FI (list display)

  • H10N50/00
  • Galvanomagnetic devices (Hall-effect devices H10N 52/00; integrated devices or assemblies of multiple devices H10N 59/00) [2023.01] HB CC 5F092
  • H10N50/01
  • .Manufacture or treatment [2023.01] HB CC 5F092
  • H10N50/10
  • .Magnetoresistive devices [2023.01] HB CC 5F092
  • H10N50/10@A
  • Characterized by the circuits HB CC 5F092
  • H10N50/10@S
  • Semiconductor magnetoresistive elements HB CC 5F092
  • H10N50/10@M
  • Ferromagnetic bodies HB CC 5F092
  • H10N50/10@P
  • Magnetosensitive part patterns HB CC 5F092
  • H10N50/10@B
  • Bias magnetic fields HB CC 5F092
  • H10N50/10@U
  • Use HB CC 5F092
  • H10N50/10@Z
  • Others HB CC 5F092
  • H10N50/20
  • .Spin-polarised current-controlled devices (magnetoresistive devices H10N 50/10) [2023.01] HB CC 5F092
  • H10N50/80
  • .Constructional details [2023.01] HB CC 5F092
  • H10N50/80@D
  • Electrodes HB CC 5F092
  • H10N50/80@H
  • Protective layers HB CC 5F092
  • H10N50/80@P
  • Characterized by the movable members, e.g., potentiometers HB CC 5F092
  • H10N50/80@Z
  • Others HB CC 5F092
  • H10N50/85
  • ..Magnetic active materials [2023.01] HB CC 5F092
    TOP