FI-MainGroup/Facet-Choice

Constructional details of integrated devices in chips, wafers or substrates[2026.01]
  • H10W10/00
  • (Not Translated) HB CC 5F032
  • H10W15/00
  • (Not Translated) HB CC 5F032
  • H10W20/00
  • (Not Translated) HB CC 5F033
  • H10W29/00
  • (Not Translated) HB CC 5F032
    Constructional details related to chips, wafers, substrates or packages[2026.01]
  • H10W40/00
  • (Not Translated) HB CC 5F136
  • H10W42/00
  • (Not Translated) HB CC 5F069
  • H10W44/00
  • (Not Translated) HB CC 5F065
  • H10W46/00
  • (Not Translated) HB CC 5F117
    Aspects of packages[2026.01]
  • H10W70/00
  • (Not Translated) HB CC 5F034
  • H10W72/00
  • (Not Translated) HB CC 5F144
  • H10W74/00
  • (Not Translated) HB CC 4M109
  • H10W76/00
  • (Not Translated) HB CC 5F065
  • H10W78/00
  • (Not Translated) HB CC 5F035
  • H10W80/00
  • (Not Translated) HB CC 5F120
  • H10W90/00
  • (Not Translated) HB CC 5F037
  • H10W95/00
  • (Not Translated) HB CC 5F059
  • H10W99/00
  • (Not Translated) HB CC 5F065
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