F-Term-List

H01J37/00-37/36

AA00
DEVICE TYPES

AA01

AA02

AA03

AA04

AA05

AA06

AA07

. Microscope devices

. . Types

. . . Scanning type

. . . Transmission type

. . . Scanning transmission type

. . . Reflection type

. . . Ion microscopes

AA12

AA13

AA14

AA15

AA16

. . Observation method

. . . Bright-field methods

. . . Dark-field methods

. . . Phase-difference methods, Phase-contrast methods

. . . Electron diffraction methods

AA21

AA22

AA23

AA25

AA27

. Analyzers

. . Elemental analysis

. . Energy analysis

. Ion implantation devices

. Exposure devices

AA31

AA32

AA33

AA34

AA35

AA36

AA37

AA39

. Processing devices

. . By focused ion beams

. . By projection type beams

. . Ion milling

. . 3D modeling

. . Film formation

. . With a microscope

. Other charged particle beam devices

BB00
OBJECTS

BB01

BB02

BB03

BB04

BB05

BB06

BB07

BB08

BB09

BB10

. Vacuum improvement, cleanup, contamination prevention

. Abnormal electrical discharge prevention

. Time reduction, speed-up

. Measures against distortion, vibration, or expansion of devices

. Maintainability improvement

. Operation simplification

. Space saving

. Shielding

. Cost reduction, power saving

. Measures for space-charge effect or blow-up

BB11

. With high SN

CC00
CHAMBERS, EXHAUST MECHANISMS

CC01

CC02

CC04

CC05

CC06

. Irradiation chambers

. Attachment chambers

. Exhaust means

. . Differential evacuation

. . Local vacuum

CC11

CC12

CC13

CC14

CC15

CC17

CC19

. Vacuum components

. . Vacuum seals

. . Bellows

. . Valves, opening and closing mechanisms

. . Caps, introduction parts, feedthroughs

. Means for introducing gases into a chamber

. Attachment optical microscopes

DD00
ION SOURCES, ELECTRON SOURCES

DD01

DD02

DD03

DD04

DD05

DD06

DD07

DD08

DD09

. Types

. . Field ionization ion sources

. . Plasma discharge type ion sources

. . Gas cluster ion sources

. . Photoelectric emission type electron sources

. . Field emission type electron sources

. . Schottky type, thermal field emission type electron sources

. . Thermionic electron emission type electron sources

. . Other ion sources and electron sources

DD11

DD12

DD13

DD14

DD15

DD16

DD17

DD18

DD19

DD20

. Constructional members

. . Emitter units (including electron sources for plasma generation)

. . . Emitters themselves

. . . . Specific materials, crystal faces, crystal axes

. . . . Manufacturing, conditioning

. . . Peripheral members

. . . Cooling mechanisms

. . . Heating mechanisms

. . Light sources and optical systems for excitation

. . Raw material supply systems

DD22

DD23

DD24

DD25

DD26

DD27

DD28

DD29

DD30

. . Arc chambers

. . Electron source chambers, ion source chambers

. . . Pressure holding mechanisms

. . Electrodes

. . Insulators

. . Magnetic field generators

. . Moving parts

. . Openings for ribbon beam generation

. . Voltage and current application circuits

DD31

DD33

DD34

DD36

DD38

DD40

. Raw materials

. Emitted ionic species

. . Negative ions

. Particle species change

. Beam control

. Replacement of members

EE00
BEAM OPTICAL SYSTEMS, TRANSPORTATION SYSTEMS, ACCELERATION SYSTEMS

EE01

EE02

EE03

EE04

EE05

EE06

EE08

. Types, functions

. . Beam shaping, dividing, stopping down

. . . Multi-beam generation

. . . Apertures

. . . Phase plates

. . . Beam shaping

. . Aberration correction

EE12

EE13

EE14

EE15

EE16

EE17

EE19

. . Beam focusing, beam divergence

. . . Irradiation optical systems

. . . Objective lenses

. . . Image forming optical systems

. . . Beam divergence

. . . Electrostatic lenses

. . Beam parallelization

EE22

EE23

EE25

EE26

EE27

EE28

EE30

. . Beam deflection

. . . For blankers

. . Beam acceleration or deceleration, energy control

. . . Electrodes just before an irradiated target (retarding electrodes)

. . . Electrodes in an objective lens (booster electrodes)

