F-Term-List

G01R31/26-31/26@Z; G01R31/27

AA00
ELEMENTS TO BE TESTED

AA01

AA02

AA03

AA04

AA05

AA06

AA07

AA08

AA09

AA10

. Transistors or bipolar transistors

. Unipolar elements (e.g., field-effect transistors (FET), metal-oxide semiconductors (MOS) or unijunction transistors (UJT))

. Thyristors or triacs (e.g., gate-turnoff thyristors (GTO) or silicon-controlled rectifiers (SCR))

. Diodes for detection or rectification

. Specialized diodes

. Light elements, light-emitting elements, photocouplers, or solar batteries

. Integrated circuits (IC) or large-scale integrated circuits (LSI)

. Memory elements

. Charge-coupling devices (CCD), bucket-brigade devices (BBD), or charge-injection devices

. Silicon wafers

G01R31/26-31/26@Z

AB00
PARAMETERS TO BE MEASURED

AB01

AB02

AB03

AB04

AB05

AB06

AB07

AB08

AB09

AB10

. Voltage or current characteristics (including characteristic curves)

. Current consumption, power consumption, or input and output current

. Ordering or reverse-direction characteristics

. . Threshold-value voltage or Zener voltage

. Current leakage or dark current

. Impedance

. . Capacity

. Gain or amplification rate of current, voltage, or power

. Switching characteristics (e.g., stand-time or delay-time)

. Frequency cut-off

AB11

AB12

AB13

AB14

AB15

AB16

AB17

AB18

AB19

. Ignition characteristics (e.g., of thyristors)

. . Rate effect, anti-noise characteristics, or dv/dt ratings (i.e., peak-current and carrying capability values obtained from the dv/dt diagramming program)

. Harmonic distortion

. Noise parameters (e.g., noise power or noise voltage)

. Heat resistance

. Element temperature

. Determination of polarity

. Detection of open shorts, cut lines, or short circuits

. Distinguishing of the type of elements

AC00
TYPES OF TESTING

AC01

AC02

AC03

AC04

AC05

AC06

AC07

AC08

AC09

. Longevity, burn-in, or aging testing

. Testing for mechanical strength (e.g., vibration testing or impact testing)

. Testing for temperature characteristics

. . Heat-impact testing or testing of response to temperature cycles

. Testing of waterproofing characteristics

. . Pressure-cooker testing

. Testing of airtight characteristics

. Testing of withstand voltage (e.g., breakdown voltage)

. Testing of bonded areas

AD00
TESTING CONDITIONS

AD01

AD02

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AD04

AD05

AD06

AD07

AD08

AD09

AD10

. Heating or cooling means

. . Thermostats

. . Contact with heat-radiating bodies or cooling bodies

. . Blowing of air

. . Infrared irradiation

. . Use of the heat-radiation of the element itself

. Charging of bias or reverse-bias

. Immersion in liquid

. Application of vibration, pressure, or weight

. Use of water-vapor generators or humidifiers

AE00
TEST SIGNALS

AE01

AE02

AE03

AE04

AE05

AE06

AE07

AE08

AE09

AE10

. Direct current

. Alternating current

. . High-frequency

. Sawtooth waves

. Stair-step waves

. Pulse waves or rectangular waves

. Half waves or full-wave rectified waves (i.e., pulsating current)

. Constant current and constant voltage

. High current and high voltage

. Maintenance of the test-current at a fixed value by means of return circuits

AF00
PROCESSING OF TEST RESULTS

AF01

AF02

AF03

AF04

AF05

AF06

AF07

AF08

AF09

. Display of numeric values, voltage measurement, or current measurement

. Memory

. Use of cathode-ray tubes (CRT) or XY recorders

. Printed recording

. Use of results to drive selection devices

. Display of a go or no-go result (GO-NG display), or display of a positive or negative result

. Display or alarming by means of an audible indication means

. Marking

. Display using light-emitting elements

G01R31/26-31/26@Z; G01R31/265

AG00
CONTACT UNITS, SETTING OF ELEMENTS, OR APPLICATION OF SIGNALS

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AG10

. Sockets

. Clips

. Probes

. Wafer-probes and probe-cards

. Contact with mounts, waveguides, or strips

. Electron beams

. Articles with contact units for conductive liquids or rubber

. Printed boards

. Measurement control terminals or check terminals

. Ease of insertion or removal of elements

AG11

AG12

AG13

AG14

AG15

AG16

AG17

AG18

AG19

AG20

. Close relation with transfer paths

. Improvement of contact

. Testing, detection, or observation of the probe contact status

. Integrated-circuit magazines

. Divided or separated lead wires

. Element-fixing units, order and orientation, and detection of the presence or absence of elements

. Selection of test signals and reversal of impression polarity

. Selection of elements

. Selection of probes

. Positioning of probes or confirmation of the probe position

G01R31/26-31/26@Z

AH00
CONTROL, DETERMINATION, PURPOSE, OR OTHERS

AH01

AH02

AH03

AH04

AH05

AH06

AH07

AH08

AH09

AH10

. Control using computers

. Comparison to reference values or reference waveforms

. Comparison to known good products

. Improved testing speed

. Increased testing accuracy

. Detection of abnormalities or malfunctions of the testing device, or testing or calibration of the testing device

. Protection of or prevention of damage to the testing device or elements to be tested

. Control of heat generation or heat radiation

. Prevention of noise interference or prevention of noise

. Detection of malfunctions or degraded output

2G003	TESTING OF INDIVIDUAL SEMICONDUCTOR DEVICES
	G01R31/26 -31/27