F-Term-List

G03F7/20-7/20,503;7/20,505;7/20,511-7/24@Z;9/00-9/02@Z

AA00
EXPOSURE METHODS

AA01

AA02

AA03

AA04

AA05

AA06

AA07

AA08

AA09

AA10

. Contact exposure

. . Vacuum contact

. . Pressure contact

. Proximity exposure

. Projection exposure

. . Reduction projection exposure (stepper, etc.)

. . Full-size projection exposure

. . Magnified projection exposure

. . Scanning type projection exposure (scannner, etc.)

. . Reflected type projection exposure

AA11

AA12

AA13

AA15

AA16

. A device to use liquids (liquid cooling means, etc.)

. . Liquid immersion exposure

. . Referral about light product in the liquid

. Products using masks having openings

. . Exposure by radiation other than visible light and ultra violet rays

AA21

AA22

AA23

AA24

AA25

AA26

AA27

AA28

AA29

AA30

. Mask less exposure, direct depicting

. . Products using lasers

. . . Exposure of liquid curing agent composition for manufacturing of printing plates

. . Exposure using scanning of fine particle beams (electronics, etc.)

. . . Correction or prevention methods for electron scattering (proximity)

. . . For exposure masks or rectile manufacturing

. . . Production using corpuscular radiation other than electron beams

. . Pattern generator (CC05 percedence)

. . Beam scanning exposure

. . Stereo lithography

AA31

AA32

AA33

AA34

AA35

AA36

AA37

AA38

AA39

AA40

. Lithography which has characteristics to travelling light source

. Lithography which has characteristics to moving of masks

. . Production to rotate masks

. . . Tabular shapes

. Production which has characteristics to moving of substrates

. . Production to rotate substrates

. . . Flat plate

. . . Cylindrical shapes

. Productions which have characteristics to moving of masks and substrates

. . Rotating exposure

AA41

AA42

AA43

AA44

AA45

AA46

AA47

AA48

AA49

AA50

. Exposure onto the cured surfaces

. Oblique exposure

. Interference exposure, holograph exposure

. Exposure using polarization of light

. Flash exposure

. Spot exposure

. Slit exposure

. Exposure, belt masks at the same time as coating

. Exposure using cantilever

. Others*

AB00
MULTI-STAGED EXPOSURE

AB01

AB02

AB03

AB04

AB05

AB07

AB08

. Mixed & match

. Stitching

. For unnecessary removal (image or background's correction, etc.)

. . Perimeter unnecessary section, perimeter non-exposed section's exposure

. Both faces exposure

. Exposure onto developed images (LLE, etc.)

. Exposure onto formulated patterns (LELE, etc.)

AB11

AB12

AB13

AB15

AB16

AB17

AB18

AB20

. Exposure to perform exposure of the same kind over 2 times

. . Miniaturization of patterns

. . Multi-plexed image exposure using the different masks

. Exposure to expose multi-types exposure

. . Ultra violet rays, light exposure

. . . Proximity exposure

. . . Beam scanning exposure

. Others*

BA00
OPTICAL SYSTEM

BA01

BA02

BA03

BA04

BA05

BA06

BA07

BA08

BA09

BA10

. Elements of optical system (GA precedence)

. . Reflecting mirror

. . . Convex surface, concave surface mirrors

. . Aperture, masking blades

. . Filter (wave length filters, etc.)

. . Prism

. . Deflection plates, PBS

. . . 1/4 wave length plates

. . Lens

. . . Light integrator, fly eye lens

BA11

BA12

BA13

BA14

BA15

BA16

BA17

BA18

BA19

. . Masks, reticle

. . . Mask layer which contacts photosensitive materials and is removed in the post process

