F-Term-List

H04R9/00-9/00@Z;9/02-9/10

AA00
DYNAMOELECTRIC TRANSDUCER TYPES

AA01

AA02

AA03

AA04

AA05

. Diaphragms acting as movable conductors

. Movable conductors directly on a flat diaphragm

. Movable conductors directly on a curved diaphragm

. . Pile-drivers

. Rotation drives

BA00
VIBRATION COMPONENTS

BA01

BA02

BA03

BA04

BA05

BA06

BA07

BA08

BA09

. Movable conductors

. . Cross-sectional shapes

. . Arrangement

. . Insulation

. . Printed conductors

. Bobbins

. Coupling cones and coupling bodies

. Centering units and dampers

. Center caps

BB00
STATIONARY COMPONENTS

BB01

BB02

BB03

BB04

BB05

BB06

BB07

BB08

BB09

. Frames

. Magnetic circuitry

. . Magnets

. . Yokes, plates, and center poles

. . . Locations in the vicinity of the magnetic gap

. . . . Addition of conductors or conductive layers

. . . . Addition of magnetic substances or magnetic layers

. . Objects that fill the magnetic gap

. . Magnetic circuits for prevention of leakage flux

BC00
ELECTRICAL CONNECTIONS TO MOVABLE CONDUCTORS OR CIRCUITS THEREFOR

BC01

BC02

BC03

BC04

BC05

BC06

. Connections between movable conductors and leads

. Leads (e.g., tinselled wire)

. Terminals

. Connections between the terminal and the lead

. Inductive connections to movable conductors

. Mixed-functional-block (MFB) circuit arrangements

BD00
AUXILIARY MEMBERS

BD01

BD02

BD03

BD04

BD05

BD06

BD07

BD08

BD09

. Mechanical filters in the vibration unit

. . Visco-elastic bodies

. . Bodies with added mass

. Air holes

. Sound-absorption materials

. Air chambers

. Horns, equalizers, and diffusers

. Radiation fins and heat pumps

. Magnetic-shield materials

CA00
COUPLINGS BETWEEN BASIC ELEMENTS

CA01

CA02

CA03

CA04

CA05

CA06

CA07

CA08

CA09

CA10

. Combinations of couplings

. . Movable conductors and diaphragms

. . Movable conductor and bobbin

. . Bobbins and diaphragms

. . Bobbins and coupling cones or coupling bodies

. . Coupling cones or coupling bodies and diaphragms

. . Dampers and other structural elements

. . Frames and circuits other than magnetic circuits

. . Frames and magnetic circuits

. . Leads and vibration units

CA11

CA12

CA13

CA14

CA15

CA16

CA18

. Coupling means

. . Integration by molding

. . Mechanical coupling

. . Bonding

. . Press-fitting and welding

. . Coupling by molding agents

. Coupling locations

DA00
OVERALL ARRANGEMENT AND CONFIGURATION

DA01

DA02

DA03

DA04

. Diaphragms inside magnetic circuits

. Multiple diaphragms

. Multiple drive units

. Composite transducers

EA00
MATERIAL PROPERTIES

EA01

EA02

EA03

EA04

EA06

EA07

EA08

. Materials

. . Conductive materials

. . Magnetic materials

. . Insulating materials

. Shapes, structure, and physical properties

. . Multiple layers

. . Fibrous types

FA00
PURPOSE AND EFFECTS

FA01

FA02

FA03

FA04

FA05

FA06

FA07

FA08

FA09

FA10

. Improved characteristics

. . Improved frequency characteristics

. . Distorted wave prevention

. Improved structural strength

. Use of members for dual purposes

. Protection or adjustment control

. Prevention of overheating

. Prevention of leakage flux

. Improved resistance to dust, weather, or water

. Ease of manufacturing or assembly

GA00
APPLICATIONS

GA01

GA02

GA03

GA04

. Speakers

. . Speakers for multi-directional systems

. Microphones

. Telephone handsets

HA00
MANUFACTURING AND ASSEMBLY METHODS

HA01

HA02

HA03

HA04

. Positioning methods

. . Bobbin-mounting methods

. Molding methods

. Printing methods

JA00
MANUFACTURING AND ASSEMBLY APPARATUSES

JA01

JA02

JA03

. Jigs and tools

. Dies

. Carrier manufacturing and assembly apparatuses

5D012	Audible-bandwidth dynamoelectric transducers other than pickups
	H04R9/00 -9/00@Z;9/02-9/10;9/18;31/00@B