F-Term-List

(Not Translated)
C08G77/00-77/62 AA AA00
CLASSIFICATION OF POLYMERS (NAME OF SUBSTANCES)
AA01 AA02 AA03 AA05 AA06 AA07 AA08 AA09 AA10
. Only repeating -Si-O- unit . . Polysilicates . . Polysiloxanes . Only repeating -Si-X- unit (X is not oxygen) . . Polysilanes . . Polycarbosilanes . . . Polysilphenylenes . . . Polysilalkylenes . . Polysilazanes (X=N)
AA11 AA13 AA15 AA17 AA18 AA19 AA20
. Mixture of -Si-O- unit and -Si-X- unit . Containing unsaturated Si structures (-Si=Si- or the like) . Polymers having structures not classified into the above . Unspecified polymer structure because of unknown structure . . Raw material compositions based on silicon monomers . . Polymers expressed only by silicon raw materials . Other substance names (FW)
AB AB00
CLASSIFICATION OF POLYMERS (SPATIAL EXTENSION)
AB01 AB02 AB05 AB06 AB07
. Straight linear, linear . . Block . Cyclic (combination of ring) . . Ladder type . . Cage type
AB11 AB12 AB13 AB14 AB15 AB20
. Branch type . . Graft, which covers comb type, hanging type . . Branch type; T-shaped (Y-shaped) polymer molecules . . High order blanch type, which covers star type, tree type and dendrimer . . Crosslinked substances, which covers cured substances . Substances having other spatial extension (FW)
BA BA00
CLASSIFICATION BY OXYGEN ATOM CONFIGURATION AROUND SI
BA01 BA02 BA03 BA04 BA05 BA07
. D units are main quantity . . Only D units . . Containing T units or Q units . . . Comprising D units and T units . . . Comprising of D units and Q units . . . Containing all of D units, T units and Q units
BA11 BA12 BA13 BA14 BA16 BA17
. T units are main quantity . . Only T units, which cover ladder type or silsesquioxanes . . Containing D units or Q units . . . Comprising T units and D units . . . Comprising T units and Q units . . . Containing all of T units, D units and Q units
BA21 BA22 BA23 BA25 BA26 BA27 BA28 BA29
. Q units are main quantity . . Only Q units . . Containing D units and T units . . . Comprising Q units and D units . . . Comprising Q units and T units . . . Containing all of Q units, D units, and T units . . Containing M units . . . MQ resins (Silicone resins)
BA31 BA34 BA35 BA36 BA37 BA40
. Without reference to quantity ratio among D, T, and Q units, quantity ratio is indefinite . . Comprising D units and T units . . Comprising Q units and D units . . Comprising T units and Q units . . Containing all of D units, T units, and Q units . Other configurations of oxygen atoms (FW)
BB BB00
BONDS BETWEEN ADJACENT SI ATOMS; BONDS HAVING REPEATING UNITS, REFER TO EA
BB01 BB02 BB03 BB04 BB05 BB07 BB08 BB09 BB10
. Bonds having O atoms in the second position of Si . . O atom by itself; Si-O-Si bonds . . Si-O-X-O-Si type bonds (X is not Si) . . . X is a hydrocarbon chain . . . X is metal or B because of co-condensation with metalalkoxides . Bonds having N atoms in the second position of Si . . N atom by itself; Si-N-Si bonds . . Si-N-X-N-Si type bonds (X is not Si) . C in the second position of SiA) the C is in carbonyl groups
BB11 BB12 BB13 BB14 BB15 BB16 BB17 BB19 BB20
. C in the second position of SiB) hydrocarbon bonds formed only by C and H . . C in the next position is carbons in aliphatic chains (alicyclic rings) . . . Saturated aliphatic chains, alkylenes . . . . Dimethylene -CH2-CH2- . . . Aliphatic chains containing double bonds, which cover vinylene . . . Aliphatic chains containing triple bonds, which cover ethynylene . . . . Diethynylbenzene type bonds . . C in the next position is carbons in aromatic rings, arylenes . . . Phenylene -C6H4-
BB21 BB22 BB24 BB25 BB26 BB27
. C in the second position of SiC) hydrocarbon bonds containing heteroatoms . . Carbon chains containing halogens . . Carbon chains containing O atoms, which cover heterocyclic rings containing O . . . Carbon chains containing OH groups, which cover ring opening of epoxies . . . Carbon chains having ether bonds . . . Carbon chain having C=O or COO bonds
BB32 BB33 BB34 BB36 BB38 BB39 BB40
. . Carbon chains containing N atoms, which cover N+ groups and azo groups . . . Amides, urethanes and carbon chains containing urea bonds . . . Heterocyclic structure containing N, which covers imide bonds . . Carbon chains containing S atoms . . Carbon chains containing P atoms, which cover P+ groups . . Carbon chains containing elements other than halogen, O, N, S and P . . . B atoms, which cover carbaboran bonds
