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F-Term-List

(Not Translated)
2H196 PHOTOSENSITIVE POLYMER AND PHOTORESIST PROCESSING
G03F7/00 -7/00,506;7/06;7/07;7/12-7/14;7/26-7/42
G03F7/00-7/00,506;7/06;7/07;7/12-7/14;7/26-7/42 AA AA00
PURPOSES OR APPLICATIONS 		AA01 AA02 AA03 AA04 AA06 AA07 AA08 AA09 AA10
. Printing plates * . . Letterpress, flexographic plate . . . The structure of plate materials . . . Use of liquid resins . . Planographic plates, offset plates . . . PS plates . . . . The structure of printing materials . . . Diffusion transfer planographic plates . . . . The structure of printing materials
AA11 AA12 AA13 AA15 AA16 AA17 AA19 AA20
. . . Planographic plates without water . . . . Use of Si-type photosensitive resins . . . . Stacked photosensitive layers and Si rubber layers . . Engraved plates or photogravure plates . . . Resin photogravure plates . . . Halftone gravure plates . . Screen plates or stencil plates . . . Use of metallic patterns
AA22 AA23 AA24 AA25 AA26 AA27 AA28 AA30
. Photographic images or plate originals . Color proofing . Photomasks . Semiconductor devices, integrated circuits . Printed circuits, printed wiring . Electric or electronic components . Optical components . Others *
BA BA00
PHOTOSENSITIVE MATERIALS 		BA01 BA02 BA03 BA04 BA05 BA06 BA07 BA09 BA10
. Negative photosensitive resins . . Azido types . . Diazo types . . Acetylene low molecular types . . Ethylene low molecular types . . Insolubilized polymer types . . Chromate types . Positive photosensitive resins . . Quinone azido types
BA11 BA13 BA14 BA16 BA17 BA20
. . Solubilized polymer systems . Inorganic photosensitive materials . . Chalcogen types . Other photosensitive materials . . Silver halides . Others *
CA CA00
FORMATION OF PHOTOSENSITIVE LAYERS 		CA01 CA02 CA03 CA05 CA06 CA07 CA09
. Pretreatment of supports . . Use of Si compounds . . Surface roughening, hydrophilic treatment . . Undercoat layers, vapor deposited layers . . . Light absorption . . . Light reflectivity . . Release layers
CA11 CA12 CA13 CA14 CA16 CA17 CA18 CA20
. Coating methods . . Application . . . Flow application . . . Spinning application . . Laminating . . Vapor-phase growth method, plasma polymerization, CVD method . . . Langmuir-Blodgett (LB) method . Others *
DA DA00
PROCESSING PRIOR TO IMAGE EXPOSURE 		DA01 DA02 DA03 DA04 DA10
. Baking (prebaking) . Uniform exposure (pre-exposure) . Processing by gas . Processing by processing liquids . Others *
EA EA00
IMAGE EXPOSURE 		EA01 EA02 EA03 EA04 EA05 EA06 EA07 EA08
. Light sources, radiation sources . . Near-ultraviolet radiation, visible light . . Far-ultraviolet radiation . . Laser . . . Excimer laser . . Electron beams . . X-rays, EUV . . Ion beams
EA11 EA12 EA13 EA14 EA15 EA16 EA18 EA19 EA20
. Exposure methods . . Multiple exposure . . . Simultaneous use of uniform exposure (auxiliary exposure) . . . Image exposure using multiple kinds of radiation sources . . . Double-sided exposure . . . Exposure from the back side . . Intervening material between document to be exposed and photosensitive material . . . Transparent sheets, gaps . . . Diffuser panels
EA21 EA23 EA27 EA30
. . . Photoengraving screens . . Lithographic exposure . . Exposure atmosphere . Others *
FA FA00
PROCESSING PRIOR TO DEVELOPMENT AFTER IAMGE EXPOSURE 		FA01 FA02 FA03 FA04 FA05 FA10
. Baking . Uniform exposure . Ambient atmosphere . Gas processing . Processing by processing liquids . Others *
GA GA00
DEVELOPMENT 		GA01 GA02 GA03 GA04 GA05 GA06 GA08 GA09 GA10
. Liquid development . . . Developers . . . . . Organic solvent type developers . . . . Combinations of solvents . . . . Additives . . . . Specifying of physical property values * . . . Aqueous developers . . . . Alkaline agents . . . . Additives
GA11 GA12 GA13 GA15 GA17 GA18 GA20
. . . . . Surfactants . . . . . Chelating agents . . . . Specification of physical property values * . . . . . Coloring or discoloring by developers . . Rinsing, water washing . . . Rinsing agents . . Drying
GA21 GA22 GA23 GA24 GA25 GA26 GA27 GA29 GA30
