F-Term-List

5D004 Piezo-electric transducers for audible bands
H04R17/00 ;17/02;17/10
H04R17/00;17/02;17/10 AA AA00
PURPOSES AND EFFECTS
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. Conversion efficiency (e.g., sensitivity and sound pressure levels) . Frequency characteristics . . Vibration modes . Noise (i.e., prevention of shaking) . Impedance conversion (i.e., matching) . Directional characteristics . Mechanical intensity and shock-resistance . Flexibility (i.e., entire transducers) . Reduction of weight and reduction of size . Shield effects
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. Electric insulation . Temperature characteristics . Stability of movement . Moisture-proofing, waterproofing, and corrosion-proofing
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PIEZOELECTRIC MATERIALS
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. Ceramics . Ferroelectric single crystals . Polymers . Compound materials . Transparent piezoelectric materials
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VIBRATION CELLS AND ELEMENTS THAT ARE DIAPHRAGMS
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. Vibration cells that are structured of single piezoelectric elements . . Curved surfaces . Structure of piezoelectric elements of more than three layers . Structures using bimorphs or unimorphs . . Joining of piezoelectric elements to non-piezoelectric boards . . . Use of thin metallic boards . . . Use of thin polymer boards . Vibration elements with characteristic shapes . . Use of wave-shaped vibration elements . Added layers
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DRIVING OF SEPARATE DIAPHRAGMS USING VIBRATION ELEMENTS
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. Joining of elements and diaphragms . . Joining the diaphragm to the center of the element . . Joining the diaphragm to the periphery of the element . Shapes of diaphragms . . Cones . . Domes . . Planes . Diaphragms with characteristic structures . . Additional layers . Joining of vibration elements to non-piezoelectric diaphragms
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USES
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. Radio transmitters . Radio receivers . . Microphones . . Pick-ups for vibration detection . Resonance . . Resonance means . . . Resonance spaces
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MULTIPLE VIBRATION ELEMENTS
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. Each element has different resonance characteristics
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DETAILS
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. Electrodes . . Divided electrodes . . Feedback electrodes . Electrical connection to electrodes . . Lead wire draw-out units . Adhesion of piezoelectric bodies . Casings and arrangements thereof . . Support of vibration elements . . Support of diaphragms . . Mounting of circuit elements
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MANUFACTURING METHODS
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