FI-MainGroup/Facet-Choice

Volatile memory devices[2023.01]
  • H10B10/00
  • Static random access memory [SRAM] devices [2023.01] HB CC 5F083
  • H10B12/00
  • Dynamic random access memory [DRAM] devices [2023.01] HB CC 5F083
    Non-volatile memory devices[2023.01]
  • H10B20/00
  • Read-only memory [ROM] devices [2023.01] HB CC 5F083
  • H10B41/00
  • Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates [2023.01] HB CC 5F083
  • H10B43/00
  • EEPROM devices comprising charge-trapping gate insulators [2023.01] HB CC 5F083
  • H10B51/00
  • Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors [2023.01] HB CC 5F083
  • H10B53/00
  • Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors [2023.01] HB CC 5F083
  • H10B61/00
  • Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices [2023.01] HB CC 4M119
  • H10B63/00
  • Resistance change memory devices, e.g. resistive RAM [ReRAM] devices [2023.01] HB CC 5F083
  • H10B69/00
  • Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B 41/00-H10B 63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices [2023.01] HB CC 5F083
  • H10B80/00
  • Assemblies of multiple devices comprising at least one memory device covered by this subclass [2023.01] HB CC 5F037
  • H10B99/00
  • Subject matter not provided for in other groups of this subclass [2023.01] HB CC 5F083
    TOP