FI (Note)/(Index) list

Descriptions for H10W80/00 and notes/indexes are displayed on this screen.

H10W80/00 Direct bonding of chips, wafers or substrates[2026.01]

Note(s)
    This group covers direct bonding of:[2026.01]
      chips, e.g. chip-to-chip;wafers having devices and interconnections therein or thereon, e.g. wafer-to-wafer;substrates having devices and interconnections therein or thereon;combinations thereof, e.g. chip-to-wafer.