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  • H01L23/00
    		•  Details of semiconductor or other solid state devices (H01L 25/00 takes precedence; details of semiconductor bodies or of electrodes of devices provided for in group H01L 29/00 are classified therein; details peculiar to devices provided for in a single group of groups H01L 31/00-H01L 49/00 are classified therein) [2]
    		HB CC 5F065
  • H01L23/00@A
    		•  Marks, marking, display HB CC 5F065
  • H01L23/00@B
    		•  Static electricity destruction prevention HB CC 5F065
  • H01L23/00@C
    		•  Protection HB CC 5F065
  • H01L23/00@Z
    		•  Others HB CC 5F065
  • H01L23/02
    		•  .Containers; Seals (H01L 23/12, H01L 23/34, H01L 23/48 take precedence) [2] HB CC 5F065
  • H01L23/02@A
    		•  for radiation shielding HB CC 5F065
  • H01L23/02@B
    		•  characterized by seal construction HB CC 5F065
  • H01L23/02@C
    		•  .using metal materials [solder, brazing, seam welding, etc.] (dot number correction) HB CC 5F065
  • H01L23/02@D
    		•  .using glass materials (dot number correction) HB CC 5F065
  • H01L23/02@E
    		•  for hybrid integrated circuits HB CC 5F065
  • H01L23/02@F
    		•  for optical semiconductors HB CC 5F065
  • H01L23/02@H
    		•  for high-frequency semiconductor materials (H11 newly provided) HB CC 5F065
  • H01L23/02@G
    		•  having penetrating pores [pores to release expanding air, remove gas, etc.] HB CC 5F065
  • H01L23/02@J
    		•  characterized by lids (H11 newly provided) HB CC 5F065
  • H01L23/02@K
    		•  with flexible members (H11 newly provided) HB CC 5F065
  • H01L23/02@Z
    		•  Others HB CC 5F065
  • H01L23/04
    		•  ..characterised by the shape [2] HB CC 5F065
  • H01L23/04@A
    		•  having can seals HB CC 5F065
  • H01L23/04@B
    		•  Flat items HB CC 5F065
  • H01L23/04@C
    		•  Stud-shaped items HB CC 5F065
  • H01L23/04@D
    		•  characterised by outer shape [positioning convex or concave parts, etc.] HB CC 5F065
  • H01L23/04@E
    		•  associated with leads HB CC 5F065
  • H01L23/04@Z
    		•  Others HB CC 5F065
  • H01L23/06
    		•  ..characterised by the material of the container or its electrical properties [2] HB CC 5F065
  • H01L23/06@A
    		•  Shade materials HB CC 5F065
  • H01L23/06@B
    		•  Metal and conductive materials HB CC 5F065
  • H01L23/06@C
    		•  Magnetic materials HB CC 5F065
  • H01L23/06@D
    		•  Shape memory alloys HB CC 5F065
  • H01L23/06@Z
    		•  Others HB CC 5F065
  • H01L23/08
    		•  ...the material being an electrical insulator, e.g. glass [2] HB CC 5F065
  • H01L23/08@A
    		•  Resin vessels HB CC 5F065
  • H01L23/08@B
    		•  Glass vessels HB CC 5F065
  • H01L23/08@C
    		•  Ceramic vessels HB CC 5F065
  • H01L23/08@D
    		•  .including non-oxidizing vessels HB CC 5F065
  • H01L23/08@Z
    		•  Others HB CC 5F065
  • H01L23/10
    		•  ..characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container [2] HB CC 5F065
  • H01L23/10@A
    		•  Glass sealing materials HB CC 5F065
  • H01L23/10@B
    		•  Sealing materials other than glass [soft solder, resins] HB CC 5F065
  • H01L23/10@C
    		•  Prepreg [thermosetting resin-impregnated sheets] HB CC 5F065
  • H01L23/10@Z
    		•  Others HB CC 5F065
  • H01L23/12
    		•  .Mountings, e.g. non-detachable insulating substrates [2] HB CC 5F034
  • H01L23/12@B
    		•  Mount substrates including L, C, and R HB CC 5F034
  • H01L23/12@C
