F-Term-List

(Not Translated)
5C040 Gas-filled discharge tubes
H01J11/00 -17/64
H01J11/00-11/54;17/00-17/06;17/10-17/36;17/40-17/46;17/48;17/48@Z;17/49-17/49@Z FA FA00
PANEL TYPES
FA01 FA02 FA04 FA05 FA07 FA09 FA10
. AC type gas discharge display panels . DC type gas discharge display panels . Matrix display panels . Segment display panels . Multi-colour display panels excluding full colour display panels . Plasma addressed liquid crystal (PALC) panels . Others *
GA GA00
SUBSTRATES
GA01 GA02 GA03 GA09 GA10
. relating to shapes or structures of substrates . . characterised by substrates on front face or display face side . . characterised by substrates on back face or rear face side . Substrate materials or processes of manufacture . Others *
GB GB00
ELECTRODES 1 OR TYPES OF ELECTRODE PATTERNS
GB01 GB02 GB03 GB04 GB06 GB08 GB09
. Display electrodes or discharge maintaining electrodes for main discharge for display . . Surface discharge type electrodes . . . arranging discharge electrodes in parallel . . . arranging discharge electrodes orthogonally or in crossing . . Counter discharge type electrodes . . Cathodes . . Anodes
GB11 GB12 GB13 GB14 GB16 GB20
. Auxiliary electrodes other than electrodes for main display discharge . . Write electrodes e.g. address electrodes or date electrodes . . . placed on the same face as display electrodes . . . placed on face opposing to display electrodes . . Trigger electrodes or priming electrodes . Others *
GC GC00
ELECTRODES 2 OR STRUCTURES OR ARRANGEMENTS OF SEPARATE ELECTRODES
GC01 GC02 GC03 GC04 GC05 GC06 GC08 GC10
. relating to structures of individual electrodes . . characterised by shapes of discharge electrodes . . with multilayer structures to discharge electrodes . . Discharge electrodes and electrical wirings being separate bodies . . . Bus electrodes or tracer electrodes . . Transparent electrodes . . with resistors for current limit purpose . . Capacitively coupled electrodes e.g. floating electrodes
GC11 GC12 GC13 GC18 GC19 GC20
. relating to arrangement of individual electrodes . . Electrodes extending between substrates and barriers . . Electrodes installed inside or on the side faces of barriers . Electrode materials . Processes of manufacture of electrodes . Others *
GD GD00
DIELECTRIC LAYERS OR INSULATING LAYERS
GD01 GD02 GD03 GD07 GD09 GD10
. Structures or arrangements of dielectric layers or insulating layers . . with dielectric layers or insulating layers adapted to multilayered structures . . with both dielectric layers and insulating layers. . Materials of dielectric layer . Processes of manufacture of dielectric layers . Others *
GE GE00
PROTECTIVE LAYERS
GE01 GE02 GE07 GE08 GE09 GE10
. relating to structures or arrangements of protective layers . . Protective layers adapted to multilayer structures . Materials of protective layers . . Materials excluding MgO . Processes of manufacture of protective layers . Others *
GF GF00
BARRIERS, PARTITIONS, RIBS OR SPACERS
GF01 GF02 GF03 GF04 GF06 GF08
. Types of barriers partitions ribs spacers or the like . . Striped barriers including the modifications . . Lattice-shaped barriers including the modifications . . Lamination of barriers of different shapes or types . . Barrier plates formed separately from substrates . . Barriers integrally formed to substrates
GF11 GF12 GF13 GF14 GF16 GF18 GF19 GF20
. relating to structures of individual barriers . . characterised by shapes of barriers . . Barriers adapted to multilayer structures or lamination of different kinds of materials . . Barriers with passages for exhaust or gas flow . relating to arrangements of individual barriers . Barrier materials . Processes of manufacture of barriers . Others *
GG GG00
PHOSPHOR LAYERS
GG01 GG02 GG03 GG04 GG05 GG07 GG08 GG09 GG10
. relating to structures of phosphor layers . relating to arrangement of phosphor layers . . forming phosphor layers on rear side substrate . . forming phosphor layers on front side substrate . . Structures of discharge cells for arranging phosphors . relating to of phosphor compositions . . Fluorescent materials or luminescent materials or phosphorescent materials . Processes of manufacture of phosphor layers . Others *
GH GH00
OTHER ADDITIONAL STRUCTURES, E.G. FILTERS
GH01 GH02 GH03 GH05 GH06 GH07 GH09 GH10
. relating to colour or RGB filters . . relating to structures or arrangements of colour filters . . Materials or processes of manufacture of colour filters . Black stripes or black matrices . . Structures or arrangements of black stripes . . Materials or processes of manufacture of black stripes . using magnetic field supplementarily . Others *
GJ GJ00
FILLER GAS
GJ01 GJ02 GJ03 GJ04 GJ06 GJ08 GJ10
. relating to composition of discharging gas . . containing xenon or Xe gas . . containing mercury or Hg . . mixing three or more gas components . . gas emitting mainly visible light . relating to sealing quantity or pressure of gas . Others *
GK GK00
ELECTRICAL CONNECTION OR CIRCUIT ARRANGEMENTS
GK01 GK02 GK03 GK05 GK07
. Structures for deriving inner electrodes to the outside . . Transfer electrodes . . Lead wires in sealing parts or connections . Connection terminals arranged on the outside or at outer edges of panels . mounting drive elements on panel substrates
GK11 GK12 GK14 GK16 GK19 GK20
. Circuit boards for external connections . . Flexible boards . Methods or structures for connecting external terminals to circuit boards . Circuits or panel structures for electric power recovery . Materials used for connection . Others *
HA HA00
SEALING, EXHAUST, GAS CHARGING OR SEALS
HA01 HA02 HA04 HA05 HA06 HA08 HA10