BB41 BB44 BB45 BB46
. Bonds having S atoms in the second position of Si . Bonds not belonging to the above . . Covalent bonds; Si-Si bonds . . Si-metal-Si bonds (a metal is Ge or the like)
CA CA00
MONOVALENT GROUPS ON SI; GROUPS CONTAINING REPEATING UNITS, REFER TO EA
CA01 CA03 CA04 CA05 CA07 CA08 CA09
. H atoms; Si-H, hydrosilyl groups . Halogen atoms . . F atoms; Si-F . . Cl atoms; Si-Cl . Groups having N atoms in the second position of Si, which cover Si-NCO . . Amino acids; Si-NH2, Si-NR2 . . Amide groups; Si-NHCO-
CA11 CA12 CA13 CA14 CA15 CA16 CA17 CA18 CA19 CA20
. Groups having O atoms in the second position of Si, which cover Si-O metal . . OH groups; Si-OH, silanol groups . . OR groups; Si-OR . . . R, which is a saturated aliphatic or aromatic, covers Alkoxy groups . . . R is an unsaturated aliphatic; Si-O-C=C . . . Hetero atoms (other atoms than C, H) are present in R . . Aminooxy groups; Si-O-NR2 . . . Oxime and ketoxime groups; Si-O-N=C . . Acyloxy groups; Si-OCO- . C in the second position of Si, a) the C is carbonyl
CA21 CA22 CA23 CA24 CA25 CA26 CA27
. C in the second position of Si, b) hydrocarbon groups containing C and H only . . C in the second position is carbons of aliphatic chains (alicyclic rings) . . . Saturated aliphatic groups, alkyl . . . . Methyl . . . . Alkyl groups having branches and alicyclic rings . . . . Long chain alkyl; number of carbons are limited to 2 or more . . . . Alkyl, aralkyl having aromatic rings
CA33 CA34 CA35 CA36 CA39 CA40
. . . Aliphatic groups having double bonds, alkenyl . . . . Vinyl . . . . Alkenyl having branches, long chains, alicyclic rings or aromatic rings . . . Aliphatic groups having triple bonds, alkynyl . . C in the second position is a carbon of aromatic rings, aryl . . . Phenyl
CA41 CA42 CA44 CA45 CA46 CA47
. C in the second position of Si, c) hydrocarbon groups containing hetero atoms . . [Note] When c) is present on all Si, it is applied . . Hydrocarbon groups containing halogens . . . Containing Cl atoms . . . Containing F atoms, which cover trifluoropropyl . . . . Perfluoroalkyl groups
CA52 CA53 CA54 CA55 CA56 CA57 CA58
. . Hydrocarbon groups containing O atoms, which cover peroxy groups . . . Containing OH groups . . . . Secondary or tertiary OH groups, which cover ring opening of epoxies . . . . Limited to phenolic OH groups . . . Containing ether bonds . . . Containing ketonic structure, which cover aldehyde groups . . . Containing COOH groups; COO-, CBO3 is given
CA63 CA64 CA65 CA66 CA67 CA68 CA69
. . . Containing C type of ester groups; Si-R-COO . . . Containing O type of ester groups; Si-R-OCO . . . . (Meth) acrylic ester groups . . . Heterocyclic rings containing O, which cover anhydride groups; N in rings refers to CA80 . . . . Containing epoxy groups; epoxies with unspecified structure . . . . . Glycidyl type . . . . . Non-glycidyl type
CA72 CA73 CA74 CA75 CA76 CA77 CA78 CA79 CA80
. . Hydrocarbon groups containing N atoms, which cover nitro, azo groups . . . Containing C) type of amide groups; Si-R-CONH . . . Containing N type of amide groups; Si-R-NHCO . . . . (Meth) acrylamide groups . . . Amino groups, containing imino groups . . . . Secondary or tertiary N atoms; quaternary N+, refers to CB02 . . . Containing CN groups . . . Containing NCO groups, urethanes, urea bonds . . . Heterocyclic rings containing N, which cover imide bonds
CA82 CA83 CA84 CA85 CA87 CA88
. . Hydrocarbon groups containing S atoms . . . Containing SH groups . . . Containing (poly) sulfide bonds, which cover thioethers . . . Containing S=O bonds, which cover sulfuric acid, sulfonic acid . . Hydrocarbon groups containing P atoms; P+, refers to CB02 . . Organic groups containing other atoms than halogen, O, N, S and P
CA91 CA92 CA99
. Groups having S atoms in the second position of Si . . Mercapt groups; Si-SH and Si-SR . Monovalent groups not belonging to the above
CB CB00
GROUPS EXPRESSED FUNCTIONALLY
CB01 CB02 CB03 CB05 CB06 CB07 CB08 CB10