    		•  Ceramic substrates HB CC 5F034
  • H01L23/12@D
    		•  .Manufacturing methods HB CC 5F034
  • H01L23/12@E
    		•  Substrates characterized by grounding construction or power supply connection construction HB CC 5F034
  • H01L23/12@F
    		•  Substrates characterized by chip mounting perimeter construction HB CC 5F034
  • H01L23/12@G
    		•  Glass seal-type device substrate HB CC 5F034
  • H01L23/12@H
    		•  Substrates for hybrid integrated circuits HB CC 5F034
  • H01L23/12@J
    		•  Substrates characterized by thermolysis HB CC 5F034
  • H01L23/12@K
    		•  Substrates characterized by outer lead fittings HB CC 5F034
  • H01L23/12@L
    		•  Leadless chip carriers HB CC 5F034
  • H01L23/12@N
    		•  Multi-layer substrates [P takes precedence] HB CC 5F034
  • H01L23/12@P
    		•  Pin grid arrays HB CC 5F034
  • H01L23/12@Q
    		•  Substrates characterized by conductor patterns HB CC 5F034
  • H01L23/12@S
    		•  Substrates characterized by metal stems HB CC 5F034
  • H01L23/12@W
    		•  Substrate construction associated with wire bonding HB CC 5F034
  • H01L23/12@Z
    		•  Others HB CC 5F034
  • H01L23/12,301
    		•  ..High frequency wave element mountings HB CC 5F034
  • H01L23/12,301@C
    		•  MIC substrate mounting HB CC 5F034
  • H01L23/12,301@D
    		•  Microwave diode mountings HB CC 5F034
  • H01L23/12,301@J
    		•  Thermolysis construction HB CC 5F034
  • H01L23/12,301@L
    		•  Lead inductance reduction HB CC 5F034
  • H01L23/12,301@Z
    		•  Others HB CC 5F034
  • H01L23/12,501
    		•  ..The one that has a projection-shaped electrode on a package substrate such as BGA and CSP (New, Apr. 2000) HB CC 5F034
  • H01L23/12,501@T
    		•  The one that the package terminal has a shape other than a ball shape [the one providing a lead, a pin, a wire, or the like. as a terminal (New, Apr. 2000) HB CC 5F034
  • H01L23/12,501@B
    		•  The one that connects a chip with the package substrate that is bigger than the width of the chip by the projection-shaped electrode (New, Apr. 2000) HB CC 5F034
  • H01L23/12,501@W
    		•  The one that the chip is connected with the package substrate having a width bigger than that of the chip by the wire (New, Apr. 2000) HB CC 5F034
  • H01L23/12,501@S
    		•  The one that a package terminal and the chip are provided at the same side with respect to the package substrate (New, Apr. 2000) HB CC 5F034
  • H01L23/12,501@C
    		•  The one that a package substrate has a width smaller than that of the chip or the one that does not have the package substrate (New, Apr. 2000) HB CC 5F034
  • H01L23/12,501@P
    		•  .The one that has have a post electrode or rewiring (New, Apr. 2000) HB CC 5F034
  • H01L23/12,501@F
    		•  .The one that a package substrate has a film shape or a tape shape (New, Apr. 2000) HB CC 5F034
  • H01L23/12,501@V
    		•  .The one that uses the wire, the lead, or the like.(New, Apr. 2000) HB CC 5F034
  • H01L23/12,501@Z
    		•  Others (New, Apr. 2000) HB CC 5F034
  • H01L23/14
    		•  ..characterised by the material or its electrical properties [2] HB CC 5F034
  • H01L23/14@C
    		•  Inorganic insulating substrates, e.g. ceramic and glass HB CC 5F034
  • H01L23/14@D
    		•  .Diamond substrates HB CC 5F034
  • H01L23/14@S
    		•  .Semiconductor substrates HB CC 5F034
  • H01L23/14@M
    		•  Metal or composite materials containing metals HB CC 5F034
  • H01L23/14@R
