F-Term-List

H01P1/202;1/205@A-1/205@J;1/205@Z;7/04

HA00
RESONATOR ELEMENTS 3 (COAXIAL LINE)

HA01

HA02

HA03

HA04

HA05

. Combination of distributed reactance

. Coaxial resonators

. . Dielectric coaxial resonators

. . . Integral formation of a plurality of resonators

. . . All surfaces of the dielectric covered by conductors

HA11

HA12

HA13

HA14

HA15

HA16

HA17

HA18

HA19

. Lambda/2 length both ends open or both ends short circuit

. SIR (also classified in JA31)

. External shapes excluding SIR

. . Cylindrical

. . Square tube shapes

. Chamfering

. Non-penetrating inner conductors

. Inner conductor shape non-linearexcluding SIR

. . Return

HA21

HA22

HA23

HA24

HA25

HA26

HA27

HA28

. Conductor terminals

. . having spring properties

. . covered by dielectrics e.g. synthetic resins

. . Wire bonding

. Electroconductive film terminals

. . Conductive films forming gap capacity

. Surface mounting

. . opening holes in substrates for containing resonators

HA31

HA32

HA33

HA34

HA35

. connecting reactance elements in serial

. . L

. . C (also classified in HA23 or HA26)

. . . Chip condensers

. . . Opposite electrodes of front and back of substrate

H01P1/203;7/08

HB00
RESONATOR ELEMENTS 4 (FLAT LINE)

HB01

HB02

HB03

HB04

HB05

. Combination of distributed reactance elements

. by slots or coplanar lines

. Strip line resonators

. . Tri-plate line resonators

. . Layered

HB11

HB12

HB13

HB14

HB15

HB16

HB17

. Specific line length excluding lambda/4

. . Lambda/2 length

. Folded shape

. . Hair-pin shaped

. Flat

. Ring shaped

. Uneven line width (SIR; also classified in JA31)

HB21

HB22

. Surface mounting

. Through hole

H01P1/20@A;7/10

HC00
RESONATOR ELEMENTS 5 (WAVEGUIDE MODE)

HC01

HC02

HC03

HC04

HC05

HC06

HC07

. Cavity resonators

. . Shapes other than cylindrical or square tube

. Dielectric resonators

. . Doughnut shaped

. . Spherical

. . Divided shape by specular conductors

. related to dielectric compositions

HC11

HC12

HC13

HC14

. Basic resonator mode

. . TE mode

. . TM mode

. Multiplex mode e.g. dual mode

HC21

HC22

HC23

HC24

HC25

HC26

. Resonator supports

. . Supports integrated with resonators

. . Holes for fitting resonators or plates having grooves

. Directly loaded on substrates

. Adherence by screws

. Adherence by adhesives

H01P1/20@B;1/20@Z;1/215-1/218;7/00

HD00
RESONATOR ELEMENTS 6 (OTHER)

HD01

HD02

HD03

HD04

HD05

HD06

HD07

HD08

. Helical resonators

. . Bobbin shapes other than cylindrical

. Resonators using magnetic substances e.g. YIG

. . Thin film magnetic substances

. . . Layering with dielectric layers excluding GGG

. Resonators by distributed LC elements

. . formed on dielectric substrates

. . . Layered

HD11

HD12

. Surface mounting

. Through holes

H01P1/212

JA00
FILTERS

JA01

JA02

JA03

JA04

JA05

JA06

JA07

JA08

JA09

JA10

. BPF (Band Pass Filter)

. BEF (Band Elimination Filter)

. LPF (Low Pass Filter)

. HPF (High Pass Filter)

. Combination of 2 or more filters

. . BPF and BEF

. . BPF and LPF (also classified in JA31)