. relating to sealing methods or sealing structures . . Sealing materials . Methods or structures of exhaust gas charging or sealing . . using exhaust tubes . . of chipless types . relating to getters . Others *
JA JA00
PROCESSES OR APPARATUS OF MANUFACTURE
JA01 JA02 JA03 JA04 JA05 JA07 JA08 JA09
. Formation of layers or films . . Coating . . . relating to adjustment of coating liquids . . . relating to coating amount or coating thickness . . . Spraying or atomisation . . Vapour deposition including sputtering or CVD . . Electrodeposition including plating . . Arrangements or adhesion of formed sheets or films
JA11 JA12 JA13 JA14 JA15 JA16 JA17 JA19 JA20
. Pattern forming . . Printing e.g. screen printing . . Coating by nozzles . . Etching . . . Photolithography . . . Lift-off . . Sand blast . . Transfer . . Punching or embedding of structures by metallic dies
JA21 JA22 JA23 JA24 JA25 JA26 JA28
. Baking or heat treatment . . Baking conditions . Washing or removal of undesired substances . . Aging . Recovery methods of materials or recycling . Testing inspecting or restoring . Preliminary processes e.g. drying or preliminary curing
JA31 JA32 JA34 JA36 JA38 JA40
. Apparatus used for manufacturing or testing . . Masks for pattern formation . . Substrate carriers . . Exposure devices . . Assembling devices . Others *
KA KA00
MATERIALS 1 (TYPES OF MATERIALS)
KA01 KA02 KA03 KA04 KA05 KA07 KA08 KA09 KA10
. Metallic materials . . Alloys . . Metallic compounds . . . Metal oxides excluding ceramics . . . Organic metals . Glass materials . . Low melting point glass . . Glass frits . . Additives to glass
KA11 KA13 KA14 KA15 KA16 KA17 KA20
. Ceramic materials . Organic compound materials excluding organic metals . . Macromolecular compounds e.g. resins . . . Thermosensitive resins e.g. thermosetting resins . . . Photosensitive resins . . Organic solvents or solvents . Others *
KB KB00
MATERIALS 2 (CONDITIONS, PROPERTIES OR APPLICATIONS)
KB01 KB02 KB03 KB04 KB06 KB08 KB09
. Materials comprising multicomponents . . characterised by principal constituents or parent materials . . characterised by additives applied to principal constituents . . . characterised by adhesive agents or sticking agents . Component gradient materials or lamination materials . Structural materials for crystal materials amorphous materials or porous materials . . characterised by grain diameters hole diameters or the like
KB11 KB13 KB14 KB15 KB17 KB18 KB19
. Thermal properties of materials e.g. heat resistance or transition temperature . Materials with particular optical properties . . Colouring materials or light absorbing materials . . Reflecting materials . Conductive materials . Semiconductor or resistance materials . Dielectric materials or insulating materials
KB21 KB22 KB24 KB26 KB28 KB29 KB30
. Magnetic materials . Electron emission materials or electron emission substances . Materials with stickiness or adhesiveness . Water soluble materials . Numerical values relating to conditions of materials e.g. component ratio . Numerical values relating to properties of materials such e.g. electric conductivity . Others *
LA LA00
TYPES OF CHARACTERISTIC CONSTITUTION
LA01 LA02 LA03 LA05 LA06 LA08 LA09 LA10
. relating to layout of panel structures . . relating to arrangements of discharge cells or picture elements . . . Staggered lattice arrangements . . Layout of electrodes or electric wiring patterns . . . sharing discharge electrode with a plurality of cells . relating to layout of individual discharge cells . . with an auxiliary discharge chamber or cell . . Numerical relationship between components e.g. dimensional ratios or distances
LA11 LA12 LA13 LA14 LA16 LA17 LA18 LA19 LA20
. Improvement of components per se of discharge cells . . dividing components into multiple parts . . Combining or integrating a plurality of components . . relating to size or dimension of components . relating to layout of manufacturing processes . relating to improvement of individual manufacturing processes . Panel structures adapted for specific drive methods or circuits . . Panels of self-shift types or charge transfer types . Others *
MA MA00
FUNCTIONS OR OPERATIONS OF CONSTITUTION
MA01 MA02 MA03 MA04 MA05 MA06 MA07 MA08 MA09 MA10
. relating to structures of gas-discharge-type display panels . . Sharpening of image or improvement of image quality mainly by optical corrections . . . increasing image display light or brightness improvement . . . Reduction or shielding of undesired light including reduction of undesired reflection . . . referring to emission or absorption spectrums . . Improvement of angle of visibility . . Anti-static methods . . Reduction of spurious radiation e.g. infrared rays ultraviolet rays or electromagnetic waves . . Improvement of panel strength including prevention of damages . . Reduction of wear or deterioration in components
MA11 MA12 MA13 MA14 MA16 MA17 MA18 MA19 MA20
. . Weight reduction of panels . . Reduction of power consumption . . Improvement of heat dissipation or cooling effects . . Reduction of number of electrical connections or external circuits . improving or adjusting discharge conditions . . Ensuring or facilitating discharging or extinguishing operations . . setting discharge paths . . limiting discharge currents e.g. uniformisation . . Reduction or elimination of unwanted discharge
MA21 MA22 MA23 MA24 MA25 MA26 MA30
. Functions operations or effects of constitution relating to manufacturing . . Panel structures for facilitating manufacturing . . relating to stability or assurance of working processing . . relating to working precision . . relating to manufacturing of large-sized panels . . Reduction of processes costs or time . Others *
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