| ReturnTo Theme-Group-Choice | Onelevelup |
| 4E080 | MOLTEN SOLDER | |
| B23K1/00 -3/08;31/02,310-31/02,310@Z;33/00,310-33/00,310@Z | ||
| B23K1/08-1/08,320@Z | AA | AA00 ARTICLES TO BE SOLDERED |
AA01 | AA02 | AA03 | AA04 | AA06 | AA10 | ||||
| . Print substrates | . . Characterized by multiplication of leading holes and piercing holes | . IC (integrated circuit) and elements (i.e., using lead prepared solder) | . Thermal converters | . Localization of soldered areas (e.g., temporary fixing) | . Other specified elements | |||||||
| AB | AB00 SOLDER TANKS, AND PRE-TREATMENT OR POST-TREATMENT FACILITIES THEREOF |
AB01 | AB02 | AB03 | AB04 | AB05 | AB06 | AB07 | AB08 | AB09 | AB10 | |
| . Solder tanks | . . Inactive tanks | . . Jet tanks including overflow tank | . Flux application area (i.e., fluxers) | . Heating and preheating area (i.e., preheaters) | . Cooling areas | . Cleaning and drying area | . Cutting area, e.g., lead (lead cutter) | . Layout | . Others | |||
| BA | BA00 SOLDER TANK STRUCTURE |
BA01 | BA02 | BA03 | BA04 | BA05 | BA06 | BA07 | BA08 | BA09 | ||
| . Mechanism for preventing bridging or icicle formation | . . Mechanical means | . . Heating means | . . By solder flow or solder wave | . Mechanism for preventing warping | . Countermeasures against oxidation of molten solder | . . Using inert gas | . . Using anti-oxidizing agents (e.g., oil) | . . Mechanisms for removing oxidization films | ||||
| BA11 | BA12 | BA13 | BA14 | BA15 | BA16 | BA17 | BA20 | |||||
| . Ultrasonic wave oscillators | . Agitator mechanisms | . . Using gas or foam | . Heating mechanisms | . Solder tank support structures | . . Mechanisms for lifting and tilting solder tanks | . Materials of solder tank components | . Others | |||||
| CA | CA00 JET SOLDERING TANK STRUCTURE |
CA01 | CA02 | CA03 | CA04 | CA05 | CA06 | CA07 | CA08 | CA09 | ||
| . Nozzle structure | . . Opening of nozzle | . . . Moving elements of opening | . . . Closing members (e.g., lids) | . . . Double entry openings | . . Inner straightening vanes (e.g., diffluence plates or latticed perforated plates) | . . . Moving elements (e.g., shutters and dampers) | . . Outer straightening vanes (e.g., straightening wave plates) | . . . Moving elements (e.g., for adjustment of height or angle) | ||||
| CA11 | CA12 | CA14 | CA15 | CA16 | CA20 | |||||||
| . Jet-generated drive means and drive units | . . Driving by electromagnetic force | . Special wave shapes | . . Irregular waves (e.g., turbulence) | . . Film flows (e.g., curtain jets) | . Others | |||||||
| CB | CB00 JET SOLDERING TANK CONTROL, DETECTION, AND ADJUSTMENT ELEMENTS |
CB01 | CB02 | CB03 | CB04 | CB10 | ||||||
| . Detection only | . Wave heights, flow rates and flow speeds | . Direction and diffluence | . Temperature (including inactive tank temperature) | . Others | ||||||||
| DA | DA00 FORM OF CONVEYING AND MAINTAINING MECHANISM |
DA01 | DA02 | DA03 | DA04 | DA05 | DA06 | DA07 | DA08 | DA09 | DA10 | |
| . Carrierless systems | . . Structure and maintenance of retention claws | . Carrier systems | . . For print substrates | . . For IC (integrated circuits) and elements | . Guideway systems | . Wire conveyor systems | . Turntable systems | . Holders | . Others | |||
| DB | DB00 DETAILS OF CONVEYING AND MAINTAINING MECHANISMS |
DB01 | DB02 | DB03 | DB04 | DB05 | DB06 | DB07 | DB08 | DB09 | DB10 | |
| . Mechanisms for preventing warping | . Mechanisms for preventing floating | . Mechanisms for preventing waves and masking | . Lifting and tilting mechanisms | . Changeable measurement means (e.g., carriers and holders) | . Mechanisms for adjusting width of conveying route (i.e, rail spacing) | . Multiple conveying routes | . Loading, unloading, and transferring to conveying routes | . Inserting and removing articles from carriers or holders | . Others | |||
| DC | DC00 CONVEYING MECHANISM CONTROL, DETECTION AND SAFETY ELEMENTS |
DC01 | DC02 | DC03 | DC04 | DC05 | DC07 | DC08 | DC09 | |||
| . Detection only | . Speed and transfer times | . Spacing and positioning of conveyed articles | . Selection (e.g., of conveying route) | . Other control elements | . Safety measures | . . Relating to the human body | . . Relating to articles and devices (e.g., prevention of falling) | |||||
| EA | EA00 IMMERSION METHODS |
EA01 | EA02 | EA03 | EA04 | EA05 | EA07 | EA08 | EA10 | |||
| . Raising of liquid surface inside of inactive tanks | . Immersion under solder bath surface for print substrates | . Using a roll or roller on the articles | . Spraying | . Other immersion methods | . Processes for bringing articles into contact with and removing from solder bath | . . Accompanied by transfer and rotation while in contact | . Others |