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5G321 | SUPERCONDUCTORS AND MANUFACTURING METHODS THEREFOR | |
H01B12/00 -12/16;13/00,561-13/00,565@Z |
H01B12/00-12/16;13/00,561-13/00,565 | AA | AA00 SUPERCONDUCTOR COMPONENTS |
AA01 | AA02 | AA03 | AA04 | AA05 | AA06 | AA07 | AA10 | ||
. Oxide ceramic compositions | . . La-Ba-Cu-O compositions | . . La-Sr-Cu-O compositions | . . Y-Ba-Cu-O compositions | . . Bi-Sr-Ca-Cu-O compositions | . . Bi-Pb-Sr-Ca-Cu-O compositions | . . Tl-Ba-Ca-Cu-O compositions | . Chevrel types | |||||
AA11 | AA12 | AA13 | ||||||||||
. A3B types (e.g., A-15 types or greek small letter beta-W type) | . Alloy compositions | . Organic substance compositions | ||||||||||
AA98 | AA99 | |||||||||||
. Other components | . Unknown components | |||||||||||
BA | BA00 APPLICATIONS |
BA01 | BA02 | BA03 | BA04 | BA05 | BA06 | BA07 | BA08 | BA09 | BA10 | |
. Wires or cables | . . Wires or cables for winding | . Coils or electromagnets | . Switches (e.g., heat switches or current-limit switches) | . Connections (e.g., current leads) | . . Connection of superconducting wire to superconducting wire | . Elements | . . Josephson elements | . . Transistors | . . Quantized interference elements (e.g., SQUID) | |||
BA11 | BA14 | |||||||||||
. Shields (e.g., magnetic shielding) | . Alternating current or pulsed current | |||||||||||
BA99 | ||||||||||||
. Other applications | ||||||||||||
CA | CA00 SUPERCONDUCTOR STRUCTURE |
CA01 | CA02 | CA03 | CA04 | CA05 | CA06 | CA07 | CA08 | CA09 | CA10 | |
. Internal structure of superconductors | . . Addition of trace of components | . . Control of crystal phase (e.g., amorphous) | . . Crystal orientation (e.g., C-axis orientation) | . . Multilayer structures | . . Crystal diameter or shape | . . Crystal grain boundaries | . . Single core line | . . Multiple core lines | . . . Dispersed fibers | |||
CA11 | CA12 | CA13 | CA15 | CA16 | CA17 | CA18 | CA19 | CA20 | ||||
. . . Twisted fibers | . . . Spiral cross-sections | . . Pinning centers | . Overall superconductor structures | . . Twisted lines | . . Braided lines | . . Tape filament | . . Coaxial types | . . Film-like structures | ||||
CA21 | CA22 | CA23 | CA24 | CA26 | CA27 | CA28 | CA30 | |||||
. . . Thin films | . . . Thick films | . . . Films on cores | . . . Films on substrates | . Substrates or cores | . . Substrate or core components | . . Boundaries with superconducting layers | . Sheaths | |||||
CA31 | CA32 | CA34 | CA35 | CA36 | CA38 | CA39 | ||||||
. . Sheath structures (e.g., pores) | . . Sheath components | . Matrices | . . Matrix structure (e.g., divided) | . . Matrix components | . Diffusion barriers | . . Diffusion barrier structure | ||||||
CA41 | CA42 | CA43 | CA44 | CA46 | CA48 | CA50 | ||||||
. Stabilizing materials | . . Stabilizing material components | . . Island types | . . Twisted type | . Fastening or affixing structure | . Electrical insulation | . Protective structures | ||||||
CA51 | CA52 | CA53 | CA54 | CA55 | ||||||||
. . Moisture-proof structures | . . Reinforcing structures | . . Protection against stretching and compression | . . . Bellows-like | . . . Pre-distortion (i.e., pre-strain) | ||||||||
CA99 | ||||||||||||
. Other structures | ||||||||||||
CB | CB00 COOLING AND MAINTAINING LOW TEMPERATURES |
CB01 | CB02 | CB03 | CB04 | CB05 | CB07 | CB08 | ||||
. Cooling systems | . . Coolant flow paths | . . Cooling fins | . . Hollow types | . . Cable-in-conduit types | . Maintaining low temperatures | . . Thermal insulation | ||||||
CB99 | ||||||||||||
. Other cooling, or maintaining of low temperatures | ||||||||||||
DA | DA00 COMMON MANUFACTURING METHODS |
DA01 | DA02 | DA03 | DA04 | DA05 | DA06 | DA08 | DA10 | |||