    		•  Organic insulating materials or composite materials containing organic insulating materials HB CC 5F034
  • H01L23/14@X
    		•  Magnetic shield material HB CC 5F034
  • H01L23/14@Z
    		•  Others HB CC 5F034
  • H01L23/16
    		•  .Fillings [2] HB CC 5F065
  • H01L23/18
    		•  ..Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    		HB CC 5F065
  • H01L23/20
    		•  ...gaseous at the normal operating temperature of the device [2] HB CC 5F065
  • H01L23/22
    		•  ...liquid at the normal operating temperature of the device [2] HB CC 5F065
  • H01L23/24
    		•  ...solid or gel, at the normal operating temperature of the device [2] HB CC 5F065
  • H01L23/26
    		•  ...including materials for absorbing or reacting with moisture or other undesired substances [2] HB CC 5F065
  • H01L23/28
    		•  .Encapsulation, e.g. encapsulating layers, coatings (H01L 23/552 takes precedence) [2006.01] HB CC 4M109
  • H01L23/28@A
    		•  characterized by leads HB CC 4M109
  • H01L23/28@B
    		•  on heat release substrate HB CC 4M109
  • H01L23/28@C
    		•  means to prevent flowing HB CC 4M109
  • H01L23/28@D
    		•  for optical semiconductors HB CC 4M109
  • H01L23/28@E
    		•  for hybrid integrated circuits HB CC 4M109
  • H01L23/28@F
    		•  with insulating layers on the surface HB CC 4M109
  • H01L23/28@G
    		•  heat contraction tubes HB CC 4M109
  • H01L23/28@H
    		•  displays and identification HB CC 4M109
  • H01L23/28@J
    		•  characterised by outer shape HB CC 4M109
  • H01L23/28@K
    		•  Case receiver-type HB CC 4M109
  • H01L23/28@L
    		•  .Seals for case receiver-types and their arrangements HB CC 4M109
  • H01L23/28@M
    		•  Mainly for clocks HB CC 4M109
  • H01L23/28@T
    		•  having chips loaded on leads coming through insulation substrate pores [e.g. using tape carriers] HB CC 4M109
  • H01L23/28@Z
    		•  Others HB CC 4M109
  • H01L23/30
    		•  ..characterised by the material or arrangement of the encapsulation [2] HB CC 4M109
  • H01L23/30@A
    		•  for shielding a wires HB CC 4M109
  • H01L23/30@G
    		•  glass seals HB CC 4M109
  • H01L23/30@R
    		•  resin seals HB CC 4M109
  • H01L23/30@B
    		•  .plural resin layers HB CC 4M109
  • H01L23/30@C
    		•  .Energy beam sensory resins, e.g. those which harden under light, electron beams, and ionization beams HB CC 4M109
  • H01L23/30@D
    		•  Protective coverings surfaces and composition planes HB CC 4M109
  • H01L23/30@E
    		•  using shading materials HB CC 4M109
  • H01L23/30@F
    		•  for optical semiconductors HB CC 4M109
  • H01L23/30@Z
    		•  Others HB CC 4M109
  • H01L23/32
    		•  .Holders for supporting the complete device in operation [2] HB CC 5F035
  • H01L23/32@A
    		•  Integrated circuit sockets [H01R33 is the main one allotted for use with the majority of special sockets] HB CC 5F035
  • H01L23/32@B
    		•  Fixtures and tools for mounting [Inserting and removing IC lead in socket (jig)] HB CC 5F035
  • H01L23/32@C
    		•  Power transistor mounting (mounting for CAN-type and 3-terminal types only) HB CC 5F035
  • H01L23/32@D
    		•  Supports, connections, mounting brackets [mountings other than those listed above] HB CC 5F035
  • H01L23/32@E
    		•  techniques related to mounting and supporting of Tr [other than soldering] HB CC 5F035
  • H01L23/32@Z
    		•  Others HB CC 5F035
  • H01L23/34
    		•  .Cooling arrangements; Heating arrangements; Ventilating arrangements [2] HB CC 5F136