. . . Accelerators

. . Beam neutralization

EE32

EE33

EE34

EE35

EE36

EE37

EE38

EE40

. . Beam separation, selection, blocking

. . . Separation of primary and secondary beams

. . . Energy separation

. . . Mass separation

. . . Beam cutoff

. . . Exposure masks, processing masks

. . . ExB filters

. . Others

EE41

EE42

EE43

EE44

EE45

EE46

EE47

EE48

EE49

. Controlled parameters

. . Beam sizes, beam density distributions

. . Beam current amounts

. . Beam energy, implantation depths

. . Beam angle, beam angle distribution

. . Magnification or reduction ratio

. . Focusing, divergence

. . Scan trajectory, scan range, scan direction

. . Scanning speeds, frequencies

EE51

EE53

EE55

EE57

EE59

. With control of secondary beams

. Feedback control

. Control according to irradiated targets

. Potential distribution, electric fields, magnetic fields

. Positions of optical feature points

EE61

EE62

EE63

EE64

EE65

EE66

EE67

EE68

EE69

EE70

. Constructional members

. . Electric field or magnetic field applying members

. . . Coils

. . . Yokes, magnetic poles

. . . Electrodes

. . . Insulators

. . . Multipole structures

. . Voltage or current application circuits

. . Slits, apertures

. . . Passage hole shapes

EE72

EE73

EE74

EE75

EE76

EE78

EE80

. . Lens tubes, beam transportation tubes

. . . Multiple lens tubes

. . . Inverted lens tubes

. . Moving members

. . Support members

. Combination or arrangement of electron optics members

. Beam line shapes

FF00
IRRADIATED TARGETS, PLACING AND MOVING MEMBERS THEREOF

FF01

FF02

FF03

FF04

FF05

FF06

FF09

. Irradiated targets

. . Semiconductors

. . Living organisms

. . Standard samples, reference samples

. . Liquids, gels

. . High-aspect-ratio structures (level differences, holes, irregularities, and the like)

. Arrangement process of irradiated targets

FF11

FF12

FF13

FF14

FF15

FF16

FF17

FF18

FF19

FF20

. Processing applied to irradiated targets

. . Before beam irradiation

. . During beam irradiation

. . After beam irradiation

. . Voltage application, current application

. . Heating, cooling

. . Irradiation of light (including IR and UV) or radioactive rays

. . Compression or tension

. . Gas or fluid irradiation

. . Air pressure atmosphere

FF22

FF23

FF24

FF25

FF26

FF27

. . Processing

. . . Slicing

. . Directing toward specific crystal orientations

. . Charging, discharging

. . Embedding, film formation

. . Markers, marker giving

FF31

FF32

FF34

FF36

. Irradiated target transfer means (manipulators and the like)

. Taking-in to the inside or taking-out to the outside of an irradiation chamber

. Masks for processing or observation

. Sample protection members

FF41

FF42

FF43

FF44

FF45

FF46

FF47

FF48

FF49

FF50

. Members on which irradiated targets are placed

. . Replaceable type

. . Side entry type

. . Top entry type

. . Multiple irradiated targets arrangement

. . Shapes of placement members for irradiated targets

. . Grids

. . Attachment of alignment marks or reference marks

. . Fixation mechanisms

. . . Deposition

FF52

FF53

FF54

FF55

FF56

FF57

FF58

FF59

FF60

. . Reciprocating motion, mechanical scan

. . Moving mechanisms or turning mechanisms

. . . Movement exceeding an irradiation chamber

. . . Movement between a plurality of charged particle devices

. . . Parallel movement

. . . . Z direction

. . . Tilt mechanisms

. . . Rotation mechanisms

. . . Multi-spindle rotation

GG00
DETECTION MEANS

GG01

GG02

GG03

GG04

GG05

GG06

GG07

GG08

GG09

GG10

. Detection targets

. . Information from an irradiated target

. . . Electrons

. . . . Secondary electrons

. . . . Reflection electrons (backscattered electrons)

. . . . Auger electrons

. . . Electromagnetic waves

. . . . Cathodoluminescence

. . . . X-rays

. . . . Optical images

GG13

GG15

GG16

GG18

GG19

GG20

. . . Ions

. . Primary beams

. . Sample absorption current

. . Others

. . . Detection of stage positions, angles, and states

. . . Member monitoring

GG21

GG22

GG23

GG24

GG25

GG26

GG28

. Physical quantities of a detection target

. . Temperature

. . Pressure, vacuum degree

. . Processing amounts (sputter, implantation dose, and the like)

. . Electric variables (resistance, impedance, and the like)

