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F-Term-List

(Not Translated)
3C081 MICROMACHINES
B81B1/00 -7/04;B81C1/00-99/00
B81B1/00-7/04;B81C1/00-99/00 AA AA00
PURPOSE OR EFFECT * 		AA01 AA02 AA03 AA04 AA05 AA07 AA09 AA10
. Enhancement of accuracy or reliability . . Prevention of adhesion or stiction . . Cleaning or prevention of dusting . . Countermeasures against heat . . . Cooling or radiation . Enhancement of strength or rigidity . Energy saving or electric power saving including voltage lowering or current lowering . Energy supply
AA11 AA13 AA14 AA15 AA17 AA18 AA19 AA20
. Miniaturisation or high integration . Improvement of performance . . Speeding up . . Countermeasures against abnormality . Improvement of processes . . Promotion of process efficiency or stabilisation of processes . . . Reduction of steps of processes . . . Shortening of treatment periods
BA BA00
SHAPE OR STRUCTURE * 		BA01 BA02 BA03 BA04 BA05 BA06 BA07 BA08 BA09 BA10
. characterised by shape * . . Concave shape * * . . . Penetration . . . without penetration . . . Cross-sectional shape * * . . . . Longitudinal cross-sectional shape . . Teeth of comb shape . . Surface shape * * . . . Unevenness e.g. roughness or arrangement patterns . . . Smoothing
BA11 BA12
. . Laminating or multilayer structure * * . . Wires or tubes * *
BA21 BA22 BA23 BA24 BA25 BA26 BA27 BA28 BA29 BA30
. Components * . . Electric elements * * . . Microchannels . . . Mixing or separating parts . . . Pumps i.e. pumping or valves . . . Heating or cooling parts . . Optical elements * * . . . Mirrors . . Machine elements * * . . Sealing members or sealing structure * *
BA31 BA32 BA33
. . characterised by peripheral structure * * . . . Wiring or electrical connection . . . Control circuits or driving circuits
BA41 BA42 BA43 BA44 BA45 BA46 BA47 BA48 BA49 BA50
. Movable parts * . . with flexibility * * . . . Cantilevers . . . Multiple supporting beams . . . Diaphragms or diaphragm faces . . . Shape of flexible parts or supporting parts . . . with twisting movement e.g. rotating or rocking movement . . . with linear movement e.g. linear reciprocal movement . . having movability * * . . . with linear movement
BA51 BA52 BA53 BA54 BA55 BA56 BA57 BA58 BA59 BA60
. . . with rotational movement . . Driving means * * . . . Electrostatic force . . . Magnetic force . . . Piezo-electric magnetostriction or electrostriction . . . Fluid pressure . . . Heat . . . . Bimetal . . . Light . . . Chemical or biological action
BA71 BA72 BA74 BA75 BA76 BA77 BA78 BA79 BA80
. characterised by arrangement conditions * * . . Array-like or matrix-like . characterised by objects to be detected * . . Speed or acceleration . . Location angle or displacement . . Force or pressure . . Flow . . Temperature . . Light
BA81
. characterised by action environment *
CA CA00
PROCESS * 		CA01 CA02 CA03 CA05
. Manufacturing by multistep treatment * * . . Manufacturing on substrates * * . . . using sacrifice layers . Manufacturing by assembling * *
CA11 CA12 CA13 CA14 CA15 CA16 CA17 CA18 CA19 CA20
. Working methods or means * . . Removing working * * . . . Etching * * . . . . Dry etching . . . . Wet etching . . . . using stop layers . . . Beam processing * * . . . Machining * * . . . . Cutting or severing . . . . Grinding or polishing
CA21 CA22 CA23 CA24 CA25 CA26 CA27 CA28 CA29 CA30
. . . Jet working * * . . . Electrical discharge or electrochemical machining . . Lithography * * . . . using radiation light of synchrotrons . . Addition working * * . . . Film formation * * . . . . PVD * * . . . . . Sputtering . . . . CVD . . . . Plating or electroforming
CA31 CA32 CA33 CA34 CA35 CA36 CA37 CA38 CA39 CA40
. . . . Printing coating or transferring . . . Bonding or adhesion * * . . . . Anodic bonding . . Light forming including in the case of gaseous starting materials * * . . Form working * * . . . Mould transferring * * . . . . Nanoimprint . . . Casting or moulds . . . Sintering . . Modification or heat treatment * *
CA41 CA42 CA43 CA44 CA45
. Other treatment * . . Element dividing i.e. dicing . . Cleaning . . Test inspection or adjusting . . Design or simulation
DA DA00
MATERIAL * 		DA01 DA02 DA03 DA04 DA05 DA06 DA07 DA08 DA09 DA10
. Base materials * . . Semiconductors * * . . . Single crystal silicon . . . SOI . . Inorganic materials * * . . . Glass . . . Ceramics * * . . . . Oxides . . . . Nitrides . . Organic materials * *
DA11 DA12
. . Metals * * . . Composite materials * *
DA21 DA22 DA23 DA24 DA25 DA26 DA27 DA28 DA29 DA30
. Functional materials * . . Protecting or reinforcing materials * * . . Gluing or stiction preventing materials * * . . Reflecting materials * * . . Conductive or wiring materials * * . . . a-silicon or p-silicon . . . Metals . . Insulating materials * * . . . Inorganic materials * * . . . . Oxides
DA31 DA32
. . . Organic materials * * . . . Composite materials * *
DA41 DA42 DA43 DA44 DA45 DA46
. Process ancillary materials * . . Protecting or reinforcing materials * * . . . Masking materials . . . Stop layer materials . . Sacrifice materials * * . . Mould materials * *
EA EA00
USE * 		EA01 EA02 EA03 EA04 EA05 EA07 EA08 EA09
. Sensors * . . Speed or acceleration sensors . . Force pressure or torque sensors . . Temperature or heat sensors . . Gas sensors . Optical parts or optical instruments * . . Light modulation or light deflection * * . . . Optical switches
EA11 EA12 EA14 EA15 EA17 EA18 EA19
. Image display devices * . . Digital micro mirror devices (DMD) . Information recording instruments * . . Magnetic head parts . Surface analysis apparatus * . . Scanning probe microscopes * * . . . AFM or STM
EA21 EA22 EA23 EA24 EA26 EA27 EA28 EA29
. Electric elements or electrical apparatus * . . Resonators or filters . . Relays or switches . . Capacitors or inductors . Analysis or reaction apparatus * * . . mu-TAS . . Micro reactors . . Biochips
EA31 EA32 EA33 EA34 EA35 EA37 EA39
. Fluid apparatus * * . . Micropumps . . Micro valves . . Nozzles * * . . . Inkjet nozzles . Separating or mixing apparatus * * . Medical instruments * *
EA41 EA43 EA45
. Actuators * * . Manipulators * * . Machine elements * *
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