Descriptions for H10W20/00 and notes/indexes are displayed on this screen.


Note(s)
    This group covers:[2026.01]
      interconnections in chips;interconnections in or on wafers;interconnections in or on substrates.
    This group does not cover interconnections in packages, such as in or on package substrates, which are covered by subgroups H10W 70/00 or H10W 72/00.