. Containing electric charge . . Positive charge, refers to N+ and P+ . . Negative charge, refers to COO- . Chiral structures, optically-active structures and asymmetric carbon atoms . Liquid crystal structures and mesogenic groups (conjugated atom groups) . Steric hindrances (hindered structures) . Acid dissociative groups, acid degradable groups, acid unstable groups . Other functional groups (FW)
EA EA00
REPEATING STRUCTURES OTHER THAN SI CHAINS EXISTING IN POLYMERS
EA01 EA02 EA03 EA04 EA05 EA06
. Structures originated by C08F system polymers . . Olefin(co)polymers . . Styrene system (co)polymers . . Halogenated vinyl system (co)polymers . . (Co)polymers of acrylic system monomers . . (Co)polymers of diene compounds
EA11 EA12 EA13 EA14 EA15 EA16 EA17 EA18 EA19 EA20
. Structures originated by C08G system polymers . . Polyethers . . . Polyether chains lies between two Si . . . Polyether chains exist in Si chain terminals . . . Polyether chains pending in the inside of Si chains . . . Existing other than C, H, and O in polyether links . . . Groups other than hydroxy groups of polyether chain terminals . . Polyesters . . Polycarbonates . . Polyurethanes, polyureas
EA22 EA23 EA24 EA25 EA26 EA28 EA30
. . Polyamides, which cover esteramides . . Polyimines -(R-N)n- . . Polyimides, which cover esterimides, amideimides . . Aldehyde systems, which cover phenol resins, amino resins . . Epoxy resins . Structures of polysaccharides and natural macromolecule origins . Structures of other polymer origins (FW)
FA FA00
METHODS FOR FORMING POLYMERS
FA01 FA02 FA03 FA04 FA06 FA07 FA08 FA10
. Condensation reaction; reaction for elimination of low molecular substances . . Condensation without hydrolysis, which covers silanol condensation . . . Ester exchange reactions . . . Formation of Si-Si bonds . . Hydrolytic condensation, which covers conditions under neutral . . . Acid hydrolytic condensation . . . Base hydrolytic condensation . Solvolysis with solvents other than water
FA11 FA12 FA13 FA14 FA15 FA16 FA17 FA18 FA19 FA20
. Type of molecules eliminated in condensation reaction . . Water molecules (dehydrating condensation) . . Alcohol molecules (dealcoholizing condensation) . . Hydrogen molecules, H2 (dehydrogenating condensation) . . Hydrogen halide, which covers dehydrochlorinating condensation . . Halogen elements, which cover dechlorination condensation . . Compounds containing nitrogen . . Compounds containing Si . . Compounds containing metals, which cover metal salts . . Other substances than the above (FW)
FA21 FA22 FA23 FA25 FA26 FA27 FA28 FA29
. Addition reaction; reactions without elimination of low molecular weight substances . . Hydrosilation reaction and hydrosilation . . Michael addition (other than hydrosilation reaction) . Reactions with cleavage and recombination of Si-O-Si bonds . . Equilibrium methods . . . Acid catalyst equilibrium . . . Base catalyst equilibrium . . Using cyclic siloxanes as raw materials, which covers Ring-opening polymerization
FA31 FA32 FA33 FA34 FA37 FA38 FA39
. Condition control . . Temperature . . Hydrogen-ion exponent (pH-value), which covers to use buffer agents or pH adjusters . . Pressure . Multi-step reactions; reactions are divided into two steps . . Changing catalysts in reaction process . . Changing conditions in reaction process, which covers pH-value or the like
FA41 FA42 FA43 FA44 FA45 FA46 FA47 FA50
. Solvents . . Water . . Organic solvents . . . Alcohols . . . Aromatics . . Mixed solvents . . Nonsolvents . Tracing and monitoring of reactions
FA51 FA52 FA53 FA54 FA55 FA56 FA57 FA60
. Reaction under specific conditions . . Emulsion polymerization and reactions in emulsion states . . Grignard reactions . . Reactions by radicals, peroxides . . Ionic reactions, which cover cationic polymerization, anionic polymerization . . Plasma polymerization . . Electron beam irradiation, light irradiation, and energy ray irradiation . Apparatus
FA61 FA62 FA63 FA64 FA65 FA66 FA68 FA69 FA70
. Sol-gel methods . . By only silicon monomer raw materials . . With silicon monomer raw materials and other reactive components . . . With metal alkoxides . . With silicon monomer raw materials and non-reactive components . . Under the existence of functional materials . Operation like in plants, which covers reuse systems of recovered substances . . Batch polymerization . . Continuous polymerization
