of substrate | ||||||||
| DA | DA00 TREATMENT APPARATUS IN GENERAL |
DA01 | DA02 | DA03 | DA04 | DA05 | DA06 | DA08 | DA09 | DA10 | ||
| . Cells or bell jars | . Vacuum discharge apparatuses | . Monitoring apparatuses in cells | . Gas introducing apparatuses | . . Blow-out nozzles | . . . Arrangement | . Apparatus for heating substrates | . Cleaning apparatuses in cells | . . Bodies to prevent adherence of particles | ||||
| DA12 | DA13 | |||||||||||
| . Shutter apparatuses | . . Composite shutters | |||||||||||
| DB | DB00 VAPOUR DEPOSITION APPARATUS |
DB01 | DB02 | DB03 | DB04 | DB05 | DB06 | DB07 | DB08 | DB09 | DB10 | |
| . Evaporation materials or substances | . . Materials | . . . Elemental metals | . . . Alloys | . . . Inorganic compounds | . . . Organic substances | . . Shape | . . . Pellets sheets or rods | . . . Wires or filaments | . . . Powders or grains | |||
| DB11 | DB12 | DB13 | DB14 | DB15 | DB17 | DB18 | DB19 | DB20 | ||||
| . Crucibles or evaporating material containers | . . Shape or structure | . . Materials | . . having multiple crucibles | . Evaporating materials supply means | . Evaporating materials heating apparatus | . . Resistance heating | . . Induction heating | . . Lasers | ||||
| DB21 | DB22 | DB23 | DB24 | |||||||||
| . . Electron beams | . . . Beam scanning | . . . Rotation or movement of crucible | . . . cooling crucible | |||||||||
| DC | DC00 SPUTTERING APPARATUS |
DC01 | DC02 | DC03 | DC04 | DC05 | DC06 | DC07 | DC08 | DC09 | ||
| . Targets | . . Materials | . . . Elemental metals | . . . Alloys | . . . Inorganic compounds | . . . Organic substances | . . Manufacturing methods | . . . Melting and casting | . . . Sintering | ||||
| DC12 | DC13 | DC15 | DC16 | DC18 | DC20 | |||||||
| . . Shapes | . . . Tubular or rod-shaped | . . Composite targets | . . having multiple targets | . Sputter guns or S-guns | . Grounding shields or shield rings | |||||||
| DC21 | DC22 | DC23 | DC24 | DC25 | DC26 | DC27 | DC28 | DC29 | DC30 | |||
| . Packing plates | . . Target mounting | . . . using jigs | . . . using brazing or soldering | . . Cooling mechanisms | . Sputtering methods | . . using discharge plasma | . . . Electrode arrangement | . . . . Double pole systems | . . . . . Coaxial types | |||
| DC31 | DC32 | DC33 | DC34 | DC35 | DC37 | DC39 | DC40 | |||||
| . . . . Three or four pole systems | . . . . Opposing target types | . . . Power sources | . . . . Direct current | . . . . High frequency | . . Ion beam sputtering | . . Magnetron sputtering | . . . using permanent magnets | |||||
| DC41 | DC42 | DC43 | DC44 | DC45 | DC46 | DC48 | ||||||
| . . . using electromagnets | . . . Magnet shape or structure | . . . Magnet arrangement | . . . Relative motion of targets or magnets | . . . . Rotation of targets or magnets i.e. rotation or revolution | . . . . Movement of targets or magnets i.e. vertical or horizontal | . . Electron cyclotron resonance (ECR) application using microwaves | ||||||
| DD | DD00 ION PLATING APPARATUS |
DD01 | DD02 | DD03 | DD04 | DD05 | DD06 | |||||
| . Direct current discharge | . High frequency discharge | . Cluster ion beam | . Thermionic cathode | . Hot-carrier diode (HCD) types having electron guns | . Arc discharge | |||||||
| DE | DE00 ION IMPLANTATION OR ION BEAM MIXING APPARATUS |
DE01 | DE02 | DE03 | DE04 | DE05 | DE06 | |||||
| . Ion beam generators | . . Ion sources | . . Ion separators | . . Ion accelerators | . Ion beam deflectors | . Ion beam scanners | |||||||
| EA | EA00 MEASUREMENT OR CONTROL |
EA01 | EA02 | EA03 | EA04 | EA05 | EA06 | EA07 | EA08 | EA09 | ||
| . Film thickness | . Evaporating or sputtering speed | . Gas pressure or degree of vacuum | . Gas flow rate | . Gas composition | . Plasma | . Vapour flow distribution | . Substrate temperature | . Power supply | ||||
| FA | FA00 PRETREATMENT |
FA01 | FA02 | FA03 | FA04 | FA05 | FA06 | FA07 | FA09 | |||
| . Pretreatment of substrates | . . Roughening | . . Smoothing | . . Washing or cleaning | . . Discharge or plasma treatment | . . Heat treatment | . . Formation of resin backing or undercoating layers | . Pretreatment in tank | |||||
| GA | GA00 AFTER-TREATMENT |
GA01 | GA02 | GA03 | GA05 | |||||||
| . Heat treatment | . Discharge or plasma treatment | . Formation of resin layers or top coat layers | . Separation of films from substrates | |||||||||
| HA | HA00 PARTIAL COATING METHOD |
HA01 | HA02 | HA03 | HA04 | HA05 | HA07 | |||||
| . using mechanical masks | . . Mask materials | . . Mask shape or structure | . . Mask fixing means | . using masking agents | . using resists | |||||||
| JA | JA00 SUBSTRATE SUPPORT |
JA01 | JA02 | JA03 | JA05 | JA06 | JA08 | JA10 | ||||
| . Substrate holders | . . Rotating mechanisms | . . . Planetary systems | . Means for attaching substrates to holders | . . using jigs | . Rotation of substrates per se | . Long support rollers | ||||||
| KA | KA00 CONTINUOUS TREATMENT |
KA01 | KA02 | KA03 | KA05 | KA06 | KA07 | KA09 | ||||
| . Transport of substrates | . . Substrate housing containers or cassettes | . . Transport rollers | . Sealing apparatuses | . . Liquid seals | . . Roll seals | . Feeding and discharging chambers of substrate or auxiliary vacuum chambers |