. using circulators

. Combination of resonators in different shapes

. Combination of different kind of resonators

JA11

JA12

JA13

JA14

JA15

JA16

JA17

. BPF having polarization properties

. . having resonators for notch formation

. . mutually coupling non-adjacent stages

. . . Usage of dual mode resonators

. . . using loops and probes for coupling

. . . using lines for coupling

. . . . Electrode pattern lines also strip lines

JA21

JA22

JA23

. Suppression of direct coupling between input/output

. . having shield conductors between input/output

. . forming cut-off space

JA31

JA32

JA33

JA34

. Suppression of spurious

. . Rods

. . Wave absorbers or resistors

. . Formation of grooves or slits

H01P1/207@Z;1/211

JB00
WAVEGUIDE FILTERS

JB01

JB02

JB03

JB04

JB05

JB06

. Posts

. Iris; E surface parallel

. Iris; H surface parallel

. Dielectric

. Corrugated

. Waffle irons

H01P1/213@M-1/213@P;1/213@Z

KA00
WAVELENGTH MULITPLEXING AND DEMULTIPLEXING OR COMMON UNITS 1

KA01

KA02

KA03

KA04

KA05

KA06

KA07

KA08

. Branch composition

. . LC phase circuit networks

. . Branch lines of fixed length

. . . Multiple branches

. . . . Tournament branching

. . Resonator coupling circuits

. . Hybrids

. . . Usage of two hybrids

KA11

KA12

KA13

. Frequency selective composition

. . Elimination property elements e.g. BEF

. . Elements of different properties per each branch

KA21

KA22

KA23

KA24

. Other additional components

. . LPF

. . Reactance elements

. . Send-receive switching

H01P1/213@D

KB00
WAVELENGTH MULITPLEXING AND DEMULTIPLEXING OR COMMON UNITS 2 (WAVEGUIDE BRANCHING)

KB01

KB02

KB03

. Branching from main waveguide

. Dual branching

. . E surface branching

KB11

KB12

KB13

KB14

KB15

. Waveguide terminal end (for signal reflection)

. Waveguides for branching the same frequency into more than two

. Conductors for reflecting specific straight polarisation components

. Waveguide tapered part or dimension change composition

. Slots with resonator rods

H01P1/20-1/219;7/00-7/10

LA00
PURPOSES

LA01

LA02

LA03

LA04

LA05

LA06

LA07

LA08

LA09

. Property improvement

. . High Q or Low loss

. . Steepening of skirt properties or improvement of separation

. . Symmetrisation of skirt properties

. . Widening of bandwidth or dense coupling

. . Narrowing of bandwidth or coarse coupling

. Consideration of impedance properties e.g. adjustment

. Compliance with large electric power

. Improvement of grounding

LA11

LA12

LA13

LA14

LA15

LA16

LA17

LA18

LA19

. Facilitation of property adjustment

. Stabilization of properties

. . Stray capacitor countermeasures

. Countermeasures against temperature change or heat

. . Heat radiation

. . Consideration of thermal expansion coefficient of materials

. . . Combination of materials having different thermal expansion coefficients

. Improvement of earthquake resistance or shock and vibration resistance

. Improvement of damp resistance and weather resistance

LA21

LA22

LA23

LA24

LA25

LA26

LA27

LA28

LA29

LA30

. Miniaturisation or improvement of space factor

. . Improvement by element shapes

. . Improvement by element arrangement

. Reduction of the number of parts

. Facilitation of assembly or manufacturing

. . Facilitation of the positioning of components

. Improvement in reliability

. . Reduction of defect rate or reduction of variation

. . Electric protection e.g. prevention of the application of excessive electric power

. . . Insulation between conductors

H01P1/20-1/209;1/215-1/218;7/00-7/10

MA00
FREQUENCY ADJUSTMENT OR CORRECTION COMPOSITION

MA01

MA02

MA03

MA04

MA05

MA06

MA07

MA08

MA09

. Insertion length of members or distance change (see viewpoint MB)

