Descriptions for H10W80/00 and notes/indexes are displayed on this screen.
H10W80/00
(Not Translated)
Note(s)
This group covers direct bonding of:[2026.01]
chips, e.g. chip-to-chip;wafers having devices and interconnections therein or thereon, e.g. wafer-to-wafer;substrates having devices and interconnections therein or thereon;combinations thereof, e.g. chip-to-wafer.