F-Term-List

H05K3/10-3/26@Z;3/38-3/38@Z

AA00
SHAPE, STRUCTURE, OR MATERIAL OF THE BASE BOARD OF A PRINTED WIRING BOARD

AA01

AA02

AA03

AA05

AA07

. structure of the base boards of printed wiring boards

. . of a flat shape

. . . of a long shape

. . for multi-piece dicing

. . having through-holes

AA11

AA12

AA13

AA14

AA15

AA16

AA17

AA18

AA19

. Materials of printed wiring boards

. . mainly made of synthetic resins

. . . Prepregs

. . . . Paper base materials

. . . . Glass-cloth base materials

. . . of specified resin compositions

. . . . Epoxy resins

. . . . Polyimide resins

. . . . Fluorocarbon resins

AA22

AA23

AA24

AA26

AA27

. . mainly made of inorganic materials e.g. metal bases

. . . Ceramics

. . . . specifying ceramic compositions

. . . Glass

. . . . specifying glass compositions

AA32

AA33

AA34

AA35

AA36

AA37

AA38

AA39

AA40

. . specifying properties of boards

. . . Flexibility

. . . Transparency

. . . specifying properties of the surfaces of boards

. . . . Surface roughness

. . . . Surface layers of boards

. . . . . Organic layers

. . . . without adhesive layers between conductors and boards

. Others

BB00
SHAPE, STRUCTURE, OR MATERIAL OF CONDUCTOR PATTERN

BB01

BB02

BB03

BB04

BB05

BB06

BB08

BB09

. Structure of conductor patterns specified

. . Board surfaces made flush with conductor surfaces

. . Conductor surfaces recessed on the board surfaces

. . Layers beneath the conductor layers provided on the bonding surface with the boards

. . . Organic layers

. . . Inorganic layers

. . Partial structure of a conductor pattern being different

. . . Terminals

BB12

BB13

BB14

BB15

BB16

BB17

BB18

. . Numerical limitation for the structure of conductor patterns

. . . Width of conductor patterns

. . . Thickness of conductor patterns

. . structure of conductor layers

. . . Two layers

. . . Three layers

. . . More than three layers

BB21

BB22

BB23

BB24

BB25

BB27

BB28

. Materials of conductors e.g. cermets

. . Metals alone

. . . Group 1B (Au)

. . . . Copper (Cu)

. . . . Silver (Ag)

. . . Group 3B

. . . . Aluminium (Al)

BB33

BB34

BB35

BB37

BB38

BB39

BB40

. . . Group 4

. . . . Tin (Sn)

. . . . Titanium (Ti)

. . . Group 6

. . . . Chromium (Cr)

. . . . Molybdenum (Mo)

. . . . Tungsten (W)

BB43

BB44

BB45

BB47

BB48

BB49

. . . Iron group

. . . . Nickel (Ni)

. . . . Cobalt (Co)

. . . Platinum group

. . . . Palladium (Pd)

. . . . Platinum (Pt)

BB52

BB53

BB54

BB55

BB57

BB58

BB59

BB60

. . Alloys

. . . Group 1

. . . Group 4

. . . Group 8

. . Non-metals

. . . Carbon e.g. graphite

. . . Metal oxides

. . . Organic conductors

BB61

BB62

BB63

BB65

BB66

BB67

BB68

BB69

. with functions specified for conductor patterns

. . Functions of electrical circuit elements

. . . Resistor elements

. States of conductor materials

. . Self-supporting conductors

. . . Foils or plates

. . . Wires

. . . . insulation-coated

BB71

BB72

BB73

BB74

BB75

BB76

BB77

BB78

BB79

BB80

. . Non-self-support conductors

. . . Paste

. . . . Vehicles being inorganic materials

. . . . . Inorganic compositions being specified

. . . . Vehicles being organic materials

. . . . . Organic materials being specified

. . . . Additives specified

. . . Powder

. . . . Powder surfaces being plated

. Others

CC00
TREATING AGENT USED FOR FORMING CONDUCTOR PATTERN

CC01

CC02

CC03

CC04

CC06

CC07

CC08

CC09

. Adhesives

. . containing rubber resins

. . containing epoxy resins

. . contain polyamide and polyimide resins

. . having specified additives

. . . Inorganic materials

. . . . Oxides

. . . . Carbonates

CC17

CC18

CC20

. . . Macromolecular materials

. . . . Rubber particles

. . . containing plating catalysts

CC21

CC22

CC23

CC24

CC25

CC26

. Surface treating agents for board adhesive layers or conductor layers

. . Organic materials

. . . Organic solvents

. . . . Alcohol

. . . . Halogenated hydrocarbon

. . . . . Fluorides

CC32

CC33

CC34

CC35

CC36

CC37

CC38

. . Inorganic materials

. . . Acids

. . . . Sulphuric acid (H2SO4)