FA71 FA72 FA73 FA75 FA76 FA77 FA78 FA79 FA80
. Order of formation . . Viewpoints of BB and CA are simultaneously formed . . Viewpoints of BB and EA are simultaneously formed . Method for introducing Si atoms into CO8F system chains . . At the initiation of addition polymerization; Using polymerization initiators containing Si . . During addition polymerization; Using vinyl monomers containing Si . . At termination of addition polymerization; using polymerization terminators containing Si . . After addition polymerization; post-introduction into CO8F system polymers . Other formation methods (FW)
FB FB00
REGULATORS NOT CONTAINING METAL, B, AND SI EXISTING IN REACTION SYSTEMS
FB01 FB03 FB04 FB05 FB07 FB08 FB09 FB10
. Elemental substances other than metal, B, and Si . Inorganic acids . . Sulfuric acids . . Hydrochloric acids . Organic acids . . Carboxylic acids . . Organic acids containing S, which cover sulfonic acids . . Organic acids containing P, which cover phosphoric acids
FB13 FB14 FB17 FB18 FB19 FB20
. Inorganic acid esters . . Phosphate esters, phosphite esters . Organic acid esters . . Carboxylic acid esters, which cover acid anhydrides . . Organic acid esters containing S, which cover of sulfonic acids . . Organic acid ester containing P, which cover of phosphonic acid
FB21 FB22 FB23 FB25 FB27 FB30
. Amines, which cover Ammonia . . Tertiary amines . . Heterocyclic compounds containing N . Compounds containing both N atoms and P atoms . Onium compounds, which cover N+, P+ . Other regulators (FW)
FC FC00
REGULATORS CONTAINING METAL, B, AND SI IN REACTION SYSTEMS
FC01 FC03 FC04 FC05 FC06 FC08 FC09 FC10
. Metal elements; Complexes and chelates, refers to FC11 . Metal oxides . . Of alkaline (earth) metals . Metal hydroxides . . Of alkaline (earth) metals . Metal salts . . Of inorganic acids . . Of organic acids
FC11 FC12 FC13 FC14 FC15 FC16 FC17 FC18 FC19
. Metal alkoxides, metal complexes, and metal chelates . . Of the first to the second families (alkaline and alkaline earth) . . Of the third to the eleventh families (transition elements) . . . Ti . . . Rh . . . Pt, which covers Chloroplatinic acid, [PtCl6]2- . . Of the twelfth to the sixteenth families . . . Al . . . Sn
FC21 FC22 FC23 FC25 FC26 FC28 FC29 FC30
. Metal halides . . Al, which covers AlCl3, for Friedel-Crafts . . Pt, which covers PtCl4 . Compounds containing B atoms . . Complexes containing B atoms and coordinate compounds containing B atoms . Compounds containing Si atoms; For terminal introduction, refers to FE12 . . Silanolate . Other regulators (FW)
FD FD00
SPECIAL REGULATORS, NON-REACTIVE COMPONENTS IN REACTION SYSTEMS
FD01 FD02 FD03 FD05 FD06 FD07 FD08 FD09 FD10
. Heterogeneous catalysts, which cover Solid catalysts, ion-exchange resins . Potential catalysts, regulators developing functions in midstream . Reaction retarders, inhibitors, polymerization inhibitors . Non-reactive additives . . Emulsifiers and surfactants . . Unspecified macromolecules . . Fillers, which cover Fibers for reinforcing . . . Silica . Other special components (FW)
FE FE00
AFTER-TREATMENT
FE01 FE02 FE03 FE04 FE05 FE06 FE07
. Purpose of after-treatment . . Recovery of polymers . . Recovery of substances other than polymers, FE31- are also given . . Refining and purification, which cover discoloration and deodorization; FE31- is also assigned . . Molecular weight control and polymerization degree control . . Drying, which covers removal of trace water . . Polymer modification, which covers hydrophobization, stabilization
FE12 FE13 FE14 FE15 FE17 FE18 FE19
. . Termination of reaction, which covers Introduction of M units . . . Using mono-functional monosilanes, which covers Cl-SiR3 . . . Use of disiloxanes and use of disilazanes . . . Use of reaction inhibitors other than the above (FW) . . Decomposition of polymers . . . Pyrolysis . . . Hydrolysis
FE21 FE22 FE23 FE24 FE25 FE26 FE27
. Means of after-treatment . . Layer separation . . Extraction . . Adsorption . . Distillation . . Stripping . . Neutralization, which covers Catalyst deactivation
