FI (list display)

  • H10N30/00
  • Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N 39/00) [2023.01] HB CC 5F050
  • H10N30/01
  • .Manufacture or treatment [2023.01] HB CC 5F050
  • H10N30/02
  • ..Forming enclosures or casings [2023.01] HB CC 5F050
  • H10N30/03
  • ..Assembling devices that include piezoelectric or electrostrictive parts [2023.01] HB CC 5F050
  • H10N30/04
  • ..Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning [2023.01] HB CC 5F050
  • H10N30/045
  • ...by polarising [2023.01] HB CC 5F050
  • H10N30/05
  • ..Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes [2023.01] HB CC 5F050
  • H10N30/053
  • ...by integrally sintering piezoelectric or electrostrictive bodies and electrodes [2023.01] HB CC 5F050
  • H10N30/057
  • ...by stacking bulk piezoelectric or electrostrictive bodies and electrodes [2023.01] HB CC 5F050
  • H10N30/06
  • ..Forming electrodes or interconnections, e.g. leads or terminals [2023.01] HB CC 5F050
  • H10N30/063
  • ...Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts [2023.01] HB CC 5F050
  • H10N30/067
  • ...Forming single-layered electrodes of multilayered piezoelectric or electrostrictive parts [2023.01] HB CC 5F050
  • H10N30/07
  • ..Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base [2023.01] HB CC 5F050
  • H10N30/071
  • ...Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate [2023.01] HB CC 5F050
  • H10N30/072
  • ...by laminating or bonding of piezoelectric or electrostrictive bodies [2023.01] HB CC 5F050
  • H10N30/073
  • ....by fusion of metals or by adhesives [2023.01] HB CC 5F050
  • H10N30/074
  • ...by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing [2023.01] HB CC 5F050
  • H10N30/076
  • ....by vapour phase deposition [2023.01] HB CC 5F050
  • H10N30/077
  • ....by liquid phase deposition [2023.01] HB CC 5F050
  • H10N30/078
  • .....by sol-gel deposition [2023.01] HB CC 5F050
  • H10N30/079
  • ....using intermediate layers, e.g. for growth control [2023.01] HB CC 5F050
  • H10N30/08
  • ..Shaping or machining of piezoelectric or electrostrictive bodies [2023.01] HB CC 5F050
  • H10N30/081
  • ...by coating or depositing using masks, e.g. liftoff [2023.01] HB CC 5F050
  • H10N30/082
  • ...by etching, e.g. lithography [2023.01] HB CC 5F050
  • H10N30/084
  • ...by moulding or extrusion [2023.01] HB CC 5F050
  • H10N30/085
  • ...by machining [2023.01] HB CC 5F050
  • H10N30/086
  • ....by polishing or grinding [2023.01] HB CC 5F050
  • H10N30/088
  • ....by cutting or dicing [2023.01] HB CC 5F050
  • H10N30/089
  • ....by punching [2023.01] HB CC 5F050
  • H10N30/09
  • ..Forming piezoelectric or electrostrictive materials [2023.01] HB CC 5F050
  • H10N30/092
  • ...Forming composite materials [2023.01] HB CC 5F050
  • H10N30/093
  • ...Forming inorganic materials [2023.01] HB CC 5F050
  • H10N30/095
  • ....by melting [2023.01] HB CC 5F050
  • H10N30/097
  • ....by sintering [2023.01] HB CC 5F050
  • H10N30/098
  • ...Forming organic materials [2023.01] HB CC 5F050
  • H10N30/20
  • .with electrical input and mechanical output, e.g. functioning as actuators or vibrators [2023.01] HB CC 5F050
  • H10N30/30
  • .with mechanical input and electrical output, e.g. functioning as generators or sensors [2023.01] HB CC 5F050
  • H10N30/40
  • .with electrical input and electrical output, e.g. functioning as transformers [2023.01] HB CC 5F050
  • H10N30/50
  • .having a stacked or multilayer structure [2023.01] HB CC 5F050
  • H10N30/60
  • .having a coaxial cable structure [2023.01] HB CC 5F050
  • H10N30/80
  • .Constructional details [2023.01] HB CC 5F050
  • H10N30/85
  • ..Piezoelectric or electrostrictive active materials [2023.01] HB CC 5F050
  • H10N30/853
  • ...Ceramic compositions [2023.01] HB CC 5F050
  • H10N30/857
  • ...Macromolecular compositions [2023.01 HB CC 5F050
  • H10N30/87
  • ..Electrodes or interconnections, e.g. leads or terminals [2023.01] HB CC 5F050
  • H10N30/88
  • ..Mounts; Supports; Enclosures; Casings [2023.01] HB CC 5F050
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