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2G132 | Tests of electronic circuits | |
G01R31/28 -31/3193 |
G01R31/28-31/30; G01R31/303; G01R31/304; G01R31/306; G01R31/307; G01R31/309; G01R31/311; G01R31/316; G01R31/3161; G01R31/3163; G01R31/3167; G01R31/317; G01R31/3173; G01R31/3177 | AA | AA00 TESTING OBJECTS |
AA01 | AA02 | AA03 | AA04 | AA05 | AA06 | AA07 | AA08 | AA09 | |
. Logic circuits | . . PLA, PLD, gate array | . . CPU, sequential circuits | . . Counters, registers, flip-flops | . . . Flip-flops for scanning | . . Tri-state, bidirectional elements | . . Multi-value (three values or more) logic circuits | . . Memory circuits | . . . ROM, nonvolatile memories, magnetic bubbles | ||||
AA11 | AA12 | AA13 | AA14 | AA15 | AA17 | AA18 | AA20 | |||||
. Analog and digital hybrid circuits (e.g. AD converters) | . Analog circuits | . ASIC | . Multichip modules | . Having functional blocks (macro cells) | . Buffers | . IC cards, or the like | . Mounting boards | |||||
G01R31/28-31/30; G01R31/3161; G01R31/3163; G01R31/3173; G01R31/3177; G01R31/3181 | AB | AB00 TESTING CONTENTS |
AB01 | AB02 | AB03 | AB04 | AB05 | AB06 | AB07 | AB08 | AB09 | AB10 |
. Functional testing | . . Operation analysis, analyzers | . Screening, burn-in, aging | . Marginal testing, life testing, reliability testing | . . Operation margins | . . . Voltage margins | . . . Timing margins | . . . Noise margins | . . . . Electrostatic noises | . . . . High frequency noises | |||
AB11 | AB12 | AB13 | AB14 | AB15 | AB16 | AB17 | AB18 | AB20 | ||||
. . Instantaneous cutoff, voltage sudden changes | . . Withstand voltage | . . Environment testing | . . . Temperature | . . . Humidity | . . . Vibration, impulse, pressure | . . . Dust | . . . Radiation, Ultra-violet radiation | . Monitoring (testing in operating states) | ||||
G01R31/28-31/30; G01R31/3193 | AC | AC00 TESTING PROCESSES |
AC01 | AC02 | AC03 | AC04 | AC05 | AC06 | AC07 | AC09 | AC10 | |
. Comparison with standard circuits | . Comparison between bodies to be tested | . Comparison with reference data | . Comparison by compressed data | . . Comparison of characteristic signals (signatures) | . . Comparison by number of pulses | . . Comparison by analog values, multi level values | . Simulation | . . Analyzing output from actual circuits | ||||
AC11 | AC12 | AC14 | AC15 | AC16 | AC17 | |||||||
. . For circuit designs | . . Hardware simulation, simulation circuits | . Scan-in, scan-out, scan-pass, LSSD | . . Boundary scanning (boundary scanning testing) | . . . Combined use with internal scanning | . . Partial scanning | |||||||
G01R31/28-31/30 | AD | AD00 TESTING ITEMS |
AD01 | AD02 | AD03 | AD04 | AD05 | AD06 | AD07 | AD08 | AD10 | |
. Voltage, current, power | . Parametric characteristics | . Impedances | . Frequencies, phases | . Logic value (HL) voltage | . Logic pattern coincidence | . Delay time, timing | . . Using ring oscillators | . Waveforms, pulse widths | ||||
AD15 | AD18 | |||||||||||
. Discontinuities, short circuits, wiring states | . Heat detection | |||||||||||
G01R31/28-31/30; G01R31/3177; G01R31/319 | AE | AE00 TESTING ARRANGEMENTS (EXCEPT FOR TESTING HEADS) |
AE01 | AE02 | AE03 | AE04 | AE06 | AE08 | AE10 | |||
. Devices for transporting the bodies to be tested | . Devices for fixing the bodies to be tested | . . Fixing by pneumatic pressure, vacuum | . . Positioning of circuit boards, position detection | . Waveform formation circuits (formatters) | . Drivers, sensor circuits | . Connection circuits to input-output terminals | ||||||
AE11 | AE12 | AE14 | AE16 | AE18 | AE19 | |||||||
. Signal switching means | . . Relay matrix arrays | . Comparison and discrimination circuits | . Display | . Records | . . Fail memories | |||||||
AE21 | AE22 | AE23 | AE24 | AE25 | AE26 | AE27 | AE29 | AE30 | ||||
. Circuits for achieving environments at actual use | . Control circuits | . . Controls by programs | . . Batch controls of plural testing arrangements (host systems) | . Relay members to testing heads | . Protection circuits | . Power supplies | . Small checkers, logic checkers | . In-circuit testers | ||||
G01R31/28-31/30; G01R31/302-31/315 | AF | AF00 TESTING HEADS |
AF01 | AF02 | AF03 | AF04 | AF05 | AF06 | AF07 | AF08 | AF10 | |
. Probes | . . Having plural probes | . . For arrangement of probes | . . . Methods for determining mounting position of probes | . . . For corresponding to multiple models of the bodies to be tested | . . Controls of relative positions of probes and the bodies to be tested | . . . Controls in vertical directions (e.g. contact pressure, contact detection) | . . Applying vibration, rotation | . . Probing adapters (e.g. conversion) | ||||
