| ReturnTo Theme-Group-Choice | Onelevelup |
(Not Translated)
| 2H195 | PREPARING PLATES AND MASK IN PHOTOMECHANICAL PROCESS | |
| G03F1/00 -1/92@Z | ||
| G03F1/00-1/00@Z;1/88-1/90 | AA | AA00 USED FOR MANUFACTRING PRINTING PLATES |
AA01 | AA02 | AA03 | AA04 | AA05 | AA06 | AA07 | AA10 | ||
| . Printed board | . Shadow mask | . Bar code printing | . Form printing | . Transfer printing | . Multicolor printing | . Endless printing | . Other special uses* | |||||
| AB | AB00 MEANS |
AB01 | AB02 | AB03 | AB04 | AB05 | AB06 | AB07 | AB08 | |||
| . Scanner | . . Preparation for input | . . Measurement of magnification | . . Placement of plate | . . Details | . . . Drum | . . . Reading | . . . Exposure | |||||
| AB11 | AB15 | |||||||||||
| . Image of TV and VCR | . Computer | |||||||||||
| AB21 | AB22 | AB23 | AB24 | AB25 | AB26 | AB27 | AB28 | AB30 | ||||
| . Photographic means | . . Repro, mechanical | . . Film template | . . . Handling of film template | . . Exposure | . . Materials | . . Electronic photography | . Printing plate | . Other special means* | ||||
| AC | AC00 OPERATION |
AC01 | AC02 | AC03 | AC04 | AC05 | AC07 | AC08 | AC09 | |||
| . Pattern preparation | . . Image composition, montage | . . Deformation, enlargement, reduction | . . Transfer, rotation, alignment | . . Gradation | . Layout | . trimming | . . Clipping | |||||
| AC11 | AC13 | AC15 | ||||||||||
| . Halftone processing, middle tone processing | . Edge processing | . Other special effect processing* | ||||||||||
| AD | AD00 OTHERS* |
AD01 | AD02 | AD03 | AD04 | AD05 | AD07 | AD08 | AD09 | AD10 | ||
| . Inspection | . . Draft | . . . Tools | . . Page array | . . Inspection of printing plate | . Correction | . . Contrast | . . Gradation | . . Tools | ||||
| AD11 | AD13 | |||||||||||
| . Proof | . Marks | |||||||||||
| G03F1/00@Z-1/86 | BA | BA00 USES FOR MANUFACTRING SEMICONDUCTORS |
BA01 | BA02 | BA03 | BA04 | BA05 | BA06 | BA07 | BA08 | BA09 | BA10 |
| . Projection exposure | . Step and repeat exposure | . Proximity exposure | . Contact exposure | . Split exposure | . Laser | . UV,DUV | . Ion beam, electron beam, particle beam | . . Photoelectron beam | . X-ray | |||
| BA11 | BA12 | |||||||||||
| . Printed board | . For other devices* | |||||||||||
| BB | BB00 MANUFACTURE (PRIORITIZED TO CA) |
BB01 | BB02 | BB03 | BB05 | BB06 | BB07 | BB08 | BB09 | BB10 | ||
| . Pattern generation | . . Shape, array | . . Phase shift mask | . Lithography | . . Exposure | . . . Beam exposure | . . . . Laser | . . . . Ion beam | . . . . Electron beam | ||||
| BB11 | BB12 | BB13 | BB14 | BB15 | BB16 | BB17 | BB18 | BB19 | BB20 | |||
| . . . . X-ray | . . . Projection exposure | . . . Contact exposure | . . Development, etching | . . . Wet process | . . . Dry process | . . . . Plasma CVD | . . Removal of resist | . . Rinse, washing | . . . Physical washing | |||
| BB21 | BB22 | BB23 | BB25 | BB26 | BB27 | BB28 | BB29 | BB30 | ||||
| . . . . Spray washing | . . . Chemical washing | . . Drying, postprocessing | . Plating, deposition, CVD | . Lift-off | . Other means* | . Combined processes | . Retention, handling of original plate and mask | . Pollution prevention, removal of foreign substances | ||||
| BB31 | BB32 | BB33 | BB34 | BB35 | BB36 | BB37 | BB38 | |||||
| . Control, adjustment, detection* | . . Exposure dose | . . Irradiation position | . . Alignment | . . Film thickness | . . Pattern shape | . . Thermal expansion, stress | . . Temperature | |||||
| BC | BC00 COMPONENTS (PRIORITIZED TO CA) |
BC01 | BC02 | BC04 | BC05 | BC06 | BC07 | BC08 | BC09 | BC10 | ||
| . Resist film | . . Multilayer | . Light shielding film | . . Materials | . . . Photosensitivity | . . . Chalcogenide | . . Film forming method | . . Shape, array | . . Embedding | ||||