. . . . Chromic acid (H2CrO4)

. . . . Phosphoric acid (H3PO4)

. . . . Hydrofluoric acid (HF)

. . . . Hydrochloric acid (HCl)

CC43

CC44

CC45

CC46

CC47

CC48

CC50

. . . Alkali

. . . . Alkali metal hydroxides

. . . Peroxides e.g. hydrogen peroxide (H2O2)

. . . Salts

. . . . Bichromates

. . . . Permanganates

. . Mixtures of liquids of more than one kind

CC52

CC54

CC55

CC56

. . having numeric limitation in compositions concentrations or the like

. . with specified additives

. . . Surfactants

. . . . Surfactants containing fluorine

CC61

CC62

CC63

CC65

CC67

. Materials or properties of resists being specified

. . Photoresists

. . . Negative

. . with specified additives

. . also working as insulation layers or solder resists

CC71

CC72

CC73

CC74

CC75

CC76

CC78

CC80

. Catalysts for non-electrolytic plating

. . Metal components of noble metals

. . . Palladium

. . with specified reducing agents

. . in the form of paste

. . in the form of colloids

. with specified plating bath compositions

. Other treating agents

DD00
METHOD OF FORMING CONDUCTOR PATTERNS

DD01

DD02

DD03

DD04

DD05

. Coating of conductive paste

. . Printing

. . . Screen printing

. . . . Specifying of printing conditions

. . . . . Methods of moving squeegees

DD12

DD13

DD14

DD15

DD16

DD17

DD18

DD20

. . Drawing with dispensers

. . . not using masks

. . . . controlling the properties of conductive paste

. . . . Control of heads or nozzles

. . . . . in response to the surfaces structures of boards

. . . . . . Non-contact control

. . . . . specifying the timing for paste ejection

. . specifying other methods of coating conductive pastes

DD21

DD22

DD23

DD24

DD25

DD26

. Plating

. . Dry plating

. . . Vapour deposition

. . . . Ion plating

. . . . Sputtering

. . . . Chemical vapour deposition (CVD)