FE31 FE32 FE33 FE34 FE35 FE36 FE37 FE40
. Substances removed and recovered by after-treatment . . Catalysts, regulators . . Eliminated molecules and by-product substances in condensation reaction processes . . Solvents . . Unreacted raw materials . . Substances harmfully affecting physical properties . . Substances other than the above (FW) . Other after-treatments (FW)
GA GA00
QUALITY OF POLYMERS AND INTRINSIC VALUES OF POLYMERS
GA01 GA02 GA04 GA06 GA07 GA08 GA09
. Molecular weight, which covers Number average, weight average . . Molecular weight distribution . Viscosity . Purity (defining contents of particular components) . . Contents of cyclic compounds and contents of linear compounds . . Contents of impurities and contents of unreacted raw materials . . Moisture contents
GA11 GA12 GA13 GA20
. Existential quantity of particular functional groups or substructures . . Contents of silanol groups . . Existential quantity of M, T, D, and Q units . Other intrinsic values (FW)
GB GB00
STATE OF POLYMERS, STATE IMMEDIATELY AFTER POLYMERIZATION
GB01 GB02 GB03 GB04 GB05 GB06 GB07 GB08 GB09 GB10
. Fluid state . . Oil state . . Paste state, which covers greases and compounds . . Organic solutions, which cover vanish . . Water solution . . Dispersion state . . . Sol state . . . Emulsion, which covers latex . . . . Oil in water type emulsion, O/W . . . . Water in oil type emulsion, W/O
GB11 GB12 GB13 GB14 GB15 GB16 GB17 GB18
. Semi-solid state, solid state, which covers resin . . Rubber state, which covers elastomers . . Gel state . . Glass state and glass-like . . Silica state and silica-like . . Ceramics . . Foam state, which covers foam formed by gas . . Porous state, which covers micropore formation by removing soluble ingredients
GB22 GB23 GB24 GB26 GB27 GB28 GB29
. . Organic-Inorganic complexes and hybrids . . IPN (Interpenetration network) . . Core-shell bodies . . State chemical bonded (grafted) on the surface of inorganic bodies . . . Chemical bonding to inorganic particles . . Chemical bonding state on the surface of organic moldings . . . Chemical bonding on organic substrates
GB31 GB32 GB33 GB40
. Shape . . Granular state, fine particle state, powder state or fine particles . . Membrane state, film state . Other states (FW)
GC GC00
PROPERTIES OF POLYMERS AND PROPERTIES OF MOLDINGS FROM POLYMERS
GC01 GC02 GC03 GC04 GC06 GC07 GC08 GC09 GC10
. Mechanical properties . . Improvement in impact resistance, cracking resistance, flexibility and toughness . . Abrasion resistance and scratch resistance . . Moldability . Environmental properties . . Storage stability, which covers Stability of emulsion . . Weatherability and cold resistance . . Antifouling properties . . Antibiotic properties
GC11 GC12 GC13 GC15 GC16 GC17 GC18
. Properties on heat or flame, which covers Flammability . . Heat resistance and thermo (oxidation) stability . . Combustion resistance and flame retardance . . Thermoplasticity . . Thermo-setting properties, which covers room temperature curing properties . . . Condensation curing properties . . . Hydrosilation curing properties
GC21 GC22 GC23 GC24 GC25 GC26 GC30
. Optical properties . . Light resistance and light (oxidation) stability, which cover radiation resistance . . Optical transparency . . Refractive properties and refractive index . . Light absorbability, which covers UV light absorption and visible light absorption . . Light curing properties, which covers electron beam curing properties . Properties to living bodies and biocompatibility, which cover antithrombogenicity
GC31 GC32 GC33 GC36 GC37 GC38 GC39
. Properties to gases, which cover impermeability . . Gas permeability and selective permeability . . . Oxygen permeability, oxygen selectivity . Properties to solids . . Adhesion properties, adherablity . . Releasing properties, which cover Mold releasing properties . . Lubricating properties
GC41 GC42 GC43 GC44 GC45 GC46 GC47 GC48 GC49
. Properties to liquids . . Emulsifying properties, which cover surface activity . . Dispersibility . . Water solubility . . Solubility in organic solvents . . Water resistance and hydrolysis resistant stability . . Oil resistance and solvent resistance . . Hydrophilicity . . Lipophilicity, water-shedding properties and hydrophobicity
