FI (list display)

  • C23C26/00
  • Coating not provided for in groups C23C 2/00-C23C 24/00 [4] HB CC 4K044
  • C23C26/00@A
  • Coating material (D to M take precedence) HB CC 4K044
  • C23C26/00@B
  • .Metallic material HB CC 4K044
  • C23C26/00@N
  • ..With intermediate formation of a liquid phase in the layer HB CC 4K044
  • C23C26/00@C
  • .Inorganic non-metallic material HB CC 4K044
  • C23C26/00@D
  • Discharge coating HB CC 4K044
  • C23C26/00@G
  • .By contact opening HB CC 4K044
  • C23C26/00@E
  • Applying high energy fixing (including cases where subtracted are melted) HB CC 4K044
  • C23C26/00@H
  • .With gaseous additional ingredients being HB CC 4K044
  • C23C26/00@J
  • .Without using additional ingredients HB CC 4K044
  • C23C26/00@F
  • Colouring HB CC 4K044
  • C23C26/00@K
  • Impregnation, filling HB CC 4K044
  • C23C26/00@L
  • Surface treatment process not characterized by coating method HB CC 4K044
  • C23C26/00@M
  • .Treatment of coating, e.g. discharge, friction (when substrate is no melted HB CC 4K044
  • C23C26/00@Z
  • Others HB CC 4K044
  • C23C26/02
  • .applying molten material to the substrate [4] HB CC 4K044
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