. . . . Formulated by selective application of an ink or a tonner

. . . . Formulated by thermal means

. . Glass plates

. . Lens-barrel

. . Immersion liquid

. . Filters with thermal influence, reflective prevention means

. . Space light modulator for multi-beam exposure

BA21

BA22

BA23

BA30

. Optical materials and coatings

. . Multiple refract

. Optical system protection

. Others*

CA00
LIGHT SOURCES

CA01

CA02

CA03

CA04

CA05

CA06

CA07

CA08

CA09

CA10

. Exposure energy sauces*

. . Visible light

. . Ultra violet rays

. . . Lamp

. . . . Discharge lamp

. . Far-ultraviolet rays

. . Laser light

. . . Excimer laser

. . Electron beam, ion line

. . X rays, EUV

CA11

CA12

CA13

CA14

CA15

CA16

CA17

CA18

CA20

. Structures*

. . Products by pulse light sources

. . Products by multi-light sources

. . . Array sources which are addressable for pattern formation

. . . Arrangements of light sources

. . Cooling

. . Optical system

. . Shutter used

. Others*

CB00
ILLUMINATION OPTICAL SYSTEM

CB01

CB02

CB03

CB04

CB06

. Alignment of illumination area (deformed illumination, etc.)

. . Off-axis setting using an aperture

. . Off-axis setting using light-guiding elements

. . Off-axis setting using SLM (DMD, etc.)

. Measurement of illumination setting in pupil plane or in image plane

CB11

CB12

CB13

CB16

CB17

CB18

CB19

CB20

. Multiplexing of illumination light path

. Optical correction elements (filters, phase plates, etc.)

. Alignment adjustments in illumination system assembly

. Details of optical elements

. . Diffractive optical elements

. . Capillary or channel elements

. . Lamp house which reflector was arranged.

. . Zoom system

CB21

CB23

CB25

CB26

CB27

. Arrangements of illumination for specific mask pattern

. Reflective optical elements other than folding mirrors

. Size and form of illuminated area in mask faces

. Homogenization of illumination intensity in the mask plane

. Non-homogeneous intensity distribution in the mask plane

CC00
PROJECTED OPTICAL SYSTEMS

CC01

CC02

CC03

CC05

CC06

CC08

. Catadiotric system

. Optical aspects of catoptric systems

. Dioptric system optical aspects

. Addressable masks (LCD, DMD, etc.)

. Non-planar pattern area, non-planar masks

. Size, forms of projection system aperture

CC11

CC12

CC13

CC14

CC16

. Multiplexing of projection light paths

. Optical correction elements, filters and phase plates

. Alignment adjustment in the assembling of projection systems

. Compensation optical system (deformed possible optical elements, etc.)

. Details of optical elements

CC21

CC22

CC23

CC24

CC25

. Not-classified resolution expansion technology in others

. . Focus drilling (FLEX, etc.)

. . Rotary scanning

. Layout for efficiency improvement and compensation of image error

. . Compensation of proximity effects

CD00
HANDLING, CHUCKS OF MASKS, SUBSTRATES

CD01

CD02

CD03

CD05

CD06

CD07

. Chuck

. . Chuck of substrates

. . Chuck of masks

. . Electrostatic chuck, deformable chuck electrostatically

. . Vacuum chucks

. . Adjustments for substrates by chucks, for plane of masks

CD11

CD12

CD13

CD15

CD16

CD17

CD18

. Stages

. . Substrate stages

. . Mask stages

. . XY stage, XY-axis directions

. . . For step and repeat

. . Z stage, z-axis direction

. . Theta stage, theta directions

CD21

CD22

CD23

CD24

CD25

CD26

CD27

CD28

CD29

CD30

. Transfer of substrates and masks

. . Transfer of substrates

. . . Feed into exposure machines of substrates

. . . . Substrate retracting feeding section

. . . . Automatic feed of substrates

. . Transfer of masks

. . . Feed onto exposure machine of masks

. . . . Automatic feed of masks

. . Transfer means

. . . Substrate take-up type

CD31

CD32

CD33

CD35

CD36

. . . Vacuum suction

. . Between process before and after exposure and it

. . . Transport section of substrates and masks after ending exposure

. Operations of stages and chucks

. . Sequences and positions of step and repeat exposure to light

CD41

CD42

CD43

CD44

CD45

CD47

CD48

CD50

. Drive means (actuator, motor, etc.)

. Control means of reaction force (countermass, etc.)

. Control of positions

. Refers to stress and distortion of chucks, masks or substrates

. Large substrates (web or polygon shape substrates, etc.)

