FI (list display)

  • H01L33/00
  • Semiconductor devices having potential barriers? specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (H10K 50/00 takes precedence; devices consisting of a plurality of semiconductor components formed in or on a common substrate and including semiconductor components having potential barriers?, specially adapted for light emission H01L 27/15; semiconductor lasers H01S 5/00)[2010.01] HB CC 5F241
  • H01L33/00@H
  • Finished product mounting HB CC 5F142
  • H01L33/00@J
  • Drive circuits HB CC 5F241
  • H01L33/00@K
  • Testing and measuring HB CC 5F241
  • H01L33/00@L
  • Devices for reference [finished products which use luminescent devices] HB CC 5F142
  • H01L33/00@Z
  • Others HB CC 5F241
  • H01L33/02
  • .characterised by the semiconductor bodies [2010.01] HB CC 5F241
  • H01L33/04
  • ..with a quantum effect structure or superlattice, e.g. tunnel junction [2010.01] HB CC 5F241
  • H01L33/06
  • ...within the light emitting region, e.g. quantum confinement structure or tunnel barrier [2010.01] HB CC 5F241
  • H01L33/08
  • ..with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body(H01L27/15 takes precedence) [2010.01] HB CC 5F241
  • H01L33/10
  • ..with a light reflecting structure, e.g. semiconductor Bragg reflector [2010.01] HB CC 5F241
  • H01L33/12
  • ..with a stress relaxation structure, e.g. buffer layer [2010.01] HB CC 5F241
  • H01L33/14
  • ..with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure [2010.01] HB CC 5F241
  • H01L33/16
  • ..with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous [2010.01] HB CC 5F241
  • H01L33/18
  • ...in light emitting region [2010.01] HB CC 5F241
  • H01L33/20
  • ..with a particular shape, e.g. curved or truncated substrate [2010.01] HB CC 5F241
  • H01L33/22
  • ...Roughened surfaces, e.g. at the interface between epitaxial layers [2010.01] HB CC 5F241
  • H01L33/24
  • ...of the light emitting region, e.g. non-planar junction [2010.01] HB CC 5F241
  • H01L33/26
  • ..Materials of the light emitting region [2010.01] HB CC 5F241
  • H01L33/28
  • ...containing only elements of Group II and Group VI of the Periodic Table?[2010.01] HB CC 5F241
  • H01L33/30
  • ...containing only elements of Group III and Group V of the Periodic Table?[2010.01] HB CC 5F241
  • H01L33/32
  • ....containing nitrogen [2010.01] HB CC 5F241
  • H01L33/34
  • ...containing only elements of Group IV of the Periodic Table?[2010.01] HB CC 5F241
  • H01L33/36
  • .characterised by the electrodes [2010.01] HB CC 5F241
  • H01L33/38
  • ..with a particular shape [2010.01] HB CC 5F241
  • H01L33/40
  • ..Materials therefor [2010.01] HB CC 5F241
  • H01L33/42
  • ...Transparent materials [2010.01] HB CC 5F241
  • H01L33/44
  • .characterised by the coatings, e.g. passivation layer or anti-reflective coating [2010.01] HB CC 5F241
  • H01L33/46
  • ..Reflective coating, e.g. dielectric Bragg reflector [2010.01] HB CC 5F241
  • H01L33/48
  • .characterised by packages of semiconductor device bodies [2010.01] HB CC 5F142
  • H01L33/50
  • ..Wavelength conversion elements [2010.01] HB CC 5F142
  • H01L33/52
  • ..Encapsulations [2010.01] HB CC 5F142
  • H01L33/54
  • ...having a particular shape [2010.01] HB CC 5F142
  • H01L33/56
  • ...Materials, e.g. epoxy or silicone resin [2010.01] HB CC 5F142
  • H01L33/58
  • ..Optical field-shaping elements [2010.01] HB CC 5F142
  • H01L33/60
  • ...Reflective elements [2010.01] HB CC 5F142
  • H01L33/62
  • ..Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls [2010.01] HB CC 5F142
  • H01L33/64
  • ..Heat extraction or cooling elements [2010.01] HB CC 5F142
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