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  • C23C18/00
    		•  Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating [4]
    		HB CC 4K022
  • C23C18/02
    		•  .by thermal decomposition [4] HB CC 4K022
  • C23C18/04
    		•  ..Pretreatment of the material to be coated (C23C 18/06 takes precedence) [4] HB CC 4K022
  • C23C18/06
    		•  ..Coating on selected surface areas, e.g. using masks [4] HB CC 4K022
  • C23C18/08
    		•  ..characterised by the deposition of metallic material [4] HB CC 4K022
  • C23C18/10
    		•  ...Deposition of aluminium only [4] HB CC 4K022
  • C23C18/12
    		•  ..characterised by the deposition of inorganic material other than metallic material [4] HB CC 4K022
  • C23C18/14
    		•  .Decomposition by irradiation, e.g. photolysis, particle radiation [4] HB CC 4K022
  • C23C18/16
    		•  .by reduction or substitution, i.e. electroless plating (C23C 18/54 takes precedence) [4] HB CC 4K022
  • C23C18/16@A
    		•  Characterized by plastic substrates HB CC 4K022
  • C23C18/16@B
    		•  Plating on semiconductor surfaces HB CC 4K022
  • C23C18/16@Z
    		•  Others HB CC 4K022
  • C23C18/18
    		•  ..Pretreatment of the material to be coated [4] HB CC 4K022
  • C23C18/20
    		•  ...of organic surfaces, e.g. resins [4] HB CC 4K022
  • C23C18/20@A
    		•  Irradiation of electromagnetic waves HB CC 4K022
  • C23C18/20@Z
    		•  Others HB CC 4K022
  • C23C18/22
    		•  ....Roughening, e.g. by etching [4] HB CC 4K022
  • C23C18/24
    		•  .....using acid aqueous solutions [4] HB CC 4K022
  • C23C18/26
    		•  .....using organic liquids [4] HB CC 4K022
  • C23C18/28
    		•  ....Sensitising or activating [4] HB CC 4K022
  • C23C18/30
    		•  .....Activating [4] HB CC 4K022
  • C23C18/31
    		•  ..Coating with metals [5] HB CC 4K022
  • C23C18/31@A
    		•  Coating on specific articles (excluding printed boards) HB CC 4K022
  • C23C18/31@E
    		•  Devices HB CC 4K022
  • C23C18/31@Z
    		•  Others HB CC 4K022
  • C23C18/32
    		•  ...Coating with one of iron, cobalt or nickel; Coating with mixtures of phosphorus or boron with one of these metals [4,5] HB CC 4K022
  • C23C18/34
    		•  ....using reducing agents [4,5] HB CC 4K022
  • C23C18/36
    		•  .....using hypophosphites [4,5] HB CC 4K022
  • C23C18/38
    		•  ...Coating with copper [4,5] HB CC 4K022
  • C23C18/40
    		•  ....using reducing agents [4,5] HB CC 4K022
  • C23C18/42
    		•  ...Coating with noble metals [4,5] HB CC 4K022
  • C23C18/44
    		•  ....using reducing agents [4,5] HB CC 4K022
  • C23C18/48
    		•  ..Coating with alloys [4,5] HB CC 4K022
  • C23C18/50
    		•  ...with alloys based on iron, cobalt or nickel (C23C 18/32 takes precedence) [4,5] HB CC 4K022
  • C23C18/52
    		•  ..using reducing agents for coating with metallic material not provided for in a single one of groups C23C 18/32-C23C 18/50 [4] HB CC 4K022
  • C23C18/52@A
    		•  Using grain diffusion composite plating liquid HB CC 4K022
  • C23C18/52@B
    		•  Laminated plating HB CC 4K022
  • C23C18/52@Z
    		•  Others HB CC 4K022
  • C23C18/54
    		•  .Contact plating, i.e. electroless electrochemical plating [4] HB CC 4K022
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