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On this page, you can select 「MainGroup」 or 「Facet」 in H10W. |
HB:Handbook | ||||
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Select the desired 「MainGroup」 or 「facet」 etc. |
CC:Concordance | ||||
| Constructional details of integrated devices in chips, wafers or substrates[2026.01] | |||||
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Constructional details of integrated devices in chips, wafers or substrates[2026.01] | HB | CC | 5F032 | |
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Highly-doped buried regions of integrated devices[2026.01] | HB | CC | 5F032 | |
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Interconnections in chips, wafers or substrates[2026.01] | HB | CC | 5F033 | |
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Generic parts of integrated devices, not otherwise provided for[2026.01] | HB | CC | 5F032 | |
| Constructional details related to chips, wafers, substrates or packages[2026.01] | |||||
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Constructional details related to chips, wafers, substrates or packages[2026.01] | HB | CC | 5F136 | |
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(Not Translated) | HB | CC | 5F069 | |
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Electrical arrangements for controlling or matching impedance[2026.01] | HB | CC | 5F065 | |
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Marks applied to devices, e.g. for alignment or identification[2026.01] | HB | CC | 5F117 | |
| Aspects of packages[2026.01] | |||||
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Aspects of packages[2026.01] | HB | CC | 5F034 | |
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Interconnections or connectors in packages[2026.01] | HB | CC | 5F144 | |
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Encapsulations, e.g. protective coatings[2026.01] | HB | CC | 4M109 | |
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Containers; Fillings or auxiliary members therefor; Seals[2026.01] | HB | CC | 5F065 | |
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Detachable holders for supporting packaged chips in operation[2026.01] | HB | CC | 5F035 | |
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Direct bonding of chips, wafers or substrates[2026.01] | HB | CC | 5F120 | |
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Package configurations[2026.01] | HB | CC | 5F037 | |
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Packaging processes not covered by the other groups of this subclass[2026.01] | HB | CC | 5F059 | |
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Subject matter not otherwise provided for in this section[2026.01] | HB | CC | 5F065 | |