. . Vibration, distortion

. Cooperative operation with other detectors

GG31

GG32

GG33

GG34

GG35

GG36

GG37

. Detector types

. . MCPs, die nodes, electron-multiplier tubes

. . Faraday cups

. . Scintillation detectors (emission units, light guiding units, photoelectric conversion units)

. . Fluorescent plates, photographic plate systems

. . Semiconductor direct detectors

. . Arrays, pixel type, variance type

GG41

GG42

GG44

GG46

GG49

. Detector auxiliary members (cooling means and the like)

. . Masks, filters, and collimators for measurement

. Moving mechanisms

. Built-in in a sample table

. Circuits for detectors

HH00
PROCESSING OF OBTAINED DATA

HH01

HH02

HH03

HH04

HH05

HH06

. Beam physical quantity output

. . Beam angle, beam angle distribution, parallelism

. . Beam positions

. . Beam divergence, size, density distribution

. . Beam current, fluence, implantation volume

. . Beam energy, speed, implantation depth

HH11

HH13

HH15

HH16

HH17

HH19

. Defect detection of an irradiated target

. Charging-state output of an irradiated target

. Dimension output of an irradiated target

. . Three dimensional sizes, beam axial direction sizes

. . Pattern length measurement

. Surface state output of irradiated targets

HH21

HH22

HH23

HH24

HH25

HH26

HH27

HH28

. Cooperation with an optical system

. Extraction of shapes or edges of irradiated targets

. Processing for positioning of a beam or an irradiated target

. Superposition with other detected data, positioning

. Comparison with other detected data

. Gain, offset adjustment

. Map creation

. Timing of performing processing

HH31

HH32

HH33

HH34

HH35

HH36

HH37

HH38

HH39

HH40

. Image processing

. . Thinning, interpolation, reduction, expansion

. . Connection, division

. . Superposition

. . . Average, integration

. . Extraction of specific pixels or patterns

. . Three-dimensional image formulation

. . Shading ratios, luminance evaluation or adjustment

. . Sharpness evaluation, adjustment

. . Alignment or pattern matching between images

HH42

HH43

HH44

HH46

HH47

HH48

HH49

HH50

. . Image shift processing, detection

. . Differentiation, difference

. . Fourier transformation, space frequencies

. Device assessment

. . Aberration assessment

. . Focus assessment

. . Detector assessment

. . Abnormality assessment

HH51

HH52

HH53

HH54

HH55

HH56

HH58

. Analysis methods, operation methods

. . Matrix operation

. . Approximate processing

. . Convolution

. . Coordinate transformation

. . Operation using transfer functions

. Under sampling (compressed sensing)

HH61

HH62

HH63

HH64

HH65

HH66

HH68

. Correction, amendment

. . Charging correction

. . Correction of detector factors

. . Aberration correction

. . Vibration component removal

. . Noise removal

. Processing circuits

JJ00
TOTAL CONTROL PROCESSING

JJ01

JJ02

JJ03

JJ04

JJ05

JJ06

JJ07

JJ08

JJ09

JJ10

. Coordination of observation and processing

. Calculation of observation or processing parameters

. Simulation of observed images or processing

. Learning

. IoT

. Stored contents

. Database utilization

. Data transmission

. Remote control, coordination with exterior equipment

. Triggering processing

JJ11

JJ12

. Data compression

. Other control

KK00
INPUT-OUTPUT DEVICES

KK01

KK02

KK03

KK04

KK05

KK06

KK07

KK08

KK09

. Observed image output

. . Three-dimensional distribution and shape output

. . Moving image output

. Input-output related to beams or optical systems

. Input-output related to lens tubes or chamber interior

. Input-output related to detectors or detection processing

. . Area of interest setting

. Input-output related to operation of irradiated targets

. Warning output

KK11

KK12

KK13

KK14

KK15

KK16

KK17

KK18

KK19

. Processing at the time of display change

. Selection of displayed parameters

. Graph indication of parameters

. Arrangement of a plurality of display or operation objects

. . Side-by-side arrangement

. . . Low magnification images and high magnification images

. . Overlapped arrangement

. Additional display

. GUIs

LL00
OTHERS

LL01

LL02

LL04

LL05

LL06

LL07

. Design

. . Beam line

. Manufacturing methods

. Calibration

. Equipment management, evaluation methods

. Installation, environments

5C101	CHARGED PARTICLE BEAM DEVICES
	H01J37/00 -37/36