. Liquid developing devices . . Dip type developing devices . . . Supply of developers . . . Conveying of sensitized materials . . . Developer tanks . . . . Injecting or spraying developers . . . . Rotary brushes . . Spin developing devices . . . Supply of developers
GA31 GA32 GA33 GA36 GA37 GA38 GA39 GA40
. . . Developer spray nozzles . . . Rotary chucks . . . Developing chambers . Dry development . . Plasma development . . . Types of plasma * . . . Means for use with plasma * . . . Plasma developing devices
GA43 GA45 GA46 GA48 GA50
. . Removal by heating . . Direct removal by exposure . . . Using excimer lasers . . Powder (toner) development . . Release development
GA52 GA54 GA55 GA60
. . Coloring by heating . . Coloring or discoloring by transfer . . . Using microcapsules . Others *
GB GB00
BAKING DEVICES 		GB01 GB02 GB03 GB04 GB05 GB07 GB08 GB10
. Heating means . . Infrared radiation . . Heaters, heating plates . . Microwaves . . Heated gases . Conveying means . . Belt conveyors . Others *
HA HA00
PROCESSING AFTER DEVELOPMENT 		HA01 HA02 HA03 HA07 HA09 HA10
. Baking, post-baking, burning . Processing by processing liquids, desensitizing treatment . Uniform exposure (after-exposure) . Transferring images . Coloring, dyeing . . . Coloring or dyeing for other than resin images
HA11 HA12 HA13 HA14 HA15 HA17 HA18 HA19 HA20
. Etching . . Objects to be etched . . . Metals . . . Non-metals, metal oxides, inorganic compounds . . . Macromolecular compounds, organic compounds . . Wet etching . . . Etchants . . . Wet etching devices . . . . Supplying etchants
HA21 HA23 HA24 HA25 HA27 HA28
. . . . Retaining or rotating objects to be etched . . Dry etching . . . Etching gas compositions * . . . Additional means * . Plating, vapor deposition . . Lift-off method
HA31 HA32 HA33 HA34 HA35 HA36 HA37 HA40
. Correcting images (deforming the patterns obtained) . . Correcting the surfaces of printing plates . . Multiple sets of image-like exposure and development . . Using a pattern as a mold to form another pattern . . Deforming patterns by applying materials (thickening or the like) . . . Deforming patterns using radiation or gases . . Deforming patterns by heat fluidization . Others *
JA JA00
TREATMENT PROCESSES 		JA01 JA02 JA03 JA04 JA06 JA07 JA08 JA10
. Combining processes * . . Up to image exposure * . . From image exposure to development * . . Subsequent to development * . Conversion or simultaneous use of negative and positive . . Changing by exposure . . Changing by development . Others *
KA KA00
MULTILAYER RESIST METHOD 		KA01 KA02 KA03 KA04 KA05 KA06 KA07 KA08 KA09 KA10
. Types of photosensitive layers * . . . Two-layered resist films * . . . Positive lower layers * . . . Negative lower layers * . . . Negative upper layers * . . . Positive upper layers * . . Three or more layers of resist films * . . Intermediate film other than resist between upper and lower layers * . . Lower-layer resists already exposed . . Multiple layers of the same resist *
KA11 KA12 KA13 KA14 KA15 KA16 KA17 KA18 KA19
. Processing methods * . . Application, baking . . Exposure . . Development . . . Of upper layers of resists . . . Of lower layers of resists . . Etching resist films . . . Dry etching . . . Etching lower layers
KA21 KA22 KA23 KA25 KA27 KA30
. . Imparting resistance to dry etching . . Flattening irregular surfaces . . Exposure of the lower layer using an upper-layer resist mask . . Cross-sectional shapes, overhanging shapes . . Enhancing contrast . Others *
LA LA00
SUPPLEMENTARY PROCESSES 		LA01 LA02 LA03 LA06 LA07 LA08 LA09
. Removal or separation of used image layers . . Wet removal or separation . . . Stripping solutions . . Dry removal or separation . . . . . Using plasma or the like . . . . Types of plasma * . . . . Means for use with plasma *
LA11 LA12 LA13 LA16 LA17 LA18 LA19
. Removal or separation of supports or protective layers . . Mechanical separation or removal . . Removal by dissolving using processing liquid . Measuring or evaluating characteristics * . . Of photosensitive resins or photoresists . . Of processing liquids . . . Of developers
LA21 LA22 LA25
. Storing photoresists . . Packages, containers . Disposal of waste processing liquids
LA31 LA40
. DSA (Directed Self Assembly) . Others *
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