GC51 GC52 GC53 GC54 GC55 GC60
. Electric properties, which cover Arc resistance . . Electric insulation . . Dielectric properties; Permittivity . . Antistatic properties, which cover Semiconductivity . . Conductivity . Other properties (FW)
GD GD00
MOLDING METHODS
GD01 GD02 GD03 GD04 GD05 GD06 GD08 GD09 GD10
. Specific molding means . . Injection . . Extrusion . . Compression . . Casting . . Foaming, which covers foam production . Film production, which covers coating . Sintering, which covers conversion to inorganic materials, ceramics . Other molding methods (FW)
HA HA00
APPLICATIONS OF POLYMERS AND MOLDED PRODUCTS THEREOF
HA01 HA02 HA03 HA04 HA05 HA06 HA08 HA09 HA10
. Machine components and mechanical materials . . Gaskets and O-rings . . Copiers, printers, and printing technology . . . Roll components . . . Toner and toner migration inhibiters, which cover printing ink . . Motor vehicle members, which cover Tires . . Action with gases, which covers Gas separation membranes and gas selecting transmissivity membranes . . Action with heat, which covers heat insulating materials, heat conductive materials, and heat transfer mediums . . Action with vibration, which covers damping materials and vibration absorbers
HA11 HA12 HA13 HA14 HA15 HA16 HA17 HA18 HA20
. Optical members and optical materials . . Lenses, which cover for glasses, for intraocular, and for contacting . . Optical disks . . Optical communication members, optical fibers, and optical wave-guides . . Photoresist materials . . Photoconductive, charge transport, electrophotosensitive materials, and EL elements . . Nonlinear optical materials . . Color filters . Materials for construction and civil engineering, which cover Cement modification; Sealing, refer to HA30
HA21 HA22 HA23 HA24 HA25 HA26 HA28 HA29 HA30
. Chemical products . . Coating agents in general; having targets, refer to HA23 . . . Special purposes; Each HA is also assigned according to each purposes . . . Paints for applying to specific surfaces . . . . Hard coat materials, organic surfaces of plastics or the like . . . . Surface coating agents, inorganic surfaces of fine particles, glass, or the like . . Encapsuling agents, sealing agents and sealants . . . Encapsulants for semiconductor and electronic members . . . Sealants for construction, which cover windowpanes fixing, void filling and waterproofing
HA32 HA33 HA34 HA36 HA37 HA39 HA40
. . Binding agents, adhesives . . Coupling agents . . Fibers, fiber treating agents, sizing and sizing agents . . Water repellants, which cover water and oil repellants . . Lubricants, which cover lubricating oil and operating oil . . Polishing agents, leather processing agents and car waxes . . Binding agents and binders (for sintering)
HA42 HA43 HA44 HA45 HA46 HA48
. . Surfactants, emulsifiers, which cover detergents . . Defoaming agents . . Foam stabilizer, which covers for urethane foam production . . General release agents, which cover mold release agents and internal release agents . . Release agents for release papers . . Liquid crystal materials and liquid crystal orientation film
HA52 HA53 HA56 HA57 HA58 HA59
. . Medical materials, which cover dental materials, medicines and agricultural chemicals . . Cosmetics and personal care products . . For raw materials of other substances and for blending with other substances . . . Crosslinking agents, curing agents, and macromonomers . . . Catalyst carriers . . . Modification of resins, which covers for the purpose of UV absorption, antistatic, and the like
HA61 HA62 HA63 HA64 HA65 HA66 HA67 HA68 HA69 HA70
. Electric members and electronic members . . Insulating materials, which cover insulating oil . . . Insulation films and interlayer insulation films for semiconductors . . . Wire-coating . . Dielectric materials . . Semiconductive materials and semiconductor materials; hermetic sealing, refers to HA29 . . Conductive materials . . Macromolecular solid electrolyte . . Wiring boards, electronic circuit boards, and printed circuit boards . Other applications (FW)
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