  • H01L23/34@A
    		•  Semiconductor elements, vessels, and leads HB CC 5F136
  • H01L23/34@B
    		•  Resin seal-type HB CC 5F136
  • H01L23/34@C
    		•  Pressure-type HB CC 5F136
  • H01L23/34@D
    		•  having heat-sensitive elements HB CC 5F136
  • H01L23/34@E
    		•  thermostatic oven HB CC 5F136
  • H01L23/34@Z
    		•  Others HB CC 5F136
  • H01L23/36
    		•  ..Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks [2] HB CC 5F136
  • H01L23/36@A
    		•  Resin seal-type HB CC 5F136
  • H01L23/36@B
    		•  for pressure attachment HB CC 5F136
  • H01L23/36@C
    		•  Thermolitic circuit substrates and systems HB CC 5F136
  • H01L23/36@D
    		•  Thermal conducting members between heaters and radiators HB CC 5F136
  • H01L23/36@M
    		•  Material characteristics HB CC 5F136
  • H01L23/36@Z
    		•  Others HB CC 5F136
  • H01L23/38
    		•  ..Cooling arrangements using the Peltier effect [2] HB CC 5F136
  • H01L23/40
    		•  ..Mountings or securing means for detachable cooling or heating arrangements [2] HB CC 5F136
  • H01L23/40@A
    		•  Printed substrate mounting HB CC 5F136
  • H01L23/40@B
    		•  Mounting of single in-line-types having cooling wheels HB CC 5F136
  • H01L23/40@C
    		•  Place setting HB CC 5F136
  • H01L23/40@D
    		•  Pressure welding-type HB CC 5F136
  • H01L23/40@E
    		•  Mounting using pinching [q] HB CC 5F136
  • H01L23/40@F
    		•  Mounting by junction layers HB CC 5F136
  • H01L23/40@Z
    		•  Others HB CC 5F136
  • H01L23/42
    		•  ..Fillings selected or arranged to facilitate heating or cooling, e.g. by change of state [2] HB CC 5F136
  • H01L23/44
    		•  ..the complete device being wholly immersed in a fluid other than air [2] HB CC 5F136
  • H01L23/46
    		•  ..involving the transfer of heat by flowing fluids (H01L 23/42, H01L 23/44 take precedence) [2] HB CC 5F136
  • H01L23/46@A
    		•  Ebullition cooling HB CC 5F136
  • H01L23/46@B
    		•  Heat pipes HB CC 5F136
  • H01L23/46@C
    		•  Air cooling HB CC 5F136
  • H01L23/46@D
    		•  .Detection of changes in air cooling state HB CC 5F136
  • H01L23/46@Z
    		•  Others HB CC 5F136
  • H01L23/48
    		•  .Arrangements for conducting electric current to or from the solid state body in operation, e.g. leadsor terminal arrangements [2] HB CC 5F066
  • H01L23/48@A
    		•  Coaxial type diodes HB CC 5F066
  • H01L23/48@B
    		•  .Totally characterized by manufacturing methods HB CC 5F066
  • H01L23/48@C
    		•  .Pellet anchoring, support electrodes, electrode protection HB CC 5F066
  • H01L23/48@D
    		•  .Lead anchoring, integrated leads, molds HB CC 5F066
  • H01L23/48@E
    		•  .Miniaturization [leadless types and lead contraction types] HB CC 5F066
  • H01L23/48@F
    		•  2-terminal elements [excluding use with coaxial-type diodes and large electric power] HB CC 5F066
  • H01L23/48@G
    		•  for high electric power HB CC 5F066
  • H01L23/48@H
    		•  3-terminal elements HB CC 5F066
  • H01L23/48@J
    		•  .Manufacturing methods HB CC 5F066
  • H01L23/48@K
    		•  .Plating and soft soldering HB CC 5F066
  • H01L23/48@L
    		•  .Thermolysis HB CC 5F066
  • H01L23/48@M
    		•  .Molding HB CC 5F066
  • H01L23/48@N
    		•  .Withstand voltage improvement and migration prevention HB CC 5F066
  • H01L23/48@P
    		•  .Leads and lead frames HB CC 5F066
  • H01L23/48@Q
    		•  ..Lead attachment to element substrates HB CC 5F066
  • H01L23/48@R