. . Rotational movement or angle change see viewpoint MB

. Electrodes

. . Trimming

. Addition or cutting of dielectrics

. Addition of inductance elements

. Addition of capacity elements

. . Variable capacity elements

. . . Diodes

MA11

MA12

MA13

MA14

. Coarse adjustment or fine adjustment

. changing frequency stepwise

. adjusting correcting frequency automatically

. . using bimetal (also LA15)

MB00
FREQUENCY ADJUSTING MEMBERS (MA01-MA02)

MB01

MB02

MB03

. Conductors (Bimetals: MA14 takes precedence)

. Dielectrics

. Plate shape

NA00
INPUT AND OUTPUT COUPLING COMPOSITION

NA01

NA02

NA03

NA04

NA05

NA06

NA07

NA08

NA09

NA10

. Probes; open ends

. Loops; short circuit ends

. Tap coupling

. Capacity also assigned to viewpoint NC

. Inductors

. Slots openings or irises

. Direct connection

. Lines

. . Waveguides

. . Dielectric lines e.g. NRD guides

H01P1/20@B;1/20@Z;1/202-1/203;1/205@A-1/205@H

NB00
INTERSTAGE COUPLING COMPOSITION 1 (MAINLY TEM MODE)

NB01

NB02

NB03

NB04

NB05

NB06

NB07

NB08

NB09

NB10

. Coupling openings (penetrated openings)

. Slits grooves

. . Open end sides

. . metalised

. Conductors connected to ground potential

. Windows

. Capacity also assigned to viewpoint NC

. Inductors

. Pi type LC circuits

. Lines

H01P1/20@B;1/20@Z;1/202-1/203;1/205@A-1/205@G

NC00
COUPLING CAPACITY COMPOSITION (ALSO CLASSIFIED IN NA04 OR NB07)

NC01

NC02

NC03

. Chip capacitors (NE16 takes precedence)

. Capacity by gaps of electrodes arranged together

. Capacity by counter electrodes

H01P1/20@A;1/208-1/209

ND00
INTERSTAGE COUPLING COMPOSITION 2 (WAVEGUIDE MODE)

ND01

ND02

ND03

ND04

ND05

. Irises

. Posts

. Openings slots

. . Rounds

. . Ovals rectangles

H01P1/20-1/203;1/205@A-1/205@H;1/208-1/209;7/00-7/10

NE00
COUPLING ADJUSTING COMPOSITION (INPUT/OUTPUT OR INTERSTAGES)

NE01

NE02

NE03

. Use of additional members e.g. screws

. . Conductors

. . Dielectrics

NE11

NE12

NE13

NE14

NE15

NE16

NE17

. Distance or insertion e.g. forward and backward movement of screws

. Rotation or angle change

. Position adjustment

. Modification

. . Elimination

. Variable elements e.g. diodes

. Adjustment of intervals of resonators

H01P1/205@B-1/205@D;1/205@G

NF00
FORMING PARTS OF COUPLING MEMBERS

NF01

NF02

NF03

. Forming on substrates such as coupling substrates

. . A plurality of sheets

. Integration with elements

H01P1/20@A;1/20@B;1/203;1/205@A-1/205C;7/00@A;7/04;7/08-7/10

PA00
CASING, OR CASINGS OR SHIELDS COMPOSITION

PA01

PA02

PA03

PA04

PA05

PA06

PA07

PA08

PA09

PA10

. for covering wholly

. for covering only the parts

. Combination with substrates

. Combination of two or more conducting plates

. . having L-shaped conducting plates

. having openings

. having raised pieces by chipping

. having grounding terminals

. with elasticity

. Casings in which conducting films are adhered to dielectrics

H01P1/20-1/219;7/00-7/10

PB00
OTHER COMPOSITIONS

PB01

PB02

PB03

PB04

. Amplifying elements

. Signal detection composition

. SAW filters

. Use of two or more dielectrics with different dielectric constants

5J006	Control of motors that do not use commutators
	H01P1/20 -1/219;7/00-7/10