| BC11 | BC13 | BC14 | BC16 | BC17 | BC19 | BC20 | ||||||
| . . Multilayered | . Antireflective film | . . Materials | . Conducting film | . . Materials | . Protective film | . . Materials | ||||||
| BC21 | BC22 | BC24 | BC26 | BC27 | BC28 | BC30 | ||||||
| . Adhesive film | . . Materials | . Other films with special effects* | . Support substrate | . . Materials | . . Shape | . Frame, reinforcing frame, supporting frame | ||||||
| BC31 | BC32 | BC33 | BC34 | BC35 | BC36 | BC37 | BC38 | BC39 | ||||
| . Pellicle | . . Film | . . . Material | . . . Manufacturing method | . . . Surface treatment | . . Frame | . . . Material | . . . Structure | . . Attachment | ||||
| BD | BD00 INSPECTION, CORRECTION |
BD01 | BD02 | BD03 | BD04 | BD05 | BD06 | BD07 | BD08 | BD09 | ||
| . Inspection | . . Mask | . . . Pattern dimension | . . . Defect and flaw of the pattern | . . . Foreign substance | . . . Superposition precision | . . . Circuit connection, electrical design | . . Pellicle | . . Exposure optical system | ||||
| BD11 | BD12 | BD13 | BD14 | BD15 | BD16 | BD17 | BD18 | BD19 | BD20 | |||
| . . Inspection optical system | . . . Light source | . . . . Laser | . . . . Ion beam, electron beam, X-ray | . . . Photodetector | . . . . ITV | . . . . CCD, linear sensor | . . . Microscope, visual observation | . . . Specific arrangement | . . . Control of optical system | |||
| BD21 | BD22 | BD23 | BD24 | BD25 | BD26 | BD27 | BD28 | BD29 | ||||
| . . Emphasis on inspected part | . . . Photographic processing, transfer | . . . . Inspection on wafer | . . Signal processing | . . . Digital processing | . . . Extraction of characteristics | . . . Comparison and discrimination of signal | . . . . Comparison with design data | . . Handling or inline inspection of inspected matter | ||||
| BD31 | BD32 | BD33 | BD34 | BD35 | BD36 | BD37 | BD38 | BD39 | BD40 | |||
| . Correction | . . Black defect | . . White defect | . . Laser | . . Ion beam | . . Electron beam | . . Lift-off | . . Plating, deposition, CVD | . . Application, coating | . . Other means* | |||
| BE | BE00 MARK AND OTHERS* |
BE01 | BE02 | BE03 | BE04 | BE05 | BE06 | BE07 | BE08 | BE09 | BE10 | |
| . Mark, symbol | . . Uses | . . . Alignment | . . . Identification | . . . Inspection of resolution | . . . Exposure accuracy inspection | . . . Manufacturing process control | . . Arrangement | . . Shape, material | . . Manufacturing | |||
| BE11 | BE12 | |||||||||||
| . Handling, transfer of the mask | . . Mark holder, mask cassette | |||||||||||
| CA | CA00 MASK FOR X-RAY EXPOSURE, EUV EXPOSURE |
CA01 | CA02 | CA03 | CA04 | CA05 | CA06 | CA07 | CA08 | CA09 | ||
| . X-ray(including EUV) absorbing layer, material of absorbing layer* | . Special arrangement relation between X-ray absorbing layer and supporting film. | . Supporting layer of X-ray absorbing layer, material of supporting film* | . Frame, reinforcing body, supporting frame, and their materials* | . Reduction, adjustment of stress | . Adjustment of coefficient of thermal expansion | . Embedding of protective layer, surface layer, absorbing layer* | . Spacer | . Marks for alignment or light transmission part | ||||
| CA11 | CA12 | CA13 | CA14 | CA15 | CA16 | CA17 | CA18 | CA19 | CA20 | |||
| . Defect inspection, defect correction | . Process | . Manufacturing* | . . Electroplating | . . Etching | . . CVD, sputtering, deposition | . . Lithography | . . Lift-off | . . Adhesion | . Others* | |||
| CA21 | CA22 | CA23 | CA24 | |||||||||
| . Stencil type | . Reflective type mask | . . Materials, structure of substrate and multilayered reflective film | . . Antiflare structure, shadowing prevention mechanism |