. Movement of lens-barrel, light source, etc. Which are relative to the stage

. Those using laser length measuring machine

. Other*

CE00
TYPES, STRUCTURE, FORM OF PHOTOSENSITIVE MATERIAL TO BE EXPOSED

CE01

CE02

CE10

. Photocurable types

. Liquid photosensitive resins

. Others*

DA00
INFORMATION MANAGEMENT, CONTROL, TEST

DA01

DA02

DA03

DA04

DA05

DA06

DA07

DA09

DA10

. Information management and control

. . Modelling, simulation

. . Data processing (addressable masks, etc.)

. . . Control, adjustments of space light modulator

. . . . Apparatus compensation between individual modulation elements

. . Calibration of components

. . Tagging

. . Control of normal operating mode

. . Control of abnormal operating mode

DB00
EXPOSURE ADJUSTMENT AND CONTROL

DB01

DB02

DB03

DB04

DB05

DB06

DB07

DB08

DB09

DB10

. Adjustments and control of optical aspects

. . Polarization states

. . Wavelength

. . Speckle prevention

. . Light beam (X rays is included)

. . Light exposure, exposure time, illumination

. . Shutter

. . Exposure angles

. . Projection optical systems

. . . Magnification, light path length, distortion

DB11

DB12

DB14

DB15

DB16

DB17

DB18

DB19

DB20

. . . Focal point position

. . . . Those by wafer pattern monitoring

. Adjustments and control of environmental aspects

. . Environment of system main body (temperature, pressure, etc.)

. . . Pressure, atmosphere

. . . Temperature

. . . . Masks or substrates'

. . . . Optical system

. . . Abnormal detection

DB21

DB22

DB23

DB24

DB26

DB27

DB28

DB29

. . . Control of the process before and after exposure

. . Masks or near masks

. . Optical type

. . Substrates or near substrates

. . Control and adjustments of immersion liquid

. . . Holding mechanism of immersion liquid

. . . Performance maintenance of immersion liquid

. . Performance maintenance of immersion liquid exposure system

DB31

DB33

DB34

DB36

DB37

DB40

. Flatness, slope of substrates and masks

. Display and information regarding control and adjustments

. . Information of substrate and mask surface

. Control of proximity exposure

. . Interval of wafers and masks, parallelism

. Others*

DC00
DETECTION MECHANISM

DC01

DC02

DC03

DC04

DC05

DC06

DC07

DC08

. Parameters to be detected

. . Light, light quantity (X rays are covered)

. . Temperature

. . Pressure, atmosphere

. . Distance, length, width, position, slope

. . . Optical

. . Interval

. . . Optical

DC11

DC12

DC13

DC14

DC15

DC16

DC18

DC20

. Mounting place of detection functions

. . Between light sources and x rays and masks

. . Near wafers

. . . Wafer stage

. Test of optical parts

. . Aberration measurement

. Detection functions of multiple pieces and multiple types

. Others*

EA00
POSITIONING TYPES AND METHODS

EA01

EA02

EA03

EA04

EA05

EA06

EA08

EA10

. Positioning other than substrates and masks

. . Positioning with pre-exposure scanning and holder

. Calibration

. Positioning in the orthogonal oriented direction on the substrate surface

. . Leveling

. . Combination with auto-focus adjustment means

. Positioning in the proximity or closely contact exposure

. Pattern formation method other than exposing to radiation

EA11

EA12

EA13

EA14

EA15

EA16

EA17

EA18

EA19

EA20

. Methodology (mark, sensor, selection of wavelength)

. Technical features

. . Optical means features

. . . Lighting of alignment marks

. . . Light sources for detection, mark irradiation light for positioning

. . . . Scan of light

. . . Optical system for detection

. . . Light receiving device for detection

. . . . Image pickup means, tv camera

. . Not optical

EA21

EA22

EA24

EA25

EA26

EA30

. . . Means using gas flow

. . . Those which uses scanning probe microscope

. Marks on two objects to be positioned

. . Wafers and mask marks

. . Wafers, mask marks and standard marks

. Others*

EB00
POSITIONING MARKS AND ITS ENVIRONMENT

EB01

EB02

EB03

EB04

EB05

EB06

EB07

EB08

EB09

EB10

. Mark's details

. . Geometry, structures

. . . Surface geometry

. . . . Bars (drawings)