    		•  ..Mounting to print substrates, etc. HB CC 5F066
  • H01L23/48@S
    		•  .Bonding [connecting between leads and plates] HB CC 5F066
  • H01L23/48@T
    		•  .Plate anchoring HB CC 5F066
  • H01L23/48@V
    		•  Materials for leads [characterized by alloy composition only] HB CC 5F066
  • H01L23/48@Y
    		•  for optical elements HB CC 5F066
  • H01L23/48@Z
    		•  Others HB CC 5F066
  • H01L23/50
    		•  ..for integrated circuit devices [2] HB CC 5F067
  • H01L23/50@A
    		•  Manufacturing methods [including ways of manufacturing lead frames] HB CC 5F067
  • H01L23/50@B
    		•  Lead shaping and cutting HB CC 5F067
  • H01L23/50@C
    		•  Lead bending detection and reshaping HB CC 5F067
  • H01L23/50@D
    		•  Plating HB CC 5F067
  • H01L23/50@E
    		•  Soft soldering HB CC 5F067
  • H01L23/50@F
    		•  Thermoloysis HB CC 5F067
  • H01L23/50@G
    		•  Molding HB CC 5F067
  • H01L23/50@H
    		•  .Moisture resistance improvement and lead removal prevention HB CC 5F067
  • H01L23/50@J
    		•  .Burr removal HB CC 5F067
  • H01L23/50@K
    		•  Leads and lead frames HB CC 5F067
  • H01L23/50@L
    		•  .Mounting of lead substrate elements HB CC 5F067
  • H01L23/50@M
    		•  ..characterized by lead mount shapes HB CC 5F067
  • H01L23/50@N
    		•  .Mounting of printed substrates of leads HB CC 5F067
  • H01L23/50@P
    		•  .Pin type leads HB CC 5F067
  • H01L23/50@Q
    		•  .Tab leads HB CC 5F067
  • H01L23/50@R
    		•  Miniaturized leads HB CC 5F067
  • H01L23/50@S
    		•  Bonding [leads and pellet connecting] HB CC 5F067
  • H01L23/50@T
    		•  .Prevention of unnecessary contact HB CC 5F067
  • H01L23/50@U
    		•  Tabs [pelletloaded section] HB CC 5F067
  • H01L23/50@V
    		•  Materials for leads HB CC 5F067
  • H01L23/50@W
    		•  Terminal construction for interconnection between laminated frames and elements HB CC 5F067
  • H01L23/50@X
    		•  characterized by terminal arrangement and circuitry HB CC 5F067
  • H01L23/50@Y
    		•  support by plural leads and insulation HB CC 5F067
  • H01L23/50@Z
    		•  Others HB CC 5F067
  • H01L23/52
    		•  .Arrangements for conducting electric current within the device in operation from one component to another [2] HB CC 5F068
  • H01L23/52@A
    		•  Wiring [chip wiring methods and patterns] HB CC 5F068
  • H01L23/52@B
    		•  .Multi-layer wiring HB CC 5F068
  • H01L23/52@C
    		•  Spatial construction of wiring [specially plural chip wiring] HB CC 5F068
  • H01L23/52@D
    		•  Planar construction of wiring [planar plural chip wiring] HB CC 5F068
  • H01L23/52@E
    		•  Techniques related to wiring HB CC 5F068
  • H01L23/52@Z
    		•  Others HB CC 5F068
  • H01L23/54
    		•  .Details of semiconductor or other solid state devices or of electrodes thereof, e.g. selection of materials therefor, not peculiar to devices provided for in a single group of groups H01L 31/00-H01L 49/00 (H01L 29/00 takes precedence) [2] HB CC 5F068
  • H01L23/56
    		•  .Circuit arrangements not adapted to a particular application of the device, e.g. for temperature compensation [2] HB CC 5F069
  • H01L23/56@A
    		•  Protection against overvoltage HB CC 5F069
  • H01L23/56@B
    		•  Protection against static electricity HB CC 5F069
  • H01L23/56@C
    		•  Protection against overcurrent HB CC 5F069
  • H01L23/56@D
    		•  Compensation and protection by temperature detection HB CC 5F069
  • H01L23/56@Z
    		•  Others HB CC 5F069
    TOP