DD32

DD33

DD34

DD35

DD36

. . Wet plating

. . . Chemical plating

. . . . with specified treatment conditions

. . . . . Agitation in plating baths

. . . . . Control of plating baths

DD43

DD44

DD45

DD46

DD47

DD48

DD49

DD50

. . . Electrolytic plating

. . . . with specified treatment conditions

. . . . . Agitation in plating baths

. . . . . Conditions on currents

. . . . . . Current densities

. . . . . Controls of plating baths

. . . . Movements of electrodes

. . . . by spraying electrolytic solutions

DD51

DD52

DD53

DD54

DD55

DD56

DD57

DD58

DD59

. Bonding of conductors or conductor layers

. . specified in laminating method

. . . Continuous laminating methods

. . . Methods specified for pressing

. . . . Pressing patterns

. . . Transferring

. . . forming board layers on conductors with resins

. . . . using melted resins

. . . . . Injection moulding

DD62

DD63

DD64

DD65

DD67

DD68

DD69

. . Bonding of conductors previously formed on conductor patterns

. . . Forming by plating

. . . Forming by printing

. . by laying wires

. Converting insulation layers into conductor layers

. . using energy beam irradiation

. . . Laser radiation

DD71

DD72

DD73

DD75

DD76

DD78

DD80

. Powder adhering methods

. using electrophotographic or magnetographic processes

. forming on both sides at the same time

. including processes for removing conductor layers

. . Chemical etching

. Forming conductor patterns after mounting components

. Other methods of forming

EE00
METHOD OF SURFACE TREATMENTS EXCEPT THOSE FOR FORMING CONDUCTOR PATTERNS

EE01

EE02

EE03

EE04

EE05

EE06

EE08

EE10

. Cleaning

. . Cleaning by using liquids

. . . by brushing

. . . by spraying

. . . by using ultrasonic waves

. . . by immersing

. . by using gases

. . Cleaning in combined processes

EE12

EE13

EE14

EE15

EE16

EE17

EE18

EE20

. . Timings for cleaning

. . . during the conductor pattern forming processes

. . . . Removal of plating catalysts

. . . after forming the conductor patterns

. . . . Removal of plating catalysts

. . . . Removal of resists

. . . after mounting components

. . including processes for cutting liquids and drying

EE21

EE22

EE23

EE24

EE25

EE26

EE28

. Forming adhesive layers

. . Coating

. . . by printing

. . . by using dispensers

. . . using transfer processes

. . . using flow cast processes

. . . Forming more than one layer

EE31

EE32

EE33

EE34

EE35

EE36

EE37

EE38

EE39

EE40

. Surface treatment of the surfaces of boards or adhesive layers

. . Physical treatments

. . . Mechanical treatments

. . . Arc treatments

. . . . Corona treatments

. . . . Plasma treatments

. . Chemical treatments

. . . Oxidation

. . . Specification of treatment conditions

. . Partial treatments

EE41

EE42

EE43

EE44

EE45

EE46

. Surface treatment of conductor layers

. . Physical treatments

. . . Mechanical treatments

. . . Arc treatments

. . . . Corona treatments

. . . . Plasma treatments

EE52

EE53

EE54

EE55

EE56

EE58

EE60

. . Chemical treatments

. . . Chemical conversion treatments

. . . . chromating

. . . Electrolytic treatments

. . . Coupling agent treatments

. . Partial treatments

. Other methods of surface treating

ER00
OTHER RELATED TREATMENT METHODS

ER01

ER02

ER04

ER05

ER07

ER08

. Application of chemical plating catalysts

. . Application to the whole boards

. . Partial applications

. . . Application after forming resists

. . with specified reduction processes

. . . Reduction using light

ER11

ER12

ER13

ER14

ER16

ER18

. Resist treatments

. . Coating

. . . by printing

. . . by using dispensers

. . adhering

. . Exposing or developing

ER21

ER22

ER23

ER25

ER26

. Forming plating leads in electroplating

. . Forming with base conductor patterns at the same time

. . forming after forming base conductor patterns

. Removal of plating leads

. . by chemical etching

ER31

ER32

ER33

ER35

ER36

ER37

ER38

ER39

. Heat treatments

. . during the conductor pattern forming processes

. . after forming conductor patterns

. Hardening or burning

. . Specified atmospheres

. . . Inert gas atmospheres

. . . Reducing atmospheres

. . Specified temperatures

ER42

ER43

ER44

ER45

ER46

ER47

ER49

ER50

. . Specified hardening or burning means

. . . Ultra-violet rays

. . . Infra-red rays

. . . Lasers

. . . Electron beams

. . treatment in the form of patterns

. treatment for flushing conductor pattern surfaces and board surface

. . by pressing

ER51

ER52

ER53

ER54

ER55

ER56

ER57

ER58

ER60

. Modification of conductor patterns

. Removal of transfer bases

. . by chemical etching

. Corrections of warped or curled circuit boards

. Registering

. . Boards and stages

. . Boards and masks

. . Registering by using marks

. Other treatment methods

FF00
DEVICES USED FOR FORMING CONDUCTOR PATTERNS

FF01

FF02

FF03

FF04

FF05

FF07

FF08

FF09

FF10

. Coating devices

. . Printing devices

. . . Stages

. . . Squeegees

. . Dispensers or drawing devices

. Adhering devices

. . Transferring devices

. Conveyor devices

. . Carriers

FF11

FF12

FF13

FF14

FF16

FF17

FF18

FF19

FF20

. Burning or hardening devices

. Masks

. . Screens

. . . Metal screens

. Plating devices

. . Plating baths

. . Electrodes

. . . Common electrodes

. . Plating jigs

FF21

FF23

FF24

FF26

FF27

FF28

FF30

. Devices for cutting conductors

. Cleaning or polishing devices

. Registering devices

. Moulding machines

. . Injection moulding machines

. Combinations of various devices

. Other devices and jigs

GG00
PURPOSES OR EFFECTS

GG01

GG02

GG03

GG04

GG06

GG08

. Improvements of adhesion

. . Conductors and boards of printed wiring boards

. . to resists

. . by roughening the surface of boards or conductors

. uniformising conductors

. making patterns fine and correct

GG11

GG13

GG14

GG16

GG18

GG20

. Simplification of manufacturing processes

. Improvement of electrical characteristics

. . Insulation properties

. Improvement of heat resistances

. Improvement of soldering properties

. Other purposes or effects

5E343	MANUFACTURING OF PRINTED WIRING (2)
	H05K3/10 -3/26@Z;3/38-3/38@Z