AF11 | AF12 | AF13 | AF14 | AF15 | AF16 | AF18 | AF20 | |||||
. . Contactless probes | . . . Using particle radiation (e.g. ion beams) | . . . Using electron beams (EB) | . . . Using lasers, light | . . . . Using electro-optical elements | . . . By magnetic induction, electrostatic induction | . Pin electronics (e.g. probe change) | . Heating, cooling of probes | |||||
G01R31/28-31/30; G01R31/3183 | AG | AG00 FOR APPLICATION OF SIGNALS |
AG01 | AG02 | AG03 | AG04 | AG05 | AG06 | AG08 | AG09 | ||
. Generation of testing signals | . . Generation by reading memory contents | . . Generation by operation | . . Processing and outputting of read-out data | . . Generation of random signals | . . Generation of multiple signals in one cycle | . Clock pulses, timing signals | . Forcible application of signals | |||||
AG11 | AG12 | AG13 | AG14 | AG15 | ||||||||
. Preparation of testing data | . . Preparation of testing patterns for scanning | . . Preparation using editors, indication circuits | . . Using simulation technology | . . . Using circuit design data (specifications) | ||||||||
G01R31/28-31/30 | AH | AH00 FOR DETECTING SIGNALS |
AH01 | AH02 | AH03 | AH04 | AH05 | AH07 | ||||
. Holding of signals | . Processing of signals | . Identifying specific signals | . Latch signals | . Strobe signals | . Controls by detection signals | |||||||
AJ | AJ00 AUXILIARY DEVICES |
AJ01 | AJ02 | AJ03 | AJ04 | AJ05 | AJ06 | AJ07 | AJ08 | |||
. Extension boards | . . Having active elements | . . Switches, switches with indicators | . . Having features of mechanical structures | . Inspection adapters | . Templates | . Clips, sockets | . . Clips for IC | |||||
G01R31/28-31/30; G01R31/3185; G01R31/3187 | AK | AK00 STRUCTURES OF THE BODIES TO BE TESTED FOR TESTING |
AK01 | AK02 | AK03 | AK04 | AK05 | AK07 | AK08 | AK09 | AK10 | |
. Shapes of IC, structures of terminals of IC | . Check terminal connectors | . Circuit boards | . . Print patterns | . Casing structures | . Circuit arrangements for testing | . . Using exclusive OR | . . Using comparison and discrimination circuits | . . For pull-up, pull-down | ||||
AK11 | AK12 | AK13 | AK14 | AK15 | AK16 | AK17 | AK18 | AK19 | AK20 | |||
. . For dividing, separating circuits | . . For initialization, synchronization | . . CPU for controlling testing operations, logic operation circuits | . . . For scanning | . . Switching circuits to testing modes | . . . Switching by voltage other than normal voltage | . . . Using shift registers | . . . Using counters | . . . Using AD-conversion circuits | . . . Using decoders | |||
AK21 | AK22 | AK23 | AK24 | AK25 | AK26 | AK27 | AK29 | |||||
. . . Using delay circuits | . . Input and output circuits for testing | . . . Scan-in, scan-out, pass circuits | . . . . Internal circuit arrangements of FF for scanning being described | . . . . . Components being transfer gates, FET | . . . . Designs of scan pass built-in circuits | . . . . Structures for adjusting clock timings | . . Self-diagnosis (e.g. BIST) | |||||
G01R31/28-31/30 | AL | AL00 PURPOSE, OTHERS |
AL01 | AL02 | AL03 | AL04 | AL05 | AL06 | AL07 | AL09 | AL10 | |
. Identification of the bodies to be tested, detection of existence | . . By electronic means | . Ensuring of connection | . Confirmation of connection, detection of incorrect connection | . A decrease in the number of connection wires (decrease of the number of terminals) | . Correspondence to multiple models (having multiple purposes) | . . Changing testing programs by models, testing items. | . Shortening of testing time | . . Finishing only by simplified testing | ||||
AL11 | AL12 | AL13 | AL14 | AL15 | AL16 | AL18 | AL19 | AL20 | ||||
. Improvement in testing accuracy | . Specification of failure parts, causes, or the like | . Adjustment of testing arrangements | . . Initial setting (except for calibration) | . . Calibration | . . Adjustment of timings (e.g. skews) | . Impedance matching | . . Earthing | . . Using terminal resistances | ||||
AL21 | AL22 | AL24 | AL25 | AL26 | AL29 | |||||||
. Temperature controls | . . Cooling of testing arrangements | . Level conversion | . Testing of plural bodies to be tested | . . Parallel testing | . Testing bodies to be tested under connecting with bus bars (e.g. bus) | |||||||
AL31 | AL32 | AL33 | AL35 | AL38 | AL40 | |||||||
. Processing at abnormalities, protection | . Testing high functional elements with low functional devices | . . Devices, circuits for supporting testing arrangements | . Improving arrangements of components for testing arrangements | . Performance testing of testing arrangements | . General as testing processes |