. Mechanical processing methods | . . Rolling | . . Extrusion, diametral compression, or wire drawing techniques | . . . Hydrostatic extrusion | . . . Extrusion billets | . . Stranding methods | . Fastening or affixing methods | . Stabilizing material manufacturing methods | |||||
DA12 | ||||||||||||
. Manufacturing apparatuses | ||||||||||||
DA99 | ||||||||||||
. Other manufacturing methods (common) | ||||||||||||
DB | DB00 MANUFACTURING METHODS FOR CERAMIC SUPERCONDUCTORS |
DB01 | DB02 | DB03 | DB05 | DB06 | DB07 | |||||
. Raw material manufacturing or treatment methods | . . Raw material powders | . . Vapor phase starting solutions | . Constituent raw materials of pastes | . . Using binders | . . Limitations on grain size of raw material powders | |||||||
DB11 | DB12 | DB13 | DB14 | DB15 | DB17 | DB18 | DB19 | |||||
. Binder processes | . . Doctor blade techniques | . . Screen printing techniques | . . Suspension spinning techniques | . . Injection molding | . Non-binder processes | . . Sheath techniques | . . Diffusion techniques | |||||
DB21 | DB22 | DB23 | DB24 | DB25 | DB26 | DB28 | DB29 | DB30 | ||||
. Solution techniques | . . Thermal decomposition with organic acid salts, or thermal decomposition with organometallic complexes | . . Sol or gel techniques | . . . Gel spinning | . . Spin coating | . . Spraying | . Melting and solidifying | . . Partial melting | . . Directional solidification | ||||
DB31 | DB33 | DB34 | DB35 | DB36 | DB37 | DB38 | DB39 | DB40 | ||||
. . Rapid solidification | . Gas phase techniques | . . Physical vapor deposition | . . . Vacuum deposition | . . . Molecular beam epitaxy | . . . Laser vapor deposition | . . . Laser ablation | . . . Sputtering | . . Chemical vapor deposition | ||||
DB41 | DB42 | DB44 | DB45 | DB46 | DB47 | DB48 | DB50 | |||||
. . . Metal oxide chemical vapor deposition (i.e., MO-CVD) | . . . Plasma chemical vapor deposition | . Heat treatment methods | . . Hot pressing or hot isostatic pressing | . . Heat treatment atmosphere (e.g., oxidizing atmosphere) | . . Heat treatment temperature | . . Cooling after heat treatment (e.g., multistage cooling) | . Diametral compression or rolling after calcining | |||||
DB52 | DB54 | DB55 | DB56 | |||||||||
. Magnetic fields are used | . Treatment after production | . . Reforming methods | . . Moisture-proofing methods | |||||||||
DB99 | ||||||||||||
. Other manufacturing methods (ceramic compositions) | ||||||||||||
DC | DC00 MANUFACTURING METHODS FOR A3B TYPE SUPERCONDUCTORS |
DC01 | DC03 | DC04 | DC06 | DC08 | DC09 | DC10 | ||||
. Surface dispersion techniques | . Melting and solidifying | . . Quenching | . Sheath techniques | . Composite processing techniques | . . Bronzing | . . External dispersion techniques | ||||||
DC11 | DC12 | DC13 | DC14 | DC15 | DC17 | DC18 | DC19 | |||||
. . Internal dispersion techniques | . . Solid-liquid reaction techniques | . . Niobium tube techniques | . . Jellyroll techniques | . . Filament bundling techniques | . Manufacturing methods for fiber-dispersed superconductors | . . In situ techniques | . . Cutting, melting and fastening techniques | |||||
DC21 | DC22 | DC23 | DC24 | DC25 | DC26 | DC27 | DC29 | DC30 | ||||
. Thin-film formation | . . Physical vapor deposition | . . . Vacuum vapor deposition. | . . . Molecular beam epitaxy | . . . Sputtering | . . . . Assist techniques | . . Chemical vapor deposition | . Thick-film formation | . . Molten spraying | ||||
DC32 | DC33 | DC35 | DC36 | |||||||||
. Heat treatment | . . Heat treatment temperature | . Treatment after production | . . Reforming methods | |||||||||
DC99 | ||||||||||||
. Other manufacturing methods (A3B types) | ||||||||||||
DD | DD00 MANUFACTURING METHOD FOR ALLOYS AND OTHER SUPERCONDUCTORS |
DD01 | DD02 | DD04 | DD05 | |||||||
. Heat treatment | . . Heat treatment temperature | . Treatment after production | . . Reforming methods | |||||||||
DD99 | ||||||||||||
. Other manufacturing methods (alloys and others) |