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| 5E049 | Thin magnetic films | |
| H01F10/00 -10/32;41/14-41/34 | ||
| H01F10/00-10/32;41/14-41/34 | AA | AA00 MAGNETIC MATERIALS (METALS, ALLOYS) |
AA01 | AA04 | AA07 | AA09 | AA10 | |||||
| . Metals and alloys composed mainly of iron | . Metals and alloys composed mainly of cobalt | . Metals and alloys composed mainly of nickel | . Variants characterized by the components substituted or contained | . Other metals or alloys | ||||||||
| AB | AB00 MAGNETIC MATERIALS (INORGANIC COMPOUNDS) |
AB01 | AB02 | AB03 | AB04 | AB05 | AB06 | AB07 | AB09 | AB10 | ||
| . Iron compounds | . . Iron oxides | . . Composite iron oxides (i.e., ferrites) | . . . AO?Fe203 (i.e., spinel) | . . . AO?nFe203 (i.e., magnet plumbite) | . . . A3Fe5012 (i.e., garnet) | . . Iron compounds other then iron oxides | . Variants characterized by the components substituted or contained | . Other inorganic compounds | ||||
| AC | AC00 MAGNETIC MATERIALS (STRUCTURE, OTHERS) |
AC01 | AC03 | AC05 | AC08 | AC10 | ||||||
| . Amorphous | . Monocrystals | . Layered magnetic materials | . Unspecified magnetic materials | . Other magnetic materials | ||||||||
| BA | BA00 MAGNETIC CHARACTERISTICS APPLICATIONS |
BA01 | BA05 | BA06 | BA07 | BA08 | ||||||
| . Hard (for magnets) | . Semi-hard | . . For magnetic recording | . . . In-plane magnetizing | . . . Perpendicular magnetizing | ||||||||
| BA11 | BA12 | BA14 | BA16 | |||||||||
| . Low or high permeability | . . For magnetic heads | . . For transformer cores | . . For magnetic sensors | |||||||||
| BA22 | BA23 | BA25 | BA27 | BA29 | BA30 | |||||||
| . Magnetooptics, photomagnetism, thermomagnetism | . . For photomagnetic recording | . For magnetic bubbles | . Absorption of radio waves (electromagnet waves) | . For microwave elements | . Other magnetic characteristics and applications | |||||||
| H01F10/00;41/32;41/34 | CB | CB00 THIN MAGNETIC FILM STRUCTURE |
CB01 | CB02 | CB06 | CB10 | ||||||
| . Variants made of layered materials | . . Non-magnetic materials in intermediate layers | . Filamentary materials (e.g., wires) | . Other structures | |||||||||
| CC | CC00 SURFACE COATING OF THIN MAGNETIC FILMS |
CC01 | CC05 | CC08 | ||||||||
| . Variants using inorganic materials | . Variants using organic materials | . Multi-layer coatings | ||||||||||
| H01F10/26-10/32 | DB | DB00 BASE MATERIALS AND INTERMEDIATE LAYERS |
DB01 | DB02 | DB04 | DB06 | DB08 | DB10 | ||||
| . Base materials | . . Variants made of metals or alloys | . . Variants made of inorganic compounds | . . Variants made of organic compounds | . . Base materials characterized by shape | . . Other base materials | |||||||
| DB11 | DB12 | DB14 | DB16 | DB18 | DB20 | |||||||
| . Intermediate layers | . . Variants made of metals or alloys | . . Variants made of inorganic compounds | . . Variants made of organic compounds | . . Intermediate layers characterized by shape | . . Other intermediate layers | |||||||
| H01F41/14-41/30 | EB | EB00 METHODS OR FORMING THIN MAGNETIC FILMS IN GENERAL |
EB01 | EB03 | EB05 | EB06 | ||||||
| . Variants that are subjected to magnetic field when formed | . Characterized by treatment prior to formation | . Characterized by treatment following formation | . . Variants that are heated | |||||||||
| H01F41/14;41/16;41/30 | FC | FC00 OTHER METHODS OF FORMATION |
FC01 | FC03 | FC06 | FC08 | FC10 | |||||
| . Ion implantation | . Plasma spraying | . Unspecified methods of formation | . Common to multiple methods of formation (GC - MC are assigned) | . Other methods of formation | ||||||||
| H01F41/18 | GC | GC00 SPUTTERING |
GC01 | GC02 | GC04 | GC06 | GC08 | |||||
| . Sputtering | . . Characterized by targets | . . Radio frequency (i.e., RF) sputtering | . . Ion beams sputtering | . . Reactive sputtering | ||||||||
| H01F41/20 | HC | HC00 VAPOR DEPOSITION |
HC01 | HC02 | HC03 | HC05 | HC06 | |||||
| . Vacuum vapor deposition | . . Characterized by the vapor deposition source | . . Reactive vapor deposition | . Ion plating | . . Reactive ion plating | ||||||||
| H01F41/22 | JC | JC00 HEATING |
JC01 | JC03 | JC05 | |||||||
| . Variants using heat treatment | . Variants using thermal decomposition | . Chemical vapor deposition | ||||||||||
| H01F41/24 | KC | KC00 METHODS OF FORMING FROM LIQUIDS |
KC01 | KC02 | KC04 | KC10 | ||||||
| . Electroless plating | . . Characterized by the plating bath | . . Characterized by the substrate | . Other methods of formation | |||||||||
| H01F41/26 | LC | LC00 ELECTROLYTIC PLATING |
LC01 | LC02 | LC04 | LC06 | ||||||
| . Electrolytic plating | . . Characterized by the plating bath | . . Characterized by the substrate | . . Characterized by electrolysis conditions | |||||||||
| H01F41/28 | MC | MC00 LIQUID PHASE EPITAXY |
MC01 | MC02 | MC03 | MC05 | MC07 | MC09 | ||||
| . Liquid-phase epitaxy | . . Characterized by dipping | . . . Characterized by temperature | . . Characterized by chipping | . . Characterized by flux components | . . Characterized by the substrate | |||||||
| MC11 | MC12 | |||||||||||
| . Liquid phase epitaxy devices | . . Substrate holding apparatuses |