. . . . Diffraction grating, moire fringes (drawing)

. . . . Same mark of multiple pieces in the same position, multiple geometry

. . . . Patchwork of multiple types of marks

. . . Marks are concave (drawings)

. Mark's materials

. Manufacturing of marks

EB11

EB12

EB13

EB15

EB16

EB17

EB18

EB19

EB20

. Auxiliary device for positioning

. Apparatus and system for positioning

. . Positioning in auto

. General detection of marks and auxiliaries of detection

. . Data processing of the detected mark information

. . Movement of stage, etc. By the mark detection results

. . . Multiple mark's position memory, position computation of each chip

. . Those which positioning more than 2 types

. . Those which perform prealignment

EB21

EB22

EB23

EB24

EB25

EB27

EB30

. Layout of marks

. . On mask, on mask frame

. . On substrates

. . . On chip

. . . On scribe line

. Special application of marks

. Others*

FA00
PREVENTION OF COMTAMINATION, WASTE REMOVAL

FA01

FA02

FA03

FA04

. Reduction of contamination (foil trap, etc.)

. Washing

. Purge

. Strayed light, scattered light, transmission loss

FB00
GENERAL STRUCTURES OF EXPOSURE SYSTEM

FB01

FB02

FB03

FB04

FB05

. Detail structures (seal,light transmission, etc.)

. . Bearings

. . Mounting of individual elements

. . Optical mounting

. . Structure relating to vacuum environment

GA00
X RAY EXPOSURE, EUV EXPOSURE

GA01

GA03

GA04

GA05

GA06

GA08

GA09

GA10

. Exposure wavelength is EUV

. X ray sources, euv sources

. . Plasma X ray sources

. . . Laser plasma

. . . Discharge plasma

. X rays optical systems, EUV optical systems

. . Removal of unnecessary lines

. . Mirror

GA11

GA12

GA13

GA14

GA16

GA17

GA18

GA19

GA20

. . . Integrator

. . . Collector mirror

. . . Substrates and materials of multi-layer reflection film, structure, fabrication methods

. . . Mirror system support, mirror's support

. Atmosphere in exposure systems, chamber*

. Substrate chuck, substrate stage

. Mask chuck, mask stage

. Control, adjustment, detection, display

. . Contamination measures (adhesion prevention, removal, etc.)

GA21

GA22

GA23

GA24

GA30

. . Responses to thermal influence

. . Measurement of image formation characteristics

. . Target is optical systems

. . Target is light source, mask and atmosphere

. Others*

HA00
APPLICATION (EXPOSURE, POSITIONING)

HA01

HA02

HA03

HA04

HA05

HA06

HA07

HA08

HA10

. For printing plate manufacturing

. For manufacturing for printing wiring plates

. For semiconductor system manufacturing

. For display system manufacturing

. . Liquid crystal

. For solid form substance formulation

. For relief

. For optical member (filter, etc.)

. Others*

JA00
OTHERS (RELATED TO EXPOSURE)

JA01

JA02

JA03

JA05

JA07

JA09

. Light sources, masks, inclusion between substrates*

. Enclosure, stage and other support materials

. Assembly, maintenance, transportation and storage of systems

. Form of mask patterns, adjustment of structures

. Atmosphere in the exposure system*

. Vibration isolation

JA11

JA12

JA13

JA14

JA15

JA17

JA18

. Features for processing of substrates in before and after exposure

. . Before exposure

. . After exposing and before developing

. . When in developing

. . After developing

. Combination with other processing functions

. . Patterns, combination with foreign inspection equipment

JA21

JA22

JA23

JA24

JA25

JA26

JA27

JA28

JA30

. Wafer pattern monitoring (db12 precedence)

. . Cd,Ler,Swa

. . Overlay

. . Inspection Of Pattern Defects

. . Electric Inspection

. . Utilization Of Aerial Image

. . Utilization Of Latent Image

. . Utilization of process control marks

. Wafer resist monitoring

2H197	EXPOSURE AND POSITIONING AGAINST PHOTORESIST PHOTOSENSITIVE MATERIALS
	G03F7/20 -7/24@